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1. 发明专利

JP2014082455A Flexible board and board connection structure 有权
标题翻译：柔性板和板连接结构
公开(公告)号：JP2014082455A
公开(公告)日：2014-05-08
申请号：JP2013158235
申请日：2013-07-30
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SHIRAO MIZUKI , OHATA NOBUO , YASUI NOBUYUKI , ARIGA HIROSHI
IPC分类号： H05K1/02 , H05K3/46
CPC分类号： H05K1/118 , H01P3/003 , H01P3/081 , H01P5/028 , H05K1/0245 , H05K1/0251 , H05K1/0253 , H05K3/363 , H05K2201/09181 , H05K2201/09481 , H05K2201/09609 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
摘要： PROBLEM TO BE SOLVED: To obtain a flexible board capable of achieving a low reflection connection with a printed wiring board, and to obtain a board connection structure using the same.SOLUTION: The flexible board comprises a terminal part for obtaining electrical connection with a printed wiring board. The terminal part has: a first signal pad 1 formed on a first conductor layer 51 and electrically isolated from a ground layer 2; a pair of first ground pads 3 formed on the first conductor layer 51 so as to sandwich the first signal pad 1 therebetween and connected to the ground layer 2; a second signal pad 5 formed on a second conductor layer 52 and connected to a signal line 4; a pair of second ground pads 6 formed on the second conductor layer 52 so as to sandwich the second signal pad 5 therebetween and electrically isolated from the signal line 4; a third signal pad 7 formed on a third conductor layer 53; and a pair of third ground pads 8 formed on the third conductor layer 53 so as to sandwich the third signal pad 7 therebetween. The second signal pad 5 is wider than the third signal pad 7.
摘要翻译：要解决的问题：获得能够实现与印刷线路板的低反射连接的柔性板，并获得使用其的板连接结构。解决方案：柔性板包括用于获得与打印的电连接的端子部分接线板端子部具有：形成在第一导体层51上并与接地层2电绝缘的第一信号焊盘1; 一对第一接地焊盘3，形成在第一导体层51上，以将第一信号垫1夹在其间并连接到接地层2; 形成在第二导体层52上并连接到信号线4的第二信号焊盘5; 形成在第二导体层52上的一对第二接地焊盘6，以将第二信号焊盘5夹在其间并与信号线4电绝缘; 形成在第三导体层53上的第三信号焊盘7; 以及形成在第三导体层53上以将第三信号垫7夹在其间的一对第三接地焊盘8。第二信号垫5比第三信号垫7宽。

