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1. 发明专利

JP2007194516A Compound wiring board and its manufacturing method, mounted shape of electronic component, and manufacturing method 审中-公开
标题翻译：复合导线板及其制造方法，电子元器件的安装形状及制造方法
公开(公告)号：JP2007194516A
公开(公告)日：2007-08-02
申请号：JP2006013376
申请日：2006-01-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SASAKI TOMOE , SUGAYA YASUHIRO , ASAHI TOSHIYUKI
IPC分类号： H05K3/46
CPC分类号： H01L24/73 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2924/15153 , H01L2924/19105 , H01L2924/00012 , H01L2224/48227
摘要： PROBLEM TO BE SOLVED: To provide a compound wiring board which is flexibly adaptive to design alterations by easily making a substrate multi-layered at an arbitrary position, and to provide a compound wiring board having a cavity structure where circuit components can be arranged in three dimensions. SOLUTION: The compound wiring board comprises a first wiring board which has a first electric insulating base material and a wiring pattern formed on the first electric insulating base material; a second wiring board which has a second electric insulating base material and a wiring pattern formed on the second electric insulating base material, and in a part of which a cavity is formed in at least a portion of it; and a third electric insulating base material which has a conductor unit electrically connecting the wiring pattern of the first wiring board and the wiring pattern of the second wiring board, while the first wiring board and the second wiring board are bonded together along the thickness, and in a part of which a cavity is formed in at least a portion of it. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过在任意位置容易地使基板多层化而灵活地适应设计变更的复合布线板，并且提供具有空腔结构的复合布线板，其中电路部件可以是三维排列。解决方案：复合布线板包括第一布线板，其具有第一电绝缘基材和形成在第一电绝缘基材上的布线图案; 第二布线板，其具有形成在所述第二电绝缘基材上的第二电绝缘基材和布线图案，并且其一部分中的空腔形成在所述第二布线基板的至少一部分中; 以及第三电绝缘基材，其具有导电单元，所述导体单元将所述第一布线板的布线图案与所述第二布线板的布线图案电连接，同时沿着所述厚度将所述第一布线板和所述第二布线板接合在一起;以及在其一部分中，在其一部分中形成空腔。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2007073787A Circuit board with built-in solid electrolytic capacitor and method of manufacturing same 审中-公开
标题翻译：具有内置固体电解电容器的电路板及其制造方法
公开(公告)号：JP2007073787A
公开(公告)日：2007-03-22
申请号：JP2005260120
申请日：2005-09-08
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMOTO YOSHIYUKI , MIKI KATSUMASA , SUGAYA YASUHIRO
IPC分类号： H05K3/46 , H01G9/00 , H01G9/012 , H01G9/028 , H01G9/04 , H05K1/16
摘要： PROBLEM TO BE SOLVED: To provide a circuit board with a thin and high capacitance built-in solid electrolytic capacitor having highly reliable insulation. SOLUTION: In the circuit board with the built-in solid electrolytic capacitor and a built-in valve metal sheet 1 having a porous portion, the solid electrolytic capacitor is formed in a portion of the valve metal sheet 1, and the porous portion 2 in the region of the valve metal sheet 1 wherein the solid electrolytic capacitor is not formed is filled with an insulating layer 3 consisting of a cured material of a liquid resin, and the solid electrolytic capacitor and the wiring pattern 4 of the circuit board are electrically connected together. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为电路板提供具有高可靠绝缘性的薄而高电容的内置固体电解电容器。
解决方案：在具有内置固体电解电容器的电路板和具有多孔部分的内置阀金属片1中，固体电解电容器形成在阀金属片1的一部分中，并且多孔在没有形成固体电解电容器的阀金属片1的区域中填充有由液体树脂的固化物构成的绝缘层3，并且固体电解电容器和电路板的布线图案4 电连接在一起。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006245191A Circuit board with built-in component and manufacturing method thereof 审中-公开
标题翻译：具有内置组件的电路板及其制造方法
公开(公告)号：JP2006245191A
公开(公告)日：2006-09-14
申请号：JP2005057239
申请日：2005-03-02
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUGAYA YASUHIRO , HONJO KAZUHIKO , MORI TOSHIHIKO , KAWAMOTO EIJI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent warp of a circuit board with built-in components in manufacture of the same.
SOLUTION: The circuit board with built-in components comprises a circuit board 1, integrated elements 2, 3 mounted on one surface side of the circuit board 1, a first protecting plate 4 laminated in one surface side of the circuit board 1, and a second protecting plate 5 laminated in the opposite side of the circuit board 1 of the first protecting plate 4. The circuit board 1 is formed of a base material and a resin. The first protecting plate 4 is formed of a resin covering the integrated elements 2, 3 and a resin including a base material surrounding the external circumference of the integrated elements 2, 3. The second preventing plate 5 comprises a metal reinforcing surface 10 provided in the side of the first protecting plate 4 and a metal shielding surface 11 provided in the opposite side of the first preventing plate 4. The metal reinforcing surface 10 is formed thicker than the metal shielding surface 11.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了防止在其制造中内置组件的电路板翘曲。解决方案：具有内置部件的电路板包括电路板1，安装在电路板1的一个表面侧的集成元件2,3，层压在电路板1的一个表面侧的第一保护板4 以及层压在第一保护板4的电路板1的相对侧的第二保护板5.电路板1由基材和树脂形成。第一保护板4由覆盖集成元件2,3的树脂和包括围绕一体元件2,3的外周的基材的树脂形成。第二防止板5包括金属加强面10，第一保护板4的侧面和设置在第一防止板4的相对侧的金属屏蔽面11.金属加强面10形成为比金属屏蔽面11更厚。（C）2006， JPO＆NCIPI

