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1. 发明专利

JP2014036190A Electronic component built-in substrate 有权
公开(公告)号：JP2014036190A
公开(公告)日：2014-02-24
申请号：JP2012177965
申请日：2012-08-10
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： MUGITANI HIDEJI , SAJI TETSUO , MATSUDA TAKASHI , NAKAMURA HIROSHI
IPC分类号： H05K3/46 , H01L23/12 , H03H9/25
CPC分类号： H03H9/6483 , H03H9/02897 , H03H9/0538 , H03H9/1085 , H05K1/0271 , H05K1/056 , H05K1/185 , H05K3/4644
摘要： PROBLEM TO BE SOLVED: To provide an electronic component built-in substrate capable of avoiding generation of function abnormalities and damages and the like to a filter function part of an elastic wave filter, which is caused by deformation of a hollow cover of the elastic wave filter built in a substrate, if at all possible.SOLUTION: In an electronic component built-in substrate, a SAW filter 12 having a structure in which a filter function part is covered with a hollow cover 12b is built in a substrate 11. A stress relaxation layer 11d3 opposed to the hollow cover 12b of the SAW filter 12 via an insulator layer 11c of the substrate 11 is provided.

2. 发明专利

JP2013222829A Circuit module and manufacturing method thereof 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：JP2013222829A
公开(公告)日：2013-10-28
申请号：JP2012093662
申请日：2012-04-17
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： SHIMAMURA MASAYA , MUGITANI HIDEJI
IPC分类号： H05K9/00
CPC分类号： H05K9/0084 , H01L23/552 , H01L24/97 , H01L2924/12042 , H01L2924/1461 , H01L2924/15192 , H01L2924/351 , H05K1/0218 , H05K3/284 , H05K5/0095 , H05K9/0037 , H05K13/0046 , H05K2201/09972 , H05K2201/10371 , Y10T29/49146 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit module capable of coping with thinning while securing a stable shield function, and a manufacturing method thereof.SOLUTION: A circuit module 1 according to one embodiment of the present invention comprises: a substrate 2; plural electronic components 3; a shielding member 4; a sealing layer 5; and a coating layer 6. The substrate 2 has a mounting plane 2a on which the plural electronic components 3 are mounted, and that includes a first region 21 and a second region 22. The shielding member 4 is made of a conductive material, and is arranged between the first region 21 and the second region 22 on the mounting plane 2a. The sealing layer 5 has a groove section 51 including a bottom face 51a at least one part of a portion formed so that the shielding member 4 is arranged, and is made of an insulator formed on the mounting plane 2a and covering the plural electronic components 3. The coating layer 6 is made of a conductive material, and has a first coating section 61 filled in the groove section 51 and a second coating section 62 coating the first coating section 61 and the sealing layer 5.
摘要翻译：要解决的问题：提供一种在确保稳定的屏蔽功能的同时能够应对变薄的电路模块及其制造方法。解决方案：根据本发明的一个实施例的电路模块1包括：基板2; 多个电子部件3; 屏蔽构件4; 密封层5; 基板2具有安装有多个电子部件3的安装面2a，该安装面2a包括第一区域21和第二区域22.屏蔽部件4由导电性材料构成，为布置在安装平面2a上的第一区域21和第二区域22之间。密封层5具有槽部51，该槽部51包括形成为遮蔽部件4的部分的至少一部分的底面51a，并且由形成在安装面2a上并覆盖多个电子部件3的绝缘体构成涂层6由导电材料制成，并且具有填充在槽部51中的第一涂布部61和涂覆第一涂布部61和密封层5的第二涂布部62。

