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1. 发明专利

JPS60123100A DEVICE FOR SUPPLYING ELECTRONIC PART 失效
公开(公告)号：JPS60123100A
公开(公告)日：1985-07-01
申请号：JP23175283
申请日：1983-12-08
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MORIMOTO YOSHIROU , MATSUZAKI TAKASHI , AISAKA SHIGERU , OOMORI TOMOHIRO , SAWADA MITSUO
IPC分类号： H05K13/02 , B65G47/08 , B65G47/84

2. 发明专利

JPS59199169A Device for soldering spherically tip of lead wire 失效
标题翻译：用于焊接电线的手段
公开(公告)号：JPS59199169A
公开(公告)日：1984-11-12
申请号：JP7443183
申请日：1983-04-27
申请人： Matsushita Electric Ind Co Ltd
发明人： MORIMOTO YOSHIROU , TANIZAKI TOSHIO , SAWADA SEIICHI , TANAKA MASAAKI , MAEDA MASAAKI
IPC分类号： B23K3/04 , B23K1/00 , B23K3/06
CPC分类号： B23K3/0623
摘要： PURPOSE:To improve workability and to stabilize the diameter of a solder ball by coating a specified amt. of cream solder on a conveying belt by a coating section for a specified amt. of solder, melting the cream solder in a heat source section and sticking the molten solder to the tip of a lead wire conveyed from a lead wire conveying section. CONSTITUTION:A titled device is constituted of a conveying belt feed section 1 which feeds a conveying belt 2, a solder coating section 7 which coats a specified amt. of cream solder 8 on the belt 2 fed from the section 1, a heat source section 13 which melts the coated cream solder 10, a lead wire conveying section 14 which approaches the tip of a lead wire 14A to the molten cream solder 10 and a roller 16 which conducts the belt 2 to a conveying belt housing section 17.
摘要翻译：目的：提高可加工性，并通过涂覆规定来稳定焊球的直径。的奶油焊料在输送带上通过涂层部分达到规定的长度。的焊料熔化在热源部分中的膏状焊料，并将熔融的焊料粘附到从引线输送部分输送的引线的末端。构成：标题装置由输送带2输送输送带2，涂布指定的焊料涂布部7构成。从部分1供给的带2上的奶油焊料8，熔化涂覆的奶油焊料10的热源部分13，接触导线14A的尖端的熔丝奶油焊料10的引线输送部分14和辊子16将带2传送到输送带收纳部分17。

3. 发明专利

JPS55115237A MANUFACTURING METHOD AND DEVICE OF FLASH DISCHARGE TUBE 失效
公开(公告)号：JPS55115237A
公开(公告)日：1980-09-05
申请号：JP2159679
申请日：1979-02-26
申请人： WEST ELECTRIC CO , MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKANO KUNIHARU , KANBARA MASAO , MORIMOTO YOSHIROU , NISHIGUCHI OSATSUGU
IPC分类号： H01J9/28 , H01J9/02 , H01J9/36 , H01J9/46
摘要： PURPOSE:To provide automation of finishing processes, by executing bar electrodes on one side after another while holding the flash discharge tube with a special jig. CONSTITUTION:Each flash discharge tube 2, made with a rare gas-filled glass tube and electrodes 2a, 2b sealed on both ends, is inserted in a hole 3 of a jig 1, the hole 3 being composed of a spring 4 and elastic matter (rubber) 5 for absorbing shock of cutting. After being cut at even length, the electrodes 2a on one side undergo electrolytic polishing, cleaning, drying, flux coating and preliminary soldering. The jig 1 is then turned to go through the same course of processing the electrodes 2b on the other side. The discharge tube 1 thus finished is removed from the jig 1. The turning of the jig and adequate positioning of working machines at each process can automate the tube finishing with a simple control system.

4. 发明专利

JPS54111664A SUSPENSION TYPE CONVEYING APPARATUS 失效
公开(公告)号：JPS54111664A
公开(公告)日：1979-09-01
申请号：JP1892778
申请日：1978-02-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA YOSHIAKI , MORIMOTO YOSHIROU , TANABE TAKETO , YAMASHITA EIJI
IPC分类号： H05K13/02 , B65G15/58

