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1. 发明专利

JP2012175471A Magnetic field coupling type communication device and magnetic field coupling type communication system 审中-公开
标题翻译：磁场耦合型通信装置和磁场耦合型通信系统
公开(公告)号：JP2012175471A
公开(公告)日：2012-09-10
申请号：JP2011036497
申请日：2011-02-23
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： IEGI TSUTOMU , BABA TAKAHIRO , SAKAI MASARU , IKEMOTO NOBUO , DOKAI TAKEYA
IPC分类号： H04B5/02 , H04M1/02
摘要： PROBLEM TO BE SOLVED: To achieve an RFID communication system that can perform stable magnetic field coupling type communication.SOLUTION: In a reader/writer 10, a transmission antenna 101Tx and a reception antenna 101Rx of a loop-like antenna are closely arranged. To the transmission antenna 101Tx, a paramagnetic first magnetic body 102A is arranged on an external side of the reader/writer 10. To the reception antenna 101Rx, a paramagnetic second magnetic body 102B is arranged on the external side of the reader/writer 10. To an RFID tag 20, a transmission/reception antenna 201 consisting of a coil-like antenna is arranged. To the transmission/reception antenna 201, a paramagnetic third magnetic body 203 is arranged on an inner side of the RFID tag 20. Thereby, magnetic field coupling between the transmission antenna 101Tx and the reception antenna 101Rx is suppressed, and the magnetic field coupling between the transmission antenna 101Tx and the reception antenna 101Rx, and the transmission/reception antenna 201 is strengthened.
摘要翻译：解决的问题：实现能够进行稳定的磁场耦合型通信的RFID通信系统。解决方案：在读取器/写入器10中，环形天线的发送天线101Tx和接收天线101Rx紧密配置。在发送天线101Tx中，顺磁性第一磁性体102A配置在读写器10的外侧。另外，在接收天线101Rx中，在读写器10的外侧配置顺磁性第二磁性体102B。对于RFID标签20，布置有由线圈状天线组成的发送/接收天线201。在发送接收天线201中，在RFID标签20的内侧配置有顺磁性的第3磁性体203，能够抑制发送天线101Tx与接收天线101Rx之间的磁场耦合，发送天线101Tx和接收天线101Rx以及发送/接收天线201被加强。版权所有（C）2012，JPO＆INPIT