3. 发明专利

JP2009302563A Manufacturing method of multilayer board with built-in electronic component, and multilayer board with built-in electronic component 审中-公开
标题翻译：具有内置电子元件的多层板的制造方法和具有内置电子元件的多层板
公开(公告)号：JP2009302563A
公开(公告)日：2009-12-24
申请号：JP2009211101
申请日：2009-09-11
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： INOUE YUSUKE , MUGITANI HIDEJI , MIYAZAKI MASASHI , SARUWATARI TATSURO , SUGIYAMA YUICHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L2224/04105 , H01L2224/2518 , H01L2224/92144
摘要： PROBLEM TO BE SOLVED: To make uniform mounting heights of electronic components to be arranged by eliminating the need of an adhesive.
SOLUTION: A lower insulating resin layer having a first insulating resin layer having small plastic deformation and a second insulating resin layer formed on the first insulating resin layer and being in an uncured or half-cured state is prepared and after at least the second insulating resin layer is heated to bond at least a lower surface of an electronic component to the second insulating resin layer, the second insulating resin layer is further heated to be changed into a state of small plastic deformation, thereby fixing the electronic component. The lower insulating resin layer in use has the first insulating resin layer for insulation with small plastic deformation formed on an upper layer of a copper foil to a prescribed thickness and also has a thermosetting resin in a uncured or half-cured state formed as the second insulating layer on an upper surface of the first insulating resin layer to a prescribed thickness.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过消除粘合剂的需要，使电子部件的均匀安装高度排列。解决方案：制备具有塑性变形小的第一绝缘树脂层的下绝缘树脂层和形成在第一绝缘树脂层上并处于未固化或半固化状态的第二绝缘树脂层，并且至少在第二绝缘树脂层被加热以将电子部件的至少下表面粘合到第二绝缘树脂层，第二绝缘树脂层被进一步加热以变为塑性变形小的状态，从而固定电子部件。所用的下绝缘树脂层具有形成在铜箔上层上规定厚度的小塑性变形的绝缘用第一绝缘树脂层，并且还具有形成为第二层的未固化或半固化状态的热固性树脂绝缘层在第一绝缘树脂层的上表面上达到规定的厚度。版权所有（C）2010，JPO＆INPIT

