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1. 发明专利

JP2004349729A Circuit board and its producing process 审中-公开
公开(公告)号：JP2004349729A
公开(公告)日：2004-12-09
申请号：JP2004264103
申请日：2004-09-10
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUZUKI TAKESHI , OGAWA TATSUO , BESSHO YOSHIHIRO , TOMEKAWA SATORU , NAKAYA YASUHIRO , ECHIGO FUMIO , UEDA YOJI , MATSUOKA SUSUMU , ANDO DAIZO
IPC分类号： H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit board in which a wiring layer and an insulator layer have a sufficient bonding strength, and high reliability is realized in inner via connection. SOLUTION: The circuit board comprises inner via conductors 102 formed in the thickness direction of an insulator layer 101 in order to connect the upper and lower surfaces of the insulator layer 101 electrically, and lands 103 arranged on the upper and lower surfaces of the insulator layer 101 while being connected electrically with the inner via conductors 102. The insulator layer 101 includes a surface 105 having a high compositional ratio of organic resin, and a core 106 having a low compositional ratio of organic resin formed in the order of the surface 105/the core 106/the surface 105. The core 106 is composed of a porous body, the lands 103 arranged on the upper and lower surfaces of the insulator layer 101 are buried in the surface until they touch the core 106 and the inner via conductors 102 has a thickness substantially identical to that of the core part 106. COPYRIGHT: (C)2005,JPO&NCIPI

2. 发明专利

JP2003324180A Mounter for semiconductor device 审中-公开
标题翻译：半导体器件安装
公开(公告)号：JP2003324180A
公开(公告)日：2003-11-14
申请号：JP2003158025
申请日：2003-06-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SHIRAISHI TSUKASA , MITANI TSUTOMU , AMAMI KAZUYOSHI , BESSHO YOSHIHIRO
IPC分类号： H01L25/18 , H01L23/52 , H01L25/04
CPC分类号： H01L2224/45144 , H01L2224/73204 , H01L2924/19107 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device wherein a semiconductor element is mounted on both sides of a multilayer circuit board having three-dimensional wiring using inner via holes, which enables high-speed operation and the reduction of size by using the ordinary stacked-layer structure of the semiconductor elements without employing a chip-on-chip structure.
SOLUTION: General-purpose semiconductor devices are mounted on both sides of the multilayer circuit board having three-dimensional wiring using the inner via holes so as to oppose each other with the multilayer circuit board between. Electrode terminals of individual semiconductor elements are connected via the three-dimensional wiring of the multilayer circuit board.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种半导体器件，其中半导体元件安装在具有使用内部通孔的三维布线的多层电路板的两侧，这使得能够通过使用高速操作和尺寸减小不采用片上芯片结构的半导体元件的普通堆叠层结构。解决方案：通过使用内部通孔将多功能半导体器件安装在具有三维布线的多层电路板的两侧，以便在多层电路板之间彼此相对。各个半导体元件的电极端子经由多层电路板的三维布线连接。版权所有（C）2004，JPO

3. 发明专利

JP2004208326A Module with built-in electric element, and its manufacturing method 有权
标题翻译：具有内置电气元件的模块及其制造方法
公开(公告)号：JP2004208326A
公开(公告)日：2004-07-22
申请号：JP2004027218
申请日：2004-02-03
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： NAKATANI SEIICHI , BESSHO YOSHIHIRO , SUGAYA YASUHIRO , ONISHI KEIJI
IPC分类号： H01L23/29 , H01L21/56 , H01L23/31 , H03H3/08 , H03H9/25
CPC分类号： H01L24/97 , H01L2224/16245 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a module with a built-in electric element such as semiconductor chip or surface acoustic wave element which is provided with a mechanical strength and which can be thinned, and its manufacturing method. SOLUTION: On a wiring pattern 201, two or more electric elements 203 are packaged and the electric elements 203 are sealed with a thermosetting resin composition 204. Upper surfaces of the two or more electric elements 203 and an upper surface of the thermosetting resin composition 204 are simultaneously polished to form approximately the same plane. Polishing is performed under sealing with the thermosetting resin composition 203, so that the module can be thinned without damaging the electric elements 203. Further, the electric elements 203, the wiring pattern 201 and the like can be prevented from being contaminated with a polishing solution. COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有内置电气元件的模块，例如具有机械强度且可以变薄的半导体芯片或表面声波元件及其制造方法。解决方案：在布线图案201上，封装两个或更多个电气元件203，并且用热固性树脂组合物204密封电子元件203.两个或更多个电气元件203的上表面和热固性树脂的上表面树脂组合物204同时被抛光以形成大致相同的平面。在热固性树脂组合物203的密封下进行抛光，使得可以使模块变薄而不损坏电气元件203.此外，可以防止电子元件203，布线图案201等被抛光溶液污染。版权所有（C）2004，JPO＆NCIPI