2. 发明专利

JP2006042010A High frequency oscillation circuit, high frequency device, and characteristic adjusting method of high frequency oscillation circuit 审中-公开
标题翻译：高频振荡电路，高频器件和高频振荡电路的特性调整方法
公开(公告)号：JP2006042010A
公开(公告)日：2006-02-09
申请号：JP2004220074
申请日：2004-07-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： FUJIDAI MASANORI , BABA TAKAHIRO , SHINODA SATOSHI , SONODA TOMIYA , HIRATSUKA TOSHIRO
IPC分类号： H03B5/18 , H01P7/10 , H03B5/04
摘要： PROBLEM TO BE SOLVED: To provide a high frequency oscillation circuit for satisfying prescribed oscillation characteristics and modulation width characteristics under condition, in which load variation characteristics are stabled.
SOLUTION: In the high frequency oscillation circuit 100, a characteristic adjusting open stub 14 is provided on the drain edge side of an FET 9 for connecting a resonance circuit 1 and an amplifier circuit 2, and trimming or a dielectric ship is applied thereby. Since there is no variation in impedance between the source edge side of the FET 9 and an output terminal 13, large attenuation of the output signal or a characteristic variation to the load variation can not be generated, and the oscillation frequency characteristics, output characteristics, and modulation width characteristics are adjustable under condition, in which load variation characteristics are stabled.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在稳定负载变动特性的条件下满足规定的振荡特性和调制宽度特性的高频振荡电路。解决方案：在高频振荡电路100中，在用于连接谐振电路1和放大器电路2的FET9的漏极边缘侧上设置特性调节开路短截线14，并施加微调或电介质船从而。由于FET9的源极边缘侧和输出端子13之间的阻抗没有变化，所以不能产生输出信号的衰减量大，负载变动的特性变化，振荡频率特性，输出特性，并且调制宽度特性在负载变化特性稳定的条件下是可调节的。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2013145945A Radio communication device 有权
标题翻译：无线电通信设备
公开(公告)号：JP2013145945A
公开(公告)日：2013-07-25
申请号：JP2012005043
申请日：2012-01-13
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YOSUI KUNIAKI , IKEDA NAOTO , GOCHI NAOKI , NAKAISO TOSHIYUKI
IPC分类号： H04B5/02 , G06K17/00 , G06K19/07 , H04B1/59
摘要： PROBLEM TO BE SOLVED: To perform temperature compensation of the resonant frequency of an antenna circuit at high speed.SOLUTION: A radio communication device 1 includes: an antenna circuit 11 including at least an LC resonance circuit constituted by an inductance component and a capacitance component composed of a variable capacitance element 17 that can change the capacitance value according to an applied voltage value; an RFIC chip 12 connected to the antenna circuit 11 and generating a control voltage to the variable capacitance element 17; and a temperature compensation circuit 14 including a thermistor 18 connected in series or a parallel to the variable capacitance element 17, temperature-compensating the control voltage generated by the RFIC chip 12, and applying the temperature-compensated control voltage to the variable capacitance element 17. The temperature compensation circuit 14 adjusts the control voltage by the change of specific resistance of the thermistor 18 itself due to a temperature environment so that at least a part of capacitance changes of the variable capacitance element due to the temperature environment is canceled.
摘要翻译：要解决的问题：高速地对天线电路的谐振频率进行温度补偿。解决方案：无线电通信装置1包括：天线电路11，包括至少一个LC谐振电路，该谐振电路由电感分量和电容分量由可变电容元件17构成，其可以根据施加的电压值改变电容值; 连接到天线电路11并产生对可变电容元件17的控制电压的RFIC芯片12; 以及包括与可变电容元件17串联或并联连接的热敏电阻18的温度补偿电路14，对由RFIC芯片12产生的控制电压进行补偿温度补偿，并将温度补偿控制电压施加到可变电容元件17 温度补偿电路14由于温度环境而由热敏电阻18本身的比电阻的变化来调节控制电压，从而消除由温度环境导致的可变电容元件的电容变化的至少一部分。