4. 发明专利

JP2006286913A Circuit module and manufacturing method thereof 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：JP2006286913A
公开(公告)日：2006-10-19
申请号：JP2005104537
申请日：2005-03-31
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： YUASA MINORU , KAI TAKEHIKO , MUGITANI HIDEJI , TSUNODA ATSUSHI
IPC分类号： H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit module for providing a highly reliable circuit module.
SOLUTION: The circuit module (101) is manufactured by forming a sealing resin layer (109) for sealing a relevant electronic component group to a circuit substrate (107) respectively, comprising an external terminal group (103) in the thickness of t at a connecting surface (107b) and the electronic component group (105) at the mounting surface (107a). In more concrete, an upper die (3) including an upper cavity, and a metal die (31) including a lower die including a lower cavity (5) opposing to the upper cavity are prepared. Moreover, a buffer sheet (51)of the shape and the thickness T (≥t) enabling placement of a relevant external terminal group on the upper surface is laid at the bottom surface of the relevant lower cavity. Pressurized entry of molten resin into a gap between the buffer sheet and the metal die can be prevented effectively on the occasion of fulfillment of the resin. Consequently, generation of burrs of resin can be prevented. As a result, highly reliable circuit module can be manufactured.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供用于提供高可靠性电路模块的电路模块的制造方法。解决方案：电路模块（101）通过形成用于将相关的电子部件组分别密封到电路基板（107）的密封树脂层（109）来制造，该密封树脂层包括厚度为在安装表面（107a）处的连接表面（107b）和电子部件组（105）处。更具体地，准备包括上腔的上模3和包括下模的金属模31，金模（31）包括与上腔相对的下腔（5）。此外，在相关下腔的底面放置形状和厚度T（≥t）的缓冲片（51），使得能够在上表面上放置相关的外部端子组。在实现树脂的情况下，可以有效地防止熔融树脂进入缓冲片和金属模之间的间隙。因此，可以防止产生树脂毛刺。结果，可以制造高可靠性的电路模块。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006202969A Semiconductor device and mounting body thereof 审中-公开
标题翻译：半导体器件及其安装体
公开(公告)号：JP2006202969A
公开(公告)日：2006-08-03
申请号：JP2005012839
申请日：2005-01-20
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： INOUE TAIZO , KITAZAKI KENZO , MUGITANI HIDEJI , OMOTANI HISASHI
IPC分类号： H01L21/60
CPC分类号： H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/05655 , H01L2224/1147 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device including a polar electrode having a ball-type low melting point layer which is prevented from getting wet in the side surface of the pole. SOLUTION: The polar electrode 20 provided on a semiconductor substrate 12 is constituted with a lower melting point layer 24 and poles 22-1 and 22-2 having the melting point which is higher than the lower melting point layer. The pole 22-2 is arranged on the upper surface of the pole 22-1, diameter of the pole 22-2 is set smaller than that of the polar part 22-1, and the lower melting point layer 24 is joined with the upper surface of the pole 22-2. Accordingly, when a ball is formed through reflow of the lower melting point layer 24, the lower melting point layer 24 can be prevented from getting wet at least to the side surface of the polar part 22-1 having larger diameter. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种包括极性电极的半导体器件，该极性电极具有防止在极的侧表面变湿的球形低熔点层。解决方案：设置在半导体基板12上的极性电极20由低熔点层24和熔点高于下层熔点层的极22-1,22-2构成。极22-2设置在极22-1的上表面上，极22-2的直径设定为小于极22-1的直径，下熔点层24与上部杆22-2的表面。因此，当通过下熔点层24的回流形成球时，可以防止下熔点层24至少在具有较大直径的极性部分22-1的侧表面变湿。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2015057815A 回路モジュール审中-公开
标题翻译：电路模块
公开(公告)号：JP2015057815A
公开(公告)日：2015-03-26
申请号：JP2014112605
申请日：2014-05-30
申请人：太陽誘電株式会社 , Taiyo Yuden Co Ltd
发明人： MUGITANI HIDEJI , KITAZAKI KENZO , SHIMAMURA MASAYA , SAJI TETSUO , NAKAMURA HIROSHI
IPC分类号： H05K9/00 , H01L23/00 , H01L25/00 , H05K1/02 , H05K3/28 , H05K3/46
CPC分类号： H05K1/0218 , H01L2224/16225 , H01L2924/16152 , H01L2924/16153 , H01L2924/181 , H01L2924/19105 , H05K1/0215 , H05K1/0216 , H05K3/284 , H05K3/303 , H05K9/0024 , H05K9/0045 , H05K2201/0723 , H05K2201/09036 , H05K2201/09145 , H05K2201/0919 , H05K2201/09972 , H05K2201/1056 , H05K2203/108 , Y10T29/4913 , H01L2924/00012
摘要：【課題】レーザー照射による回路基板の層内配線へのダメージが防止され、かつシールドと回路基板の表層導体の電気的接続が確保されている回路モジュールを提供すること。【解決手段】本発明に係る回路モジュールは、回路基板と、実装部品と、封止体と、シールドとを具備する。回路基板は、層内配線が形成された多層基板であって、実装面を有し、上記実装面側の上記層内配線上に実装面に表層導体が配設されている。実装部品は、実装面に実装されている。封止体は、実装面上に形成され、実装部品を被覆する封止体であって、封止体の主面から実装面に向けて形成され、表層導体上に位置し、表層導体に到達するレーザー照射によって形成された第1のトレンチ部分と、表層導体上に位置し、表層導体に到達しない第2のトレンチ部分とを有するトレンチを備える。シールドは、封止体を被覆する外部シールド部と、トレンチの内部に形成された内部シールド部とを有する。【選択図】図13
摘要翻译：要解决的问题：提供一种电路模块，其防止由激光照射引起的电路板的内层布线的损坏，并确保屏蔽和电路板的表层导体之间的电连接。解决方案：根据本实施例包括电路板，安装部件，封装体和屏蔽件。电路板是形成内层布线的多层基板; 并且在安装面上的内层布线的安装面上配置有安装面，表层导体配置在安装面上。安装部件安装在安装表面上。封装体形成在安装面上; 并覆盖安装部件; 并且包括从封装体的主表面朝向安装表面形成的沟槽，并且具有位于表面层导体上的第一沟槽部分，并且通过到达表面层导体的激光辐射形成，并且第二沟槽部分位于表面层导体并未到达表层导体。该屏蔽件具有覆盖封装体的外部屏蔽部分和形成在沟槽内部的内部屏蔽部分。

7. 发明专利

JP2015057805A 回路モジュール及びその製造方法有权
标题翻译：电路模块及其制造方法
公开(公告)号：JP2015057805A
公开(公告)日：2015-03-26
申请号：JP2013170456
申请日：2013-08-20
申请人：太陽誘電株式会社 , Taiyo Yuden Co Ltd
发明人： KITAZAKI KENZO , SHIMAMURA MASAYA , MUGITANI HIDEJI , KAI TAKEHIKO
IPC分类号： H01L23/28 , H01L23/00 , H01L25/04 , H01L25/18 , H05K1/02 , H05K3/28 , H05K9/00
CPC分类号： H05K9/0081 , H01L21/561 , H01L23/3121 , H01L23/552 , H01L24/73 , H01L24/97 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12042 , H01L2924/1461 , H01L2924/15159 , H01L2924/15192 , H01L2924/15313 , H01L2924/181 , H01L2924/19105 , H05K1/0216 , H05K3/244 , H05K3/284 , H05K2201/0341 , H05K2201/0919 , H05K2201/0979 , H05K2201/09845 , H05K2203/085 , H05K2203/107 , H05K2203/1316 , H05K2203/1361 , Y10T29/4913 , H01L2924/00 , H01L2924/00012 , H01L2224/83 , H01L2224/85
摘要：【課題】シールド形状の設計自由度が高く、レーザ光の照射から基板上の配線を保護し、配線層とシールド間の電気的接続を確保できる回路モジュールを提供する。【解決手段】本発明の一実施形態に係る回路モジュール100は、配線基板2と、複数の電子部品3と、封止層4と、導電性シールド5とを具備する。配線基板2は、第1の領域と第2の領域とを含む実装面2aと、実装面2aの第1の領域と第2の領域との境界に沿って形成され、最表層がAu又はAgで構成された導体パターン10とを有する。封止層4は、複数の電子部品3を被覆し、絶縁性材料で構成され、上記境界に沿って形成され上記導体パターンの最表層の少なくとも一部が露出する深さの溝部41を有する。導電性シールド5は、封止層4の外表面を被覆する第1のシールド部51と、溝部41に設けられ導体パターン10と電気的に接続する第2のシールド部52とを有する。【選択図】図2
摘要翻译：要解决的问题：提供一种具有屏蔽形状设计的高自由度的电路模块，并且允许保护基板上的布线免受激光的辐射并确保布线层和屏蔽件之间的电连接。解决方案：电路模块100包括布线基板2，多个电子部件3，密封层4和导电屏蔽5.布线基板2具有包括第一区域和第二区域的安装面2a和导体图案 10沿着安装表面2a的第一区域和第二区域之间的边界形成并且具有由Au或Ag组成的最外表面层。密封层4涂覆多个电子部件3，由绝缘材料构成，并且具有沿着边界形成的沟槽41，并且具有使导体图案的最外表面层的至少一部分露出的深度。导电屏蔽5具有涂覆密封层4的外表面的第一屏蔽部分51和设置在沟槽41中并电连接到导体图案10的第二屏蔽部分52。

8. 发明专利

JP2008022016A Circuit module 审中-公开
标题翻译：电路模块
公开(公告)号：JP2008022016A
公开(公告)日：2008-01-31
申请号：JP2007196473
申请日：2007-07-27
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： MUGITANI HIDEJI , KAI TAKEHIKO , YUASA MINORU
IPC分类号： H01L23/29 , H01L23/31 , H05K3/28
CPC分类号： H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105
摘要： PROBLEM TO BE SOLVED: To provide a circuit module in which solder fillet of an electronic component can be prevented from melting through reflow to cause short circuit.
SOLUTION: The circuit module 1 is provided with a first resin 7 covering from a land electrode on a circuit board 3 to the solder fillet 5 connecting the electronic component 21 on the mounting surface 3a and interposing between the electronic component 21 and the mounting surface 3a, a second resin 9 covering at least the upper surface of the first resin part 7 and the electronic component 21 connected through the solder fillet 5. The first resin 7 serves to prevent short circuit even if the solder fillet 5 melts through reflow.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路模块，其中电子部件的焊盘可以通过回流熔化而引起短路。解决方案：电路模块1设置有第一树脂7，其从电路板3上的焊盘电极覆盖到连接安装表面3a上的电子部件21并插入在电子部件21和电子部件21之间的焊接圆角5 安装表面3a，至少覆盖第一树脂部分7的上表面的第二树脂9和通过焊接圆角5连接的电子部件21.第一树脂7用于防止短路，即使焊接焊缝5通过回流熔化。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2006286915A Circuit module 审中-公开
标题翻译：电路模块
公开(公告)号：JP2006286915A
公开(公告)日：2006-10-19
申请号：JP2005104545
申请日：2005-03-31
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： KAI TAKEHIKO , YUASA MINORU , MUGITANI HIDEJI , SAKURAI TATSUYA
IPC分类号： H05K9/00 , H01L23/00 , H05K3/28
CPC分类号： H01L24/97 , H01L2924/15787 , H01L2924/19105 , H01L2924/3025 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a circuit module which offers a noise shield effect matching that of a metal case when electronic components sealed in an insulating resin layer are sheathed with a conductive resin layer overlaid on the insulating resin layer. SOLUTION: The circuit module includes a circuit board (7) having a wiring pattern (5) and a ground layer (8), a group of electronic components (9) mounted on the mounting surface of the circuit board (7), the insulating resin layer (15) sealing the electronic components (9), and the conductive resin layer (19) which is formed on the surface of the insulating resin layer (15) and contains flakes of metal. The conductive resin layer (19) works to offer the noise shield effect matching that of the metal case. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电路模块，其在密封在绝缘树脂层中的电子部件用覆盖在绝缘树脂层上的导电树脂层覆盖时，提供与金属壳体相匹配的噪声屏蔽效果。解决方案：电路模块包括具有布线图案（5）和接地层（8）的电路板（7），安装在电路板（7）的安装表面上的一组电子部件（9）密封电子部件（9）的绝缘树脂层（15）和在绝缘树脂层（15）的表面上形成的含有金属片的导电性树脂层（19）。导电树脂层（19）用于提供与金属外壳相匹配的噪音屏蔽效果。版权所有（C）2007，JPO＆INPIT

10. 发明专利

JP2003324259A Circuit module and manufacturing method therefor 审中-公开
标题翻译：电路模块及其制造方法
公开(公告)号：JP2003324259A
公开(公告)日：2003-11-14
申请号：JP2002129594
申请日：2002-05-01
申请人： Taiyo Yuden Co Ltd , 太陽誘電株式会社
发明人： MUGITANI HIDEJI
IPC分类号： H05K13/04 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To improve the reliability of a circuit module by accurately recognizing a form of a square terminal at mounting. SOLUTION: In a circuit module (1), a conductor surface (23c) is exposed from the surface of a mounted square terminal (21), and a rounded part or a chamfered part (23a and 23b) are formed at all the corners of four sides surrounding the conductor surface (23c). By this constitution, the diffuse reflection of light irradiated on the corner of the square terminal is accelerated, and thereby the quantity of light incident to a camera is increased. The form is accurately recognized by increasing the quantity of light, so that positioning at mounting is accurately performed. Thereby the reliability of the circuit module on which the square terminal is mounted is improved. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：通过在安装时精确识别正方形端子的形式来提高电路模块的可靠性。解决方案：在电路模块（1）中，导体表面（23c）从安装的方形端子（21）的表面露出，并且完全形成圆形部分或倒角部分（23a和23b）围绕导体表面（23c）的四个边的角部。通过这种结构，加速了照射在方形端子的角上的光的漫反射，从而增加了入射到照相机的光量。通过增加光量可以准确地识别出形状，从而准确地进行安装时的定位。从而提高了安装方形端子的电路模块的可靠性。版权所有（C）2004，JPO

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