专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2006050334A High frequency module and radio communication equipment 审中-公开
标题翻译：高频模块和无线电通信设备
公开(公告)号：JP2006050334A
公开(公告)日：2006-02-16
申请号：JP2004229653
申请日：2004-08-05
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： SONODA TOMIYA , FUJIDAI MASANOBU , BABA TAKAHIRO , SHINODA SATOSHI , HIRATSUKA TOSHIRO
IPC分类号： H01P7/10
摘要： PROBLEM TO BE SOLVED: To provide a high frequency module and radio communication equipment for improving maintenance frequency characteristics by constituting so that a resonance frequency of a spurious mode moves towards one higher than the resonance frequency of a resonator by specified frequency or above.
SOLUTION: A voltage control oscillator 1 is provided with a package 2, a dielectric resonator 3, a circuit substrate 4, and a cover 5, and houses the dielectric resonator 3 and the circuit substrate 4 in the package 2. The package 2 has a horizontal mounting part 20 for mounting the circuit substrate 4 and a housing part 21 for housing the dielectric resonator 3. Also, the mounting part 20 and the housing part 21 are covered with an conductor film 25. The dielectric resonator 3 is formed into a chip body shape and a ratio of a longer side of the housing part 21 to a longer side of the dielectric resonator 3 is set within a range 1.1 to 1.5. Thus, a resonance frequency of spurious moves away to one higher than the resonance frequency of the dielectric resonator 3 by the specified frequency or above.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种高频模块和无线电通信设备，用于通过构成使得寄生模式的谐振频率向着比谐振器的谐振频率高一个特定频率或更高的频率移动来提高维护频率特性。解决方案：电压控制振荡器1设置有封装2，介质谐振器3，电路基板4和盖5，并且将介质谐振器3和电路基板4容纳在封装2中。封装 2具有用于安装电路基板4的水平安装部20和用于容纳介质谐振器3的壳体部21.此外，安装部20和壳体部21被导体膜25覆盖。形成介质谐振器3 成为芯体的形状，并且外壳部21的长边与介质谐振器3的长边的比例设定在1.1〜1.5的范围内。因此，杂散的谐振频率远离介质谐振器3的谐振频率高一个指定频率或更高的频率。版权所有（C）2006，JPO＆NCIPI

IPRDB

热门服务

关于我们

友情链接

联系方式