4. 发明专利

JP2004134817A Method of producing semiconductor device 审中-公开
公开(公告)号：JP2004134817A
公开(公告)日：2004-04-30
申请号：JP2004022001
申请日：2004-01-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： BESSHO YOSHIHIRO , ITAGAKI MINEHIRO
IPC分类号： H01L23/32 , H01L21/60
CPC分类号： H01L2224/16 , H01L2224/16235 , H01L2924/01005 , H01L2924/01078
摘要： PROBLEM TO BE SOLVED: To overcome a limit in the conventional semiconductor device in reducing the size, improving the reliability, and reducing the cost. SOLUTION: The method of producing semiconductor device includes a hole forming process of providing adhesive layers 2 on both sides of an organic film 1, then preparing a substrate having mold-releasing films 3 on both of the adhesive layers, and then forming a through-hole 4 in the substrate; a paste filling process of filling conductive paste 5 in the through-hole 4; and a connection process of releasing the mold-releasing film 3 from the adhesive layer 2, gluing a semiconductor device 6 on one side of the organic film 1 through the adhesive layer 2, and a multi-layer substrate 8 on the other side of the organic film 1 through the adhesive layer 2, and electrically connecting a terminal electrode 7 of the semiconductor device 6 to a connection electrode 9 of the multi-layer substrate 8 by the conductive paste 5. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003297877A Mounting body for electronic component 审中-公开
标题翻译：电子元件安装体
公开(公告)号：JP2003297877A
公开(公告)日：2003-10-17
申请号：JP2003059473
申请日：2003-03-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KUMANO YUTAKA , SHIRAISHI TSUKASA , BESSHO YOSHIHIRO
IPC分类号： H05K3/32 , H01L21/60 , H05K1/18
CPC分类号： H01L2224/11 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To improve the effectiveness of a mounting body of an electronic component. SOLUTION: After providing conductive adhesive material layers 7c and 7d each composed of a thermoplastic resin or a thermosetting resin in a liquid shape on the external connection part 2 of the electronic component 1 and the mounting connection part 5 of a mounting member 4 where the electronic component 1 is mounted, the electronic component 1 is positioned and loaded on the mounting member 4 so as to make both conductive adhesive material layers 7c and 7d face each other. Thus, even when a failure occurs after a conductive adhesive material is set, the electronic component 1 and the mounting member 4 are separated by dissolving the thermoplastic resin by an organic solvent and is subjected to repair. Also, the thermoplastic resin does not cause bulk destruction with respect to stress and a structure stable with respect to thermal stress which extends over a long period of time is attained. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提高电子部件的安装体的有效性。解决方案：在电子部件1的外部连接部件2和安装部件4的安装连接部件5上设置由热塑性树脂或热固性树脂构成的导电性粘接材料层7c，7d，安装电子部件1的情况下，电子部件1被定位并装载在安装部件4上，以使导电性粘接材料层7c，7d彼此面对。因此，即使在导电性粘合剂材料被固定之后发生故障，电子部件1和安装部件4通过用有机溶剂溶解热塑性树脂来分离，并进行修理。此外，热塑性树脂不会引起相对于应力的体积破坏，并且获得长时间延伸的相对于热应力稳定的结构。版权所有（C）2004，JPO

6. 发明专利

JP2001332654A MODULE PROVIDED WITH BUILT-IN ELECTRIC ELEMENT AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JP2001332654A
公开(公告)日：2001-11-30
申请号：JP2001056535
申请日：2001-03-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKATANI SEIICHI , BESSHO YOSHIHIRO , SUGAYA YASUHIRO , ONISHI KEIJI
IPC分类号： H01L23/28 , H01L21/56 , H01L21/60 , H01L23/12 , H01L23/29 , H01L23/31 , H03H3/08 , H03H9/25 , H05K3/20 , H05K3/28 , H05K3/32 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a module which is provided with built-in electric elements, such as semiconductor chips and surface acoustic wave elements, and can be thinned while being provided with mechanical strength, and to provide a manufacturing method of the module. SOLUTION: A module provided with built-in electric elements is constituted in a structure that more than two electric elements 203 are mounted on wiring patterns 201 and the elements 203 are sealed with a thermosetting resin composition 204. The upper surfaces of the elements 203 and the upper surface of the composition 204 are simultaneously polished, whereby almost the same surface is formed on the elements 203 and the composition 204. As the upper surfaces of the elements 203 are polished in a state that the elements 203 are sealed with the composition 204, the elements 203 can be thinned without damaging the elements 203. Moreover, a contamination of the elements 203 and the patterns 201 due to an abrasive liquid can be prevented.

