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1. 发明专利

JP2011134817A Module with built-in component 有权
标题翻译：具有内置组件的模块
公开(公告)号：JP2011134817A
公开(公告)日：2011-07-07
申请号：JP2009291630
申请日：2009-12-24
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMADA HIDEAKI , IEGI TSUTOMU
IPC分类号： H01L23/12 , H01L23/36
CPC分类号： H01L2224/16225 , H01L2224/48227 , H01L2924/181 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a module with a built-in component allowing high-density wiring without impairing a heat dissipation effect from a metal block for heat radiation.
SOLUTION: The module with a built-in component includes: a substrate 1 with via holes 2a, 2b, 2c; the metal block 3 arranged on the substrate and having through-holes 4a, 4b penetrating from a surface opposite of a surface in contact with the substrate to the surface in contact with the substrate and joining the via holes, resin filling the through-holes, and via holes 13a, 13b formed in the resin; a first resin layer 8 arranged on the substrate and in which the metal block is buried; a heating part 17 arranged on the first resin layer and connected to the via hole formed in the metal block or the metal block with metal bumps 19a, 19b, 19c; and a second resin layer 20 arranged on the first resin layer and in which the heating part is buried.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有允许高密度布线的内置部件的模块，而不损害来自用于散热的金属块的散热效果。解决方案：具有内置部件的模块包括：具有通孔2a，2b，2c的基板1; 金属块3布置在基板上，并且具有从与基板接触的表面相反的表面穿透到与基板接触的表面的通孔4a，4b，并且连接通孔，填充通孔的树脂，以及形成在树脂中的通孔13a，13b; 布置在基板上并且金属块被埋入的第一树脂层8; 布置在第一树脂层上并与形成在金属块中的通孔相连的加热部分17或具有金属凸块19a，19b，19c的金属块; 以及布置在第一树脂层上并加热加热部分的第二树脂层20。版权所有（C）2011，JPO＆INPIT

2. 发明专利

JP2011054620A Method of manufacturing multilayer wiring board 审中-公开
标题翻译：制造多层接线板的方法
公开(公告)号：JP2011054620A
公开(公告)日：2011-03-17
申请号：JP2009199853
申请日：2009-08-31
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： YAMADA HIDEAKI , IEGI TSUTOMU
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board in which an interlayer insulating layer can be easily formed in a short period of time. SOLUTION: The method of manufacturing the multilayer wiring board includes processes of: preparing an insulating layer which has a first region and a second region and in which a wiring conductor is formed in the second region; forming a first interlayer insulating layer by applying a precursor of the interlayer insulating layer to the first region and drying it; forming a wiring conductor on the surface and the side face of the first interlayer insulating layer so as to make an electric connection with the wiring conductor formed in the second region of the insulating layer; and forming a second interlayer insulating layer by applying the precursor of the interlayer insulating layer to the second region and drying it after forming the first interlayer insulating layer and the wiring conductor. In the method of manufacturing the multilayer wiring board, the precursor of the interlayer insulating layer to be applied to the second region is lower in viscosity than the precursor of the interlayer insulating layer to be applied to the first region. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：解决的问题：提供一种可以在短时间内容易地形成层间绝缘层的多层布线基板的制造方法。解决方案：制造多层布线板的方法包括以下步骤：制备具有第一区域和第二区域并且在第二区域中形成布线导体的绝缘层; 通过将所述层间绝缘层的前体施加到所述第一区域并干燥来形成第一层间绝缘层; 在所述第一层间绝缘层的表面和所述侧面上形成布线导体，以与形成在所述绝缘层的所述第二区域中的所述布线导体形成电连接; 以及通过将所述层间绝缘层的前体施加到所述第二区域并在形成所述第一层间绝缘层和所述布线导体之后将其干燥来形成第二层间绝缘层。在制造多层布线板的方法中，施加到第二区域的层间绝缘层的前体的粘度低于施加到第一区域的层间绝缘层的前体。版权所有（C）2011，JPO＆INPIT