4. 发明专利

JP2005234557A Optical transmission line substrate and its manufacturing method, substrate with built-in optical transmission line and its manufacturing method, and data processor 审中-公开
标题翻译：光传输线路基板及其制造方法，具有内置光传输线的基板及其制造方法和数据处理器
公开(公告)号：JP2005234557A
公开(公告)日：2005-09-02
申请号：JP2005014743
申请日：2005-01-21
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： KARASHIMA YASUHARU , NAKATANI SEIICHI , SUGAYA YASUHIRO , ASAHI TOSHIYUKI , ICHIYANAGI TAKASHI
IPC分类号： G02B6/42
摘要： PROBLEM TO BE SOLVED: To provide the manufacturing method of optical transmission line substrate, with which the optical transmission line substrate can be manufactured at a simpler manufacturing process, or the substrate does not need an aligning process or it can be manufactured at a reduced aligning processes. SOLUTION: The method for manufacturing the optical transmission line substrate includes: a first step in which a layer including an electrically conductive material is formed on a substrate 40; and a second step in which a wiring pattern 15 is formed, at least a part of which is for an electrical circuit and a part of which is for positional control of the optical transmission line, by patterning the layer that is formed on the substrate 40 and that includes the electrically conductive material. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供光传输线路基板的制造方法，可以在更简单的制造工艺中制造光传输线基板，或者基板不需要对准工艺，或者可以在减少对齐过程。光传输线基板的制造方法包括：在基板40上形成有包含导电材料的层的第一工序; 以及第二步骤，其中形成布线图案15，其中至少一部分用于电路，并且其一部分用于光传输线路的位置控制，通过对形成在基板40上的层进行图案化并且其包括导电材料。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2004319976A Transfer sheet, and wiring board using the same and fabrication method thereof 审中-公开
公开(公告)号：JP2004319976A
公开(公告)日：2004-11-11
申请号：JP2004075108
申请日：2004-03-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SUGAYA YASUHIRO , ISHITOMI HIROYUKI , NAKATANI SEIICHI
IPC分类号： H05K3/20 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a sheet of transfer sheet for improving a transferring ability, for achieving a low temperature transferring, and for improving a size stability and via connection stability, and the wiring board using the same and the fabrication method thereof.
SOLUTION: The transfer sheet 100 according to the present invention includes a resign film 101 having a 60°C or more glass-transition temperature; a silicon resin layer 103 formed on the silicon resin film 101; a metal wiring pattern 104 formed on the silicon resin layer 103. The exposed surface of the metal wiring pattern 104 is roughened surface, the surface roughness of ten-point mean roughness (Rz)is equal to 2 μm or more, and the surface roughness (Rz) of the surface of the metal wiring pattern 104 contacting to the silicon resin layer 103 is lower than that of the exposed surface.
COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2004193392A Circuit component incorporating module and its manufacturing method 审中-公开
标题翻译：电路组件及其制造方法
公开(公告)号：JP2004193392A
公开(公告)日：2004-07-08
申请号：JP2002360535
申请日：2002-12-12
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： ISHITOMI HIROYUKI , SUGAYA YASUHIRO , HIRANO KOICHI , NAKATANI SEIICHI
IPC分类号： H05K3/38 , H01L23/12 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a circuit component incorporating module which can mount a circuit component in high density and has high reliability, and its manufacturing method.
SOLUTION: A structural body is provided with a wiring board 1, an intermediate board 2 and an inner via 5 to electrically connect a wiring pattern 3 with a circuit component 4 mounted on the wiring pattern 3 formed on at least the main surface of the wiring board, the upper and lower surfaces of the intermediate board 2 are pinched by the wiring boards 1 and the upper and lower surfaces are roughened. In such a structure, the wiring pattern is roughened, permitting highly dense mounting of the circuit component.
COPYRIGHT: (C)2004,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以高密度地安装电路部件并且具有高可靠性的电路部件并入模块及其制造方法。解决方案：结构体设置有布线板1，中间板2和内通孔5，以将布线图案3与安装在至少形成在主表面上的布线图案3上的电路部件4电连接在布线基板1上，中间基板2的上表面和下表面被布线板1夹住，上表面和下表面被粗糙化。在这种结构中，布线图案被粗糙化，允许电路部件的高密度安装。版权所有（C）2004，JPO＆NCIPI