7. 发明专利

JP2001118883A CIRCUIT BOARD, ELECTRONIC COMPONENT AND MOUNTING OF ELECTRONIC COMPONENT DEVICE 失效
公开(公告)号：JP2001118883A
公开(公告)日：2001-04-27
申请号：JP29501099
申请日：1999-10-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIRAISHI TSUKASA , KOJIMA TOSHIYUKI , BESSHO YOSHIHIRO , HATANAKA HIDEO
IPC分类号： H05K3/28 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To keep cleanliness of a circuit board or the electrode terminal parts of an electronic component and to manufacture an electronic component device of high quality and with satisfactory productivity. SOLUTION: A heat-cured resin layer 3 which covers electrode terminals 2 has insulation properties and is in a resin-cured state, is laminatedly formed on the surface of at least one side of the surfaces of a substrate 1, formed with a desired wiring pattern and the electrode terminals 2. At mounting of an electronic component, the layer 3 is utilized as a member for bonding, when the component is mounted in flip-chip manner by a face-down method.

8. 发明专利

JP2000315698A MANUFACTURE OF SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000315698A
公开(公告)日：2000-11-14
申请号：JP12445199
申请日：1999-04-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIRAISHI TSUKASA , BESSHO YOSHIHIRO , NAKATANI SEIICHI
IPC分类号： H01L23/12 , H01L21/52 , H01L21/56 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To improve the mechanical strength of the connecting section between a semiconductor element and a circuit board, by reinforcing the adhesion between the element and board with an insulating resin before injecting a sealing resin composed of an inorganic filler and a liquid thermosetting resin, by injecting the sealing resin between the element and board by utilizing a capillary phenomenon and curing the resin by heating. SOLUTION: After a conductive adhesive 3 is applied to the front end of a gold bump 2 formed on the electrode terminal 5 of a semiconductor element 1, the element 1 is mounted on a circuit board 4 on which an appropriate amount of insulating adhesive 7 containing an inorganic filler is applied to an appropriate position. From the position, the adhesive 7 does not reach the connecting section between the element 1 and board 4 in the mounting area for the element 1 by aligning the bump 2 with an electrode terminal 5 formed on the board 4. The bump 2 is electrically connected to the terminal 5 by curing the resin 3 through heat treatment which is performed at about 120 deg.C for about one hour. Then, after a sealing resin is injected between the element 1 and board 4, a semiconductor package is manufactured by curing the resin 8 by heating the resin to about 150 deg.C. In the step of injecting the sealing resin 8, the semiconductor element 1 connected to the circuit board 4 is placed on a heat generating plate 9 and the surface of the substrate 4 is heated to 60-90 deg.C by means of the plate 9.

9. 发明专利

JP2000311920A ELECTRONIC COMPONENT CONNECTING MATERIAL AND ELECTRONIC APPARATUS USING THE SAME 失效
公开(公告)号：JP2000311920A
公开(公告)日：2000-11-07
申请号：JP11784799
申请日：1999-04-26
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HASE NOBUNORI , ITAGAKI MINEHIRO , BESSHO YOSHIHIRO
IPC分类号： H01R11/01 , C09J9/02 , H01B1/00 , H01B1/02 , H01B1/22 , H01B5/16 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To obtain an electronic component connecting material, capable of stably holding electric connections even in a high temp. during heating of electronic apparatus in operation. SOLUTION: Electrodes 5 of an electronic component 4 are connected to electrodes 7 of a circuit board 6 through conductors 2 contained in an electronic component connecting material. The conductors 2 are made of grains of a thermoelastic martensite transformed alloy having an austenitic transformation end temp. lower than a max. temp. in the rated operating temp. conditions of the electronic component 4. Thus the conductors 2 have a high spring back quantity to make it difficult for poor conduction to occur at high temps.

10. 发明专利

JP2000208906A CONNECTING STRUCTURE AND MOUNTING STRUCTURE 失效
公开(公告)号：JP2000208906A
公开(公告)日：2000-07-28
申请号：JP263499
申请日：1999-01-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKEZAWA HIROTERU , ITAGAKI MINEHIRO , BESSHO YOSHIHIRO
IPC分类号： H05K3/32 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To improve mounting reliability by forming a structure for adhering a conductive adhesive from a surface of an electrode to a surface of an electrode molding around the electrode. SOLUTION: The connecting structure electrically connects an electrode 5 on a surface 4a of a board 4 of an electrode molding to a conductive adhesive 6. Further, the adhesive 6 is adhered from the electrode 5 to a board 4a of its periphery. An adhering area between the surface 4a of the board around the adhesive 6 and the adhesive 6 is larger than a surface area of the electrode 5. Further, an overall peripheral edge of the adhesive 6 is adhered to the board 4 at an outside of the electrode 5. With the constitution, the connecting structure improves its adhesive strength between the adhesive 6 and the electrode 5.

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