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    • 4. 发明专利
    • Sheet module and its manufacturing method
    • 表格模块及其制造方法
    • JP2004311788A
    • 2004-11-04
    • JP2003104553
    • 2003-04-08
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • YAMAMOTO YOSHIYUKINAKATANI SEIICHIKOJIMA TOSHIYUKI
    • H01L23/28H01L21/56H01L21/60H01L23/12H01L23/29H01L23/31
    • H01L2221/68354H01L2224/16H01L2924/01019H01L2924/01078
    • PROBLEM TO BE SOLVED: To provide a high density semiconductor built-in module having a felexible performance with an identical material used for an underfill and an insulating layer of the semiconductor, and to provide a method for manufacturing it. SOLUTION: The semiconductor built-in module has an electrically insulating layer (101) comprising a mixture of an inorganic filler and a resin, an interconnection carrier layer having at least an interonnection pattern (102) on one side of the layer (101), an interconnection pattern layer (103) on the other side, an inner via hole (104) for mutually connecting between the pattern (102) and the pattern (103), and a semiconductor (105) embedded in the electrically insulating layer, The external electrode of the semiconductor (105) is connected to the pattern (102) through a projecting electrode (106), an electrically insulating material existing between the external electrode surface of the semiconductor (105) and the interconnection carrier comprises the same material as the electrically insulating layer, and the pattern layer (103) on the layer (101) and the other side of the layer (101) forms approximately identical surface. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:提供具有与用于底部填充物和半导体的绝缘层的相同材料具有柔性性能的高密度半导体内置模块,并提供其制造方法。 解决方案:半导体内置模块具有包含无机填料和树脂的混合物的电绝缘层(101),在层的一侧至少具有连接图案(102)的互连载体层( 101),另一侧的互连图案层(103),用于在图案(102)和图案(103)之间相互连接的内部通孔(104)和嵌入电绝缘层中的半导体(105) 半导体(105)的外部电极通过突出电极(106)连接到图案(102),存在于半导体(105)的外部电极表面和互连载体之间的电绝缘材料包括相同的材料 作为电绝缘层,层(101)上的图案层(103)和层(101)的另一侧形成大致相同的表面。 版权所有(C)2005,JPO&NCIPI
    • 8. 发明专利
    • Reflow soldering apparatus and method
    • REFLOW焊接设备和方法
    • JP2008166450A
    • 2008-07-17
    • JP2006353486
    • 2006-12-27
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • OKIMOTO RIKIYAISHIMARU YUKIHIROKOJIMA TOSHIYUKIKOMYOJI DAIDO
    • H05K3/34B23K1/00B23K1/008B23K101/42
    • PROBLEM TO BE SOLVED: To provide reflow soldering apparatus and method capable of early detecting the chatter occurring in a board conveying chain.
      SOLUTION: This reflow soldering apparatus comprises a temperature control chamber 11 for adjusting the temperature environment for reflow soldering, a conveying mechanism having the board conveying chain 12 for conveying a printed circuit board 30 subjected to reflow soldering in the temperature control chamber 11, a sprocket 13 and a driving motor 14 for driving the board conveying chain 12, and a detection unit 19 for detecting any of (A) the speed or the change of the speed of the board conveying chain 12, (B) the oscillation amount or the change of the oscillation amount of the board conveying chain 12 and (C) the slack extent or the change of the slack extent of the board conveying chain 12, and outputting the result as a signal.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:提供能够及早检测板输送链中发生的颤动的回流焊接装置和方法。 该回流焊接装置包括用于调节用于回流焊接的温度环境的温度控制室11,具有用于将温度控制室11中进行回流焊接的印刷电路板30传送的板输送链条12的输送机构 ,用于驱动板传送链12的链轮13和驱动电动机14,以及用于检测(A)板传送链12的速度或速度变化的检测单元19,(B)振动量 或板输送链12的振荡量的变化和(C)板输送链12的松弛程度或松弛程度的变化,并输出结果作为信号。 版权所有(C)2008,JPO&INPIT
    • 9. 发明专利
    • Method and device for inspecting resin composition inside through-hole
    • 用于检查通孔内的树脂组合物的方法和装置
    • JP2008078291A
    • 2008-04-03
    • JP2006254312
    • 2006-09-20
    • Matsushita Electric Ind Co Ltd松下電器産業株式会社
    • ISHIMARU YUKIHIROKOJIMA TOSHIYUKIOKIMOTO RIKIYA
    • H05K3/40
    • PROBLEM TO BE SOLVED: To provide a method for inspecting via holes and wiring arranged on the surface and in the inner part of a substrate and a conductive paste filling state, in a substrate whose via holes are filled with a conductive paste, at low cost.
      SOLUTION: An inspection method includes a process for making one surface of the substrate tightly contact a heating or cooling mechanism so as to heat or cool the surface; and a process for detecting the temperature of an electrode on a second surface which is different from the heated or cooled first surface so as to determine whether a part between the electrodes arranged on both the connection surfaces is connected normally, based on the detected temperature. An inspection device of the method is also provided.
      COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提供一种检查通孔和布置在基板的内部和导电糊状填充状态中的布线的方法,在其中通孔填充有导电浆料的基板中, 以低成本。 解决方案:检查方法包括使基板的一个表面紧密接触加热或冷却机构以便加热或冷却表面的工艺; 以及用于检测与加热或冷却的第一表面不同的第二表面上的电极的温度的步骤,以便确定布置在两个连接表面上的电极之间的部分是否基于检测到的温度正常连接。 还提供了该方法的检查装置。 版权所有(C)2008,JPO&INPIT