3. 发明专利

JP2004120792A Waveguide conversion structure, waveguide connection structure, primary radiator, oscillator and transmission apparatus 审中-公开
公开(公告)号：JP2004120792A
公开(公告)日：2004-04-15
申请号：JP2003394467
申请日：2003-11-25
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： KITAMORI NORIMASA , AZUMA KAZUTAKA , TANIZAKI TORU , YAMADA HIDEAKI , YAMASHITA SADAO
IPC分类号： H01P1/04 , H01P1/06 , H01P3/16 , H01P5/08 , H01P5/12 , H01Q13/02 , H01Q13/06 , H01Q13/10 , H01Q19/06
摘要： PROBLEM TO BE SOLVED: To provide: a dielectric line waveguide converter which implements direct conversion with a circular waveguide without being enlarged and complicated; a dielectric line easy to be multilayered; a primary radiator of wide band characteristics; an oscillator easily outputting an oscillated signal through a dielectric line; and a transmission apparatus using these. SOLUTION: The dielectric line is configured by arranging a dielectric strip 3 between two parallel conductor surfaces, and a terminal part of the dielectric strip 3 is inserted into a waveguide 4 just for a predetermined quantity approximately vertically to the electromagnetic wave propagation direction of the waveguide 4. Thus, mode conversion is performed between an LSM01 mode of the dielectric line and a circular TE11 mode of a circular cavity waveguide. COPYRIGHT: (C)2004,JPO

4. 发明专利

JP2011155560A High frequency reception module 有权
标题翻译：高频接收模块
公开(公告)号：JP2011155560A
公开(公告)日：2011-08-11
申请号：JP2010016498
申请日：2010-01-28
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： BABA TAKAHIRO , YAMADA HIDEAKI , IEGI TSUTOMU
IPC分类号： H04B1/08 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2924/15311 , H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a high frequency reception module for improving the S/N rate of a reception signal. SOLUTION: A high frequency reception module 100 includes: a first wiring layer 11 having a signal terminal 32 on the lower main surface; a first built-in layer 12 formed on the upper main surface of the first wiring layer 11, and internally equipped with a base band part 50 electrically connected to a signal terminal 32; a second built-in layer 14 formed at the upper part of the first built-in layer 12, and internally equipped with an RF part 40 electrically connected to the base band part 50; and an external connection path 23 electrically connected to the RF part 40 at a position above the base band part 50. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于提高接收信号的S / N速率的高频接收模块。解决方案：高频接收模块100包括：在下主表面上具有信号端子32的第一布线层11; 第一内置层12，其形成在第一布线层11的上主表面上，内部配备有电连接到信号端子32的基带部分50; 形成在第一内置层12的上部的第二内置层14，并且内部配备有电连接到基带部50的RF部40; 以及外部连接路径23，其在基带部分50上方的位置处电连接到RF部件40.版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2005124222A Dielectric lens antenna and wireless device using it 有权
标题翻译：电介质镜头天线和无线设备使用它
公开(公告)号：JP2005124222A
公开(公告)日：2005-05-12
申请号：JP2004318469
申请日：2004-11-01
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： ISHIKAWA YOHEI , SAKAMOTO KOICHI , YAMADA HIDEAKI , NAKAMURA FUMINORI
IPC分类号： H01Q15/08 , G01S7/03 , H01Q1/02
摘要： PROBLEM TO BE SOLVED: To provide a dielectric lens antenna including a snow melting function without degrading the efficiency of a lens and a communication apparatus using it. SOLUTION: In the dielectric lens antenna 10 constructed by attaching and holding a lens 2 made of a dielectric to and on a frame 3, a heating element 11 composed of a plurality of heating wires is formed on the front surface of the lens 2. A current is passed through the heating element 11 at the time of snowfall and snow accumulation, and snow attached on the front surface of the lens 2 of the dielectric lens antenna 10 can be melted by heat generated by a heating element. COPYRIGHT: (C)2005,JPO&NCIPI

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