7. 发明专利

JP2004086185A Optoelectric hybrid wiring module having light emitting and receiving elements built in, and its manufacturing method and its package 有权
公开(公告)号：JP2004086185A
公开(公告)日：2004-03-18
申请号：JP2003181700
申请日：2003-06-25
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： IWAKI HIDEKI , TAGUCHI YUTAKA , OGURA TETSUYOSHI , SUGAYA YASUHIRO , ASAHI TOSHIYUKI , NISHIYAMA TOSAKU , IDOKAWA YOSHINOBU
IPC分类号： G02B6/122 , G02B6/13 , H01L31/12
摘要： PROBLEM TO BE SOLVED: To provide an optoelectric hybrid wiring module with built-in light emitting and receiving elements which can optically couple an optical element and an optical waveguide with each other without using any optical element such as a reflecting mirror, and its manufacturing method and its package. SOLUTION: The optoelectric hybrid wiring modules with the built-in light emitting and receiving elements includes an optical waveguide layer (104) including a core part (105) and a clad part (106), 1st and 2nd wiring patterns (121a, 121b, 121c) formed on at least one main surface of the optical waveguide layer (104), the light receiving element (101) which is arranged in the core part (105) of the optical waveguide layer, optically connected to the 1st wiring pattern, and electrically connected to the 1st wiring pattern, and the light emitting element (103) which is arranged in the optical waveguide layer, optically connected to the core part (105) of the optical waveguide layer, and electrically connected to the 2nd wiring pattern. COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2004055967A Manufacturing method of board with built-in electronic component 审中-公开
公开(公告)号：JP2004055967A
公开(公告)日：2004-02-19
申请号：JP2002213742
申请日：2002-07-23
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMOTO YOSHIYUKI , NAKATANI SEIICHI , SUGAYA YASUHIRO , ASAHI TOSHIYUKI , KOMATSU SHINGO , KAWAMOTO EIJI
IPC分类号： H05K1/18 , H01L23/12 , H05K3/46
CPC分类号： H01L2224/16225 , H01L2224/81 , H01L2924/19105
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a board with built-in electronic components capable of easily incorporating electronic components to a circuit board. SOLUTION: In the manufacturing method of the board with the built-in electronic components, an external connection electrode forming face of the electronic component 102 is directed upward and the external connection electrode forming face is pushed to a first electric insulating sheet 901b until the external connection electrode forming face is nearly flush with the surface of the first electric insulating sheet 901b. A second electric insulating sheet 901a is placed opposite to an electronic component embedded face of the sheet 901b so as to press conductor paste 905 of the sheet 901a into contact with an external connection electrode. Heat and pressure is applied to both the sheets 901b, 901a placed opposite to each other to integrate both the sheets. A conductive projection 105A is formed to the conductor paste 905 exposed on the surface of the second electric insulating sheet of both the integrated sheets 901b, 901a. COPYRIGHT: (C)2004,JPO