4. 发明专利

JP2007053440A Suspended stripline device and transmitting/receiving apparatus 审中-公开
标题翻译：悬挂式条带装置和发送/接收装置
公开(公告)号：JP2007053440A
公开(公告)日：2007-03-01
申请号：JP2005235449
申请日：2005-08-15
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： OKANO TAKESHI , SHINODA SATOSHI , BABA TAKAHIRO
IPC分类号： H01P3/08 , H01P5/02 , H03D7/02 , H03D9/06 , H04B1/40
摘要： PROBLEM TO BE SOLVED: To provide a suspended stripline device wherein a low loss is attained by suppressing leakage of a high frequency signal and a degree of design freedom of which can be enhanced and to provide a transmitting/receiving apparatus. SOLUTION: A dielectric substrate 3 is arranged between two conductor plates 1, 2. Further, a first suspended stripline 4 for a high frequency signal is provided to a front side 3A of the dielectric substrate 3. On the other hand, a second suspended stripline 5 for a DC signal or a low frequency signal is provided to a rear side 3B of the dielectric substrate 3 in crossing with the first suspended stripline 4. Then an open stub 6 is provided to the second suspended stripline 5 at both sides of a position P crossing with the first suspended stripline 4. Thus, the apparatus uses the open stubs 6 to shut off the high frequency signal, so as to bring the first suspended stripline 4 to have a low loss. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决的问题：提供一种悬挂带状线装置，其中通过抑制高频信号的泄漏而获得低损耗，并且可以提高其设计自由度，并提供发送/接收装置。解决方案：电介质基板3布置在两个导体板1,2之间。此外，用于高频信号的第一悬置带状线4被提供到电介质基板3的前侧3A。另一方面，在与第一悬吊带状线4交叉的电介质基板3的后侧3B设置有用于DC信号或低频信号的第二悬吊带状线5.然后，在第二悬挂带状线5的两侧设置开口短截线6 与第一悬挂带状线4交叉的位置P.因此，该装置使用开放短截线6来切断高频信号，从而使第一悬挂带状线4具有低损耗。版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2003309405A Dielectric resonator device, high frequency filter, and high frequency oscillator 有权
标题翻译：电介质谐振器，高频滤波器，高频振荡器
公开(公告)号：JP2003309405A
公开(公告)日：2003-10-31
申请号：JP2002115144
申请日：2002-04-17
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： MUKOYAMA KAZUTAKA , MIKAMI SHIGEYUKI , MATSUZAKI HIROYASU , KAWACHI TETSUYA , BABA TAKAHIRO , SAKAMOTO KOICHI
IPC分类号： H01P7/08 , H01P1/203 , H01P7/10
CPC分类号： H01P1/20318 , H01P7/10
摘要： PROBLEM TO BE SOLVED: To provide a dielectric resonator device wherein a strong coupling is obtained between a resonator and a slot line or the like and to provide a high frequency filter, and a high frequency oscillator.
SOLUTION: An electrode film 2, 3 is formed on a front surface 1A (rear surface 1B) of a dielectric substrate 1, and a TE 010 mode resonator 4 is formed, which comprises circular openings 4A, 4B respectively opposed to the electrode films 2, 3. further, a PDTL (planar dielectric line) 5 comprising slots 5A, 5B opposed to the electrode films 2, 3 is formed and the PDTL 5 is connected to the TE 010 mode resonator 4. Moreover, extending parts located aside the slots 5A, 5B in the electrode films 2, 3 into the openings 4A, 4B forms a excitation part 6. Thus, the tip of the excitation part 6 is placed at a position at which the electric field strength of the TE 010 mode resonator 4 is strong so as to strengthen the coupling between the TE 010 mode resonator 4 and the PDTL 5.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种介质谐振器装置，其中在谐振器和缝隙线等之间获得强耦合并提供高频滤波器和高频振荡器。解决方案：在电介质基板1的前表面1A（背面1B）上形成电极膜2,3，形成TE 010模式谐振器4，其包括分别与电介质基板1相对的圆形开口4A，4B 还形成了包括与电极膜2,3相对的槽5A，5B的PDTL（平面介质线）5，并且PDTL 5连接到TE 010模式谐振器4。而且，位于将电极膜2,3中的槽5A，5B放入开口4A，4B中形成激励部6.因此，激发部6的前端位于TE 010模式的电场强度的位置谐振器4是强的，以便加强TE 010模式谐振器4和PDTL 5之间的耦合。版权所有（C）2004，JPO

6. 发明专利

JP2011134817A Module with built-in component 有权
标题翻译：具有内置组件的模块
公开(公告)号：JP2011134817A
公开(公告)日：2011-07-07
申请号：JP2009291630
申请日：2009-12-24
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMADA HIDEAKI , IEGI TSUTOMU
IPC分类号： H01L23/12 , H01L23/36
CPC分类号： H01L2224/16225 , H01L2224/48227 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a module with a built-in component allowing high-density wiring without impairing a heat dissipation effect from a metal block for heat radiation.
SOLUTION: The module with a built-in component includes: a substrate 1 with via holes 2a, 2b, 2c; the metal block 3 arranged on the substrate and having through-holes 4a, 4b penetrating from a surface opposite of a surface in contact with the substrate to the surface in contact with the substrate and joining the via holes, resin filling the through-holes, and via holes 13a, 13b formed in the resin; a first resin layer 8 arranged on the substrate and in which the metal block is buried; a heating part 17 arranged on the first resin layer and connected to the via hole formed in the metal block or the metal block with metal bumps 19a, 19b, 19c; and a second resin layer 20 arranged on the first resin layer and in which the heating part is buried.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有允许高密度布线的内置部件的模块，而不损害来自用于散热的金属块的散热效果。解决方案：具有内置部件的模块包括：具有通孔2a，2b，2c的基板1; 金属块3布置在基板上，并且具有从与基板接触的表面相反的表面穿透到与基板接触的表面的通孔4a，4b，并且连接通孔，填充通孔的树脂，以及形成在树脂中的通孔13a，13b; 布置在基板上并且金属块被埋入的第一树脂层8; 布置在第一树脂层上并与形成在金属块中的通孔相连的加热部分17或具有金属凸块19a，19b，19c的金属块; 以及布置在第一树脂层上并加热加热部分的第二树脂层20。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2017092486A 電気素子有权
公开(公告)号：JP2017092486A
公开(公告)日：2017-05-25
申请号：JP2016252194
申请日：2016-12-27
申请人：株式会社村田製作所 , Murata Mfg Co Ltd
发明人： BABA TAKAHIRO , KIKUCHI AKIHIRO , KATO MOTORO , NISHINO KOSUKE , IKEMOTO NOBUO
IPC分类号： H05K3/34 , H01P3/08 , H05K1/02
CPC分类号： H01P3/08 , H01P3/026 , H01P3/085 , H05K1/0239 , H05K1/0242 , H05K1/0243 , H05K1/0245 , H05K1/0298 , H05K1/0313 , H05K1/111 , H05K1/141 , H05K1/144 , H05K1/147 , H05K2201/0141
摘要：【課題】例えばフラットケーブルとして用いられる電気素子を簡易な工程で基板に実装できる構造を備えた電子機器、およびその電気素子を提供する。【解決手段】電子機器は、基板201と基板201に実装される電気素子101とを備える。電気素子101は、平坦な第1主面S1と第2主面S2を有する可変形性の基材10と、基材10に形成された導体パターンとを備える。これら導体パターンにより、第1接続部CN1、第2接続部CN2、伝送線路部CA、および電気素子側接合パターンB1が構成される。基板201には、電気素子の第1接続部が接続される第3接続部CN3、電気素子の第2接続部CN2が接続される第4接続部CN4、電気素子側接合パターンB1が接合される基板側接合パターンB2を備える。【選択図】図1

8. 发明专利

JP2012064639A Circuit module with metal case 有权
标题翻译：带金属外壳的电路模块
公开(公告)号：JP2012064639A
公开(公告)日：2012-03-29
申请号：JP2010205455
申请日：2010-09-14
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMAMOTO JUNYA
IPC分类号： H01L23/02 , H01L23/00 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To solve such a problem that in a circuit module with a metal case where the stray capacitance between the metal case and a mounted electronic component varies when the metal case flexes to cause variation in the circuit module characteristics, and to provide a circuit module in which the circuit module characteristics is less susceptible to variation by increasing the flexure strength of the metal case as much as possible while limiting the number of supports for supporting the metal case and the area on a substrate occupied by the supports as much as possible.SOLUTION: For the circuit module having a rectangular contour, legs of the metal case are arranged at two points on each of long sides facing each other so that a shape formed by connecting respective legs by straight lines becomes square, and its center matches the center of the rectangle.
摘要翻译：解决这样的问题：为了解决这样一个问题，即在金属壳体和安装的电子部件之间的杂散电容在金属壳体发生弯曲而引起电路模块特性变化的金属壳体的电路模块中时，并且提供一种电路模块，其中电路模块特性不易受变化的影响，尽可能地增加金属壳体的挠曲强度，同时限制用于支撑金属壳体的支撑件的数量和由基板占据的基板上的面积支持尽可能多。
解决方案：对于具有矩形轮廓的电路模块，金属外壳的腿部布置在彼此面对的每个长边上的两个点处，使得通过直线连接相应的腿形成的形状变为正方形，并且其中心匹配矩形的中心。版权所有（C）2012，JPO＆INPIT