5. 发明专利

JPS5941850A Wafer chip feeding device 失效
标题翻译：滤芯输送装置
公开(公告)号：JPS5941850A
公开(公告)日：1984-03-08
申请号：JP15301582
申请日：1982-09-02
申请人： Matsushita Electric Ind Co Ltd
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , ITOU AKINORI , HARAZONO KOUHEI , KONISHI MOTOYUKI , ENOMOTO YOSHINARI
IPC分类号： H01L21/677 , H01L21/00 , H01L21/67 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/68 , H01L2221/68322
摘要： PURPOSE:To make it possible to feed many kinds of wafer chips having different sizes, by selecting a sucking pin, which sucks the wafer chip and a pushing pin, which pushed up the wafer chip. CONSTITUTION:In correspondence with the size of a wafer chip 10 to be picked up, a sucking pin 13 and a pushing pin 16 are selected based on the instruction of a computer. By the driving of a cam, the sucking pin 13 is directed to the wafer chip 10 from the upper side and the pushing pin 16 is directed from the lower side. The wafer chip 10 is pushed by the pushing pin 16 and sucked by the vacuum sucking through a hole 13a of the sucking pin 13. Then only one wafer chip 10 is separated from a tacky tape 8. When the wafer chip 10 is lifted to a certain height, the pushing pin 16 is stopped, and the wafer chip 10 is held only by the sucking pin 13. The wafer chip 10 is moved to the upper part of a positioning table by the movement of a sucking pin slider. The pushing pin 16 is returned to the lower side. Finally, the wafer chip 10 is fed on the positioning table by the sucking pin 13.
摘要翻译：目的：通过选择吸引晶片芯片的吸引销和推动晶片芯片的推销，可以供给多种不同尺寸的晶片芯片。构成：根据要拾取的晶片10的尺寸，基于计算机的指示来选择吸引销13和推动销16。通过驱动凸轮，吸引销13从上侧被引导到晶片芯片10，并且推压销16从下侧被引导。晶片芯片10被推压销16推压，并通过吸引销13的孔13a进行真空抽吸而吸引。然后只有一个晶片芯片10与粘性带8分离。当将晶片芯片10提升到一定的高度，推动销16停止，并且晶片芯片10仅由吸引销13保持。晶片芯片10通过吸引销滑块的移动而移动到定位台的上部。推销16返回到下侧。最后，晶片芯片10由吸引销13供给到定位台上。

6. 发明专利

JPS59169144A Eutectic bonding device of semiconductor chip 失效
标题翻译：半导体芯片的保护性接合装置
公开(公告)号：JPS59169144A
公开(公告)日：1984-09-25
申请号：JP4354383
申请日：1983-03-16
申请人： Matsushita Electric Ind Co Ltd
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , ITOU AKINORI , HARAZONO KOUHEI , KONISHI MOTOYUKI , ENOMOTO YOSHINARI
IPC分类号： H01L21/52 , H01L21/58
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/8319 , H01L2224/8385 , H01L2924/01039 , H01L2924/01322 , H01L2924/07802
摘要： PURPOSE:To enable to bond semiconductor chips of many types, different shapes and sizes by one device by selectively providing a collet in which various types of semiconductor chips are matched, and providing a scrubbing mechanism capable of vibrating. CONSTITUTION:Semiconductor chips 24 are selected in shape and size, vacuum- adsorbed by a collet 1 moved by an X-Y table 22, moved to the specified position on a substrate 26 heated and positioned on a heat plate 25, rotated by a selection cam 8 by the operation of a lever 11, a collet shaft 2 is moved down by the force of a load spring 5, and contacted with the substrate 26. When the chips 24 are small, a scrubbing cam 20 is moved by an air cylinder 21, a collect shaft 2 is vibrated through a cam follower 19, the chips 24 are rubbed on the substrate 26 under the prescribed pressure, the production of eutectic alloy is accelerated, and the chips 24 are effectively secured to the substrate 26.
摘要翻译：目的：通过选择性地提供其中各种类型的半导体芯片匹配的夹头，并且提供能够振动的擦洗机构，能够通过一个装置使多种类型，不同形状和尺寸的半导体芯片结合。构成：选择半导体芯片24的形状和尺寸，通过由XY工作台22移动的夹头1进行真空吸附，移动到被加热并定位在加热板25上的基板26上的指定位置，由选择凸轮8旋转通过杠杆11的操作，夹头轴2被负载弹簧5的力向下移动，并与基板26接触。当芯片24小时，擦洗凸轮20被气缸21移动，收集轴2通过凸轮从动件19振动，芯片24在规定压力下摩擦在基板26上，加速了共晶合金的生成，芯片24有效地固定在基板26上。

7. 发明专利

JPS5850310A ADSORBING PAD 失效
公开(公告)号：JPS5850310A
公开(公告)日：1983-03-24
申请号：JP14763881
申请日：1981-09-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , TANAKA MASAAKI
IPC分类号： B65H5/14 , B65H3/08 , B65H5/08 , B66C1/00 , B66C1/02 , F16B47/00

8. 发明专利

JPS56160001A METHOD OF INDICATING COLOR CODE FOR ELECTRONIC PART 失效
公开(公告)号：JPS56160001A
公开(公告)日：1981-12-09
申请号：JP5204980
申请日：1980-04-18
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOO TOSHIROU , KOBAYASHI YASUHARU , YOSHIDA YOSHIAKI , MORIMOTO YOSHIROU , OOMORI TOMOHIRO
IPC分类号： H01C1/04 , H01G2/24 , H01G13/00

9. 发明专利

JPS59145506A Chip resistor laser trimming device 失效
标题翻译：芯片电阻激光切割装置
公开(公告)号：JPS59145506A
公开(公告)日：1984-08-21
申请号：JP2022583
申请日：1983-02-08
申请人： Matsushita Electric Ind Co Ltd
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , TANAKA MASUMI , KAKEE SHIGEO
IPC分类号： H01C17/242 , H01C17/24 , H01L27/01

10. 发明专利

JPS58138100A METHOD AND DEVICE FOR TAPING CHIP PART 失效
公开(公告)号：JPS58138100A
公开(公告)日：1983-08-16
申请号：JP1999182
申请日：1982-02-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SATOU TAKASHI , MORIMOTO YOSHIROU , YAMADA TAKESHI , EGASHIRA HIRONOBU , HARAZONO KOUHEI
IPC分类号： B65B15/04 , B65D73/02 , H05K13/00

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