9. 发明专利

JP2003197849A MODULE WITH BUILT-IN COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
公开(公告)号：JP2003197849A
公开(公告)日：2003-07-11
申请号：JP2002301043
申请日：2002-10-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： ASAHI TOSHIYUKI , SUGAYA YASUHIRO , KOMATSU SHINGO , YAMAMOTO YOSHIYUKI , NAKATANI SEIICHI
IPC分类号： H01L23/12 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To enable a mounting test and a characteristics test before components are built in and thereby to increase an yield and the overall strength by embedding the components in an electrical insulation layer integrally with a wiring board. SOLUTION: A module with built-in components includes an electrical insulation layer (101), interconnections (102 and 106) integrated on both surfaces of the electrical insulation layer (101), vias (103) for connecting the interconnections (102 and 106), and at least one component (104) selected among electronic components and semiconductors being embedded in the electrical insulation layer (101). Out of the interconnections (102 and 106), at least one interconnection is constituted of the interconnection (106) formed on the surface of a wiring board (109). The component (104) embedded in the electrical insulation layer (101) is mounted on the wiring board integrally with it before embedded. COPYRIGHT: (C)2003,JPO

10. 发明专利

JP2003078250A Module incorporating component and manufacturing method thereof 审中-公开
标题翻译：模块组装及其制造方法
公开(公告)号：JP2003078250A
公开(公告)日：2003-03-14
申请号：JP2001267058
申请日：2001-09-04
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： YAMAMOTO YOSHIYUKI , ASAHI TOSHIYUKI , SUGAYA YASUHIRO , KOMATSU SHINGO , NAKATANI SEIICHI
IPC分类号： H05K1/02 , H01L25/00 , H01L25/04 , H01L25/18 , H05K3/46
CPC分类号： H01L2224/16225
摘要： PROBLEM TO BE SOLVED: To provide a reliable module incorporating components suited for high-density packaging, and to provide a method for manufacturing the module.
SOLUTION: The module has an electric insulating layer 101 using a thermosetting resin as a main constituent, a plurality of wiring layers 102 existing in and/or on the surface of the electric insulating layer 101, a semiconductor 103 and/or circuit components that is buried in the insulating layer 101, and a via 104 for connecting the wiring layers 102. At a portion from the position of the via 104 to a position where the semiconductor 103 and/or a circuit component section is buried, a protection body 105 is provided, where the protection body 105 protects the via 104 from the flow of resin when the semiconductor 103 and/or circuit components are to be buried in the electric insulating layer 101.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供一种包含适用于高密度封装的部件的可靠模块，并提供一种制造该模块的方法。解决方案：该模块具有使用热固性树脂作为主要成分的电绝缘层101，存在于电绝缘层101的表面中和/或表面上的多个布线层102，半导体103和/或电路部件掩埋在绝缘层101中的通孔104和用于连接布线层102的通孔104.在从通孔104的位置到半导体103和/或电路部件部分被埋置的位置的部分，保护体105是其中当半导体103和/或电路部件被埋在电绝缘层101中时，保护体105保护通孔104免受树脂流动的影响。

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