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1. 发明专利

JPS5941850A Wafer chip feeding device 失效
标题翻译：滤芯输送装置
公开(公告)号：JPS5941850A
公开(公告)日：1984-03-08
申请号：JP15301582
申请日：1982-09-02
申请人： Matsushita Electric Ind Co Ltd
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , ITOU AKINORI , HARAZONO KOUHEI , KONISHI MOTOYUKI , ENOMOTO YOSHINARI
IPC分类号： H01L21/677 , H01L21/00 , H01L21/67 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/68 , H01L2221/68322
摘要： PURPOSE:To make it possible to feed many kinds of wafer chips having different sizes, by selecting a sucking pin, which sucks the wafer chip and a pushing pin, which pushed up the wafer chip. CONSTITUTION:In correspondence with the size of a wafer chip 10 to be picked up, a sucking pin 13 and a pushing pin 16 are selected based on the instruction of a computer. By the driving of a cam, the sucking pin 13 is directed to the wafer chip 10 from the upper side and the pushing pin 16 is directed from the lower side. The wafer chip 10 is pushed by the pushing pin 16 and sucked by the vacuum sucking through a hole 13a of the sucking pin 13. Then only one wafer chip 10 is separated from a tacky tape 8. When the wafer chip 10 is lifted to a certain height, the pushing pin 16 is stopped, and the wafer chip 10 is held only by the sucking pin 13. The wafer chip 10 is moved to the upper part of a positioning table by the movement of a sucking pin slider. The pushing pin 16 is returned to the lower side. Finally, the wafer chip 10 is fed on the positioning table by the sucking pin 13.
摘要翻译：目的：通过选择吸引晶片芯片的吸引销和推动晶片芯片的推销，可以供给多种不同尺寸的晶片芯片。构成：根据要拾取的晶片10的尺寸，基于计算机的指示来选择吸引销13和推动销16。通过驱动凸轮，吸引销13从上侧被引导到晶片芯片10，并且推压销16从下侧被引导。晶片芯片10被推压销16推压，并通过吸引销13的孔13a进行真空抽吸而吸引。然后只有一个晶片芯片10与粘性带8分离。当将晶片芯片10提升到一定的高度，推动销16停止，并且晶片芯片10仅由吸引销13保持。晶片芯片10通过吸引销滑块的移动而移动到定位台的上部。推销16返回到下侧。最后，晶片芯片10由吸引销13供给到定位台上。

2. 发明专利

JPS58138100A METHOD AND DEVICE FOR TAPING CHIP PART 失效
公开(公告)号：JPS58138100A
公开(公告)日：1983-08-16
申请号：JP1999182
申请日：1982-02-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SATOU TAKASHI , MORIMOTO YOSHIROU , YAMADA TAKESHI , EGASHIRA HIRONOBU , HARAZONO KOUHEI
IPC分类号： B65B15/04 , B65D73/02 , H05K13/00

3. 发明专利

JPS5671411A RUBBER STRIPPING DEVICE FOR RUBBER CORD 失效
公开(公告)号：JPS5671411A
公开(公告)日：1981-06-15
申请号：JP14730379
申请日：1979-11-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TANIZAKI TOSHIO , TANAKA MASAAKI , HARAZONO KOUHEI , MORIKAWA ISAO
IPC分类号： H02G1/12

4. 发明专利

JPS59169144A Eutectic bonding device of semiconductor chip 失效
标题翻译：半导体芯片的保护性接合装置
公开(公告)号：JPS59169144A
公开(公告)日：1984-09-25
申请号：JP4354383
申请日：1983-03-16
申请人： Matsushita Electric Ind Co Ltd
发明人： TANIZAKI TOSHIO , MORIMOTO YOSHIROU , ITOU AKINORI , HARAZONO KOUHEI , KONISHI MOTOYUKI , ENOMOTO YOSHINARI
IPC分类号： H01L21/52 , H01L21/58
CPC分类号： H01L24/83 , H01L24/75 , H01L2224/8319 , H01L2224/8385 , H01L2924/01039 , H01L2924/01322 , H01L2924/07802
摘要： PURPOSE:To enable to bond semiconductor chips of many types, different shapes and sizes by one device by selectively providing a collet in which various types of semiconductor chips are matched, and providing a scrubbing mechanism capable of vibrating. CONSTITUTION:Semiconductor chips 24 are selected in shape and size, vacuum- adsorbed by a collet 1 moved by an X-Y table 22, moved to the specified position on a substrate 26 heated and positioned on a heat plate 25, rotated by a selection cam 8 by the operation of a lever 11, a collet shaft 2 is moved down by the force of a load spring 5, and contacted with the substrate 26. When the chips 24 are small, a scrubbing cam 20 is moved by an air cylinder 21, a collect shaft 2 is vibrated through a cam follower 19, the chips 24 are rubbed on the substrate 26 under the prescribed pressure, the production of eutectic alloy is accelerated, and the chips 24 are effectively secured to the substrate 26.
摘要翻译：目的：通过选择性地提供其中各种类型的半导体芯片匹配的夹头，并且提供能够振动的擦洗机构，能够通过一个装置使多种类型，不同形状和尺寸的半导体芯片结合。构成：选择半导体芯片24的形状和尺寸，通过由XY工作台22移动的夹头1进行真空吸附，移动到被加热并定位在加热板25上的基板26上的指定位置，由选择凸轮8旋转通过杠杆11的操作，夹头轴2被负载弹簧5的力向下移动，并与基板26接触。当芯片24小时，擦洗凸轮20被气缸21移动，收集轴2通过凸轮从动件19振动，芯片24在规定压力下摩擦在基板26上，加速了共晶合金的生成，芯片24有效地固定在基板26上。

5. 发明专利

JPS552564A TAPING PARTS CONVEYOR 失效
公开(公告)号：JPS552564A
公开(公告)日：1980-01-10
申请号：JP7604878
申请日：1978-06-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOSHIDA YOSHIAKI , OKASAKA KEIZOU , NEGISHI SHIGEFUSHI , HARAZONO KOUHEI , YAMASHITA EIJI
IPC分类号： B65H20/22
摘要： PURPOSE:To facilitate the replacement of taping parts and make a taping parts conveyor compact, by providing a slide block in a fixed block so that the slide block slides back and forth. CONSTITUTION:A recess 17 is provided on the fixed block 15 having a groove 16. The slide block 19 is fitted in the recess 17 and guided by a guide shaft 18. The rod 23 of a cylinder 22 is coupled to one end of the slide block 19. A similar groove 24 is provided on a taping parts conveyance side of the slide block 19. Several levers 28, each of which has one end coupled to a support shaft 25 and has a feed pin 26 on the conveying face of the other end and is fitted at the latter end with a spring 27 for pushing the feed pin 26 out of the conveying face, are provided in the grooves 16, 24.

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