2. 发明专利

JP2006253569A Flexible wiring board and semiconductor device using the same 审中-公开
标题翻译：柔性布线板及使用其的半导体器件
公开(公告)号：JP2006253569A
公开(公告)日：2006-09-21
申请号：JP2005070959
申请日：2005-03-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： HAMAGUCHI TSUNEO , ARIGA HIROSHI , KONDO TERUHIRO , SUGIDACHI ATSUSHI
IPC分类号： H05K1/14 , H05K1/02 , H05K1/11
摘要： PROBLEM TO BE SOLVED: To provide a flexible wiring board wherein soldering connection can be applied to its wires in a way of preventing their adjacent wires from being short-circuited even when pitches of a wiring pattern are minute, thereby downsizing a semiconductor device.
SOLUTION: The flexible wiring board 1 soldered to electric components or a wiring board is provided, wherein soldering connection terminals 21 of the flexible wiring board 1 are formed on one side of its insulation film 3; and conductor members 22 are provided on a side (a second side of the insulation film) opposite to the side of the insulation film 3 (a first side of the insulation film), on which the connection terminals 21 are provided along the connection terminals 21 in a way opposite to the connection terminals 21 such that the insulation film 3 is sandwiched between the conductor members 3 and the connection terminals 21.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供柔性布线板，其中即使在布线图案的间距很小的情况下，也可以以防止其相邻布线短路的方式将焊接连接施加于其布线，从而使半导体设备。解决方案：提供焊接到电气部件或布线板的柔性布线板1，其中柔性布线板1的焊接连接端子21形成在其绝缘膜3的一侧上; 并且导体构件22设置在与绝缘膜3的一侧（绝缘膜的第一侧）相对的一侧（绝缘膜的第二侧）上，连接端子21沿着连接端子21设置以连接端子21相对的方式使得绝缘膜3夹在导体构件3和连接端子21之间。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2006216839A Optical module 有权
标题翻译：光学模块
公开(公告)号：JP2006216839A
公开(公告)日：2006-08-17
申请号：JP2005029112
申请日：2005-02-04
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ARIGA HIROSHI
IPC分类号： H01S5/022
CPC分类号： H01S5/02276 , H01L2224/48091 , H01L2224/48227 , H01L2924/19107 , H01S5/02212 , H01S5/02248 , H01S5/0427 , H01S5/06226 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide an optical module having a low consumption power wherein the degradation of its signal reflecting characteristic (the increase of its reflecting quantity) can be so suppressed even though making small the value of its matching resistance provided for its impedance matching that it requires no special component and it is excellent in its high-frequency characteristic suitable to its miniaturization. SOLUTION: A matching resistance 11 formed out of a thin-film resistance and a capacitor 12 (inter-digital type capacitor) so formed as to combine with each other conductor patterns in the form of comb teeth are disposed on a sub-mount 7 for mounting thereon a laser diode 8 (LD element) in the optical module. Further, the value of the matching resistance 11 is so set to a value smaller than the one obtained by subtracting the differential resistance value of the LD element 8 from the characteristic impedance of a signal source of the optical module as to improve its signal reflecting characteristic by adjusting the capacity of the capacitor. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种具有低功率消耗功率的光模块，其信号反射特性的劣化（其反射量的增加）可被如此抑制，即使将其匹配电阻的值设定为其阻抗匹配不需要特殊部件，其高频特性优于其小型化。解决方案：由薄膜电阻形成的匹配电阻11和形成为以梳齿形状彼此结合的导体图案形成的电容器12（数字型间电容器）安装件7用于在光学模块中安装激光二极管8（LD元件）。此外，匹配电阻11的值被设定为小于通过从光学模块的信号源的特性阻抗中减去LD元件8的差分电阻值而获得的值，以提高其信号反射特性通过调整电容器的容量。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005252783A Optical transmitter 审中-公开
标题翻译：光学发射器
公开(公告)号：JP2005252783A
公开(公告)日：2005-09-15
申请号：JP2004062089
申请日：2004-03-05
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YAMADA KAZUYOSHI , ARIGA HIROSHI
IPC分类号： H01S5/068 , H04B10/07 , H04B10/2507 , H04B10/40 , H04B10/50 , H04B10/516 , H04B10/58 , H04B10/60 , H04B10/04 , H04B10/02 , H04B10/06 , H04B10/14 , H04B10/18 , H04B10/26 , H04B10/28
摘要： PROBLEM TO BE SOLVED: To secure a predetermined eye mask margin in an optical transmitter without depending on a transmission speed. SOLUTION: The optical transmitter includes a semiconductor laser drive circuit 1, and a semiconductor laser 4 for generating and outputting modulated laser light based on the modulation current of the semiconductor laser drive circuit 1. In the above optical transmitter, a phase difference adjustment circuit 2 is provided in the pre-stage of the semiconductor laser drive circuit 1, so as to reduce a phase difference produced between data signals. The phase difference adjustment circuit 2 includes an impedance control line 5, a resistor element 7 having a parasitic inductance component (or an inductor having a parasitic resistance component), and a DC cutoff capacitor 8. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了确保光发射机中的预定眼罩余量而不依赖于传输速度。解决方案：光发射机包括半导体激光器驱动电路1和半导体激光器4，用于基于半导体激光器驱动电路1的调制电流产生和输出调制激光。在上述光发射机中，相位差调整电路2设置在半导体激光器驱动电路1的前级，以便减少数据信号之间产生的相位差。相位差调节电路2包括阻抗控制线5，具有寄生电感分量（或具有寄生电阻分量的电感器）的电阻元件7和直流截止电容器8.（C）2005年， JPO＆NCIPI

5. 发明专利

JP2005191088A Package for semiconductor and semiconductor device 有权
标题翻译：半导体和半导体器件封装
公开(公告)号：JP2005191088A
公开(公告)日：2005-07-14
申请号：JP2003427766
申请日：2003-12-24
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： SAKAI KIYOHIDE , ARIGA HIROSHI
IPC分类号： H01L23/02 , H01L23/04 , H01S5/022
CPC分类号： H01L2924/19107
摘要： PROBLEM TO BE SOLVED: To provide a package for a semiconductor using a conductive case at a low case, having a constitution within a range of the diameter of a reliable practical signal pin and the diameter of a through-hole, facilitating a connection with an external substrate, having excellent high-frequency transmission characteristics, and enabling a high-speed operation of 10 G bit/sec or more.
SOLUTION: The package for the semiconductor has a signal conductor composed of a field-through section having a characteristic impedance lower than one to be matched, a free running section A being electrically connected to the field-through section respectively from the inside and the outside of the package and having the characteristic impedance higher than the field-through section, and a high impedance section 52d.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种使用导电壳体的半导体的封装，其具有在可靠的实际信号引脚的直径范围内的结构和通孔的直径，便于与外部基板的连接，具有优异的高频传输特性，并且能够进行10G比特/秒以上的高速操作。解决方案：用于半导体的封装具有信号导体，该信号导体由具有低于1的特性阻抗的通过部分组成，自由运行部分A分别从内部电连接到通过部分和封装的外部，并且具有高于通过部分的特性阻抗，以及高阻抗部分52d。版权所有（C）2005，JPO＆NCIPI

6. 发明专利

JP2003197929A LIGHT RECEIVING ELEMENT CARRIER AND LIGHT RECEIVING DEVICE 审中-公开
公开(公告)号：JP2003197929A
公开(公告)日：2003-07-11
申请号：JP2001397895
申请日：2001-12-27
申请人： MITSUBISHI ELECTRIC CORP
发明人： ARIGA HIROSHI
IPC分类号： G02B6/42 , H01L31/0232
摘要： PROBLEM TO BE SOLVED: To solve the problem that the height of a light receiving device at the time of modulation is increased since the set height of an optical fiber is made different from the set height of an electric output terminal. SOLUTION: This light receiving device is provided with a terrace 9 where adjacent S layer to P layer are laminated successively from the bottom face through boundary surfaces almost in parallel with the bottom face, and the R layer is formed longer than the Q layer, and a part of the surface of the R layer is exposed like a terrace, a vertical power supply VIA 17A put through the Q layer from the A face to the B face, a vertical power supply VIA 17C put through the R layer from the C face to the B face, a vertical differential line 16A formed on the A face for connecting a high frequency terminal 6A to the vertical power supply VIA 17A, a vertical differential line 16C formed on the C face for connecting the high frequency terminal 6C to the vertical power supply VIA 17C, a differential line 7A formed on the B face, connected to the vertical power supply VIA 17A, and extended to the terrace 9, and a differential line 7C formed on the B face, connected to the vertical power supply VIA 17C, and extended to the terrace 9. COPYRIGHT: (C)2003,JPO

7. 发明专利

JP2002141711A DIFFERENTIAL STRIP LINE VERTICAL CONVERTER AND OPTICAL MODULE 失效
公开(公告)号：JP2002141711A
公开(公告)日：2002-05-17
申请号：JP2000332593
申请日：2000-10-31
申请人： MITSUBISHI ELECTRIC CORP
发明人： ARIGA HIROSHI
IPC分类号： H01P1/04 , H01P5/08 , H01S5/022
摘要： PROBLEM TO BE SOLVED: To obtain a differential strip line vertical converter with a simple structure without using a matching via that is in operation while staying in a differential state, and to obtain an optical module incorporated with the converter. SOLUTION: A differential microstