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    • 1. 发明专利
    • JPH05295527A
    • 1993-11-09
    • JP19920991
    • 1991-08-08
    • RIKAGAKU KENKYUSHOJEOL LTD
    • HARA TAMIOHAMAGAKI MANABUAOYANAGI KATSUNOBUKOBUNA SADATOSHI
    • C23C14/32
    • PURPOSE:To develop ion plating device having the excellent efficiency of utilizing electrons by providing a reflection plate for the electrons from a plasma generator in a vapor deposition chamber of the ion plating device. CONSTITUTION:The inside of a plasma forming device 9 and the vacuum vapor deposition chamber 1 connected thereto is evacuated to a vacuum and gaseous Ar is gradually supplied from a gas supplying pipe 15 of a plasma forming device, simultaneously with which the electrons are released by energizing a hot cathode 10. A voltage is then impressed between the hot cathode 10 and a discharge electrode 12 to generate a discharge. Ar molecules are ionized by the electrons from the hot cathode 10 to generate plasma P. The electrons formed therein advance rectilinearly in the vapor deposition chamber 1. On the other hand, a raw material 3 for vapor deposition in a crucible 2 is heated and evaporated by the electrons from a filament 4 and collide against the electrons from the plasma forming device 9, by that, the raw material is ionized and a vapor deposited film is formed on a substrate 6. The electrons are partly not utilized and advance rectilinearely and, therefore, these electrons are reflected by the reflection electrode 21 to irradiate and evaporate the raw material 3 for vapor deposition in the crusible 2. The electrons are thus effectively utilized for the vapor deposition effect.