9. 发明专利

JP2006050334A High frequency module and radio communication equipment 审中-公开
标题翻译：高频模块和无线电通信设备
公开(公告)号：JP2006050334A
公开(公告)日：2006-02-16
申请号：JP2004229653
申请日：2004-08-05
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： SONODA TOMIYA , FUJIDAI MASANOBU , BABA TAKAHIRO , SHINODA SATOSHI , HIRATSUKA TOSHIRO
IPC分类号： H01P7/10
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module and radio communication equipment for improving maintenance frequency characteristics by constituting so that a resonance frequency of a spurious mode moves towards one higher than the resonance frequency of a resonator by specified frequency or above.
SOLUTION: A voltage control oscillator 1 is provided with a package 2, a dielectric resonator 3, a circuit substrate 4, and a cover 5, and houses the dielectric resonator 3 and the circuit substrate 4 in the package 2. The package 2 has a horizontal mounting part 20 for mounting the circuit substrate 4 and a housing part 21 for housing the dielectric resonator 3. Also, the mounting part 20 and the housing part 21 are covered with an conductor film 25. The dielectric resonator 3 is formed into a chip body shape and a ratio of a longer side of the housing part 21 to a longer side of the dielectric resonator 3 is set within a range 1.1 to 1.5. Thus, a resonance frequency of spurious moves away to one higher than the resonance frequency of the dielectric resonator 3 by the specified frequency or above.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种高频模块和无线电通信设备，用于通过构成使得寄生模式的谐振频率向着比谐振器的谐振频率高一个特定频率或更高的频率移动来提高维护频率特性。解决方案：电压控制振荡器1设置有封装2，介质谐振器3，电路基板4和盖5，并且将介质谐振器3和电路基板4容纳在封装2中。封装 2具有用于安装电路基板4的水平安装部20和用于容纳介质谐振器3的壳体部21.此外，安装部20和壳体部21被导体膜25覆盖。形成介质谐振器3 成为芯体的形状，并且外壳部21的长边与介质谐振器3的长边的比例设定在1.1〜1.5的范围内。因此，杂散的谐振频率远离介质谐振器3的谐振频率高一个指定频率或更高的频率。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2011155560A High frequency reception module 有权
标题翻译：高频接收模块
公开(公告)号：JP2011155560A
公开(公告)日：2011-08-11
申请号：JP2010016498
申请日：2010-01-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMADA HIDEAKI , IEGI TSUTOMU
IPC分类号： H04B1/08 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2924/15311 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a high frequency reception module for improving the S/N rate of a reception signal. SOLUTION: A high frequency reception module 100 includes: a first wiring layer 11 having a signal terminal 32 on the lower main surface; a first built-in layer 12 formed on the upper main surface of the first wiring layer 11, and internally equipped with a base band part 50 electrically connected to a signal terminal 32; a second built-in layer 14 formed at the upper part of the first built-in layer 12, and internally equipped with an RF part 40 electrically connected to the base band part 50; and an external connection path 23 electrically connected to the RF part 40 at a position above the base band part 50. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高接收信号的S / N速率的高频接收模块。解决方案：高频接收模块100包括：在下主表面上具有信号端子32的第一布线层11; 第一内置层12，其形成在第一布线层11的上主表面上，内部配备有电连接到信号端子32的基带部分50; 形成在第一内置层12的上部的第二内置层14，并且内部配备有电连接到基带部50的RF部40; 以及外部连接路径23，其在基带部分50上方的位置处电连接到RF部件40.版权所有（C）2011，JPO＆INPIT

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