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JP2012064639A Circuit module with metal case 有权
标题翻译：带金属外壳的电路模块
公开(公告)号：JP2012064639A
公开(公告)日：2012-03-29
申请号：JP2010205455
申请日：2010-09-14
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMAMOTO JUNYA
IPC分类号： H01L23/02 , H01L23/00 , H05K9/00
摘要： PROBLEM TO BE SOLVED: To solve such a problem that in a circuit module with a metal case where the stray capacitance between the metal case and a mounted electronic component varies when the metal case flexes to cause variation in the circuit module characteristics, and to provide a circuit module in which the circuit module characteristics is less susceptible to variation by increasing the flexure strength of the metal case as much as possible while limiting the number of supports for supporting the metal case and the area on a substrate occupied by the supports as much as possible.SOLUTION: For the circuit module having a rectangular contour, legs of the metal case are arranged at two points on each of long sides facing each other so that a shape formed by connecting respective legs by straight lines becomes square, and its center matches the center of the rectangle.
摘要翻译：解决这样的问题：为了解决这样一个问题，即在金属壳体和安装的电子部件之间的杂散电容在金属壳体发生弯曲而引起电路模块特性变化的金属壳体的电路模块中时，并且提供一种电路模块，其中电路模块特性不易受变化的影响，尽可能地增加金属壳体的挠曲强度，同时限制用于支撑金属壳体的支撑件的数量和由基板占据的基板上的面积支持尽可能多。
解决方案：对于具有矩形轮廓的电路模块，金属外壳的腿部布置在彼此面对的每个长边上的两个点处，使得通过直线连接相应的腿形成的形状变为正方形，并且其中心匹配矩形的中心。版权所有（C）2012，JPO＆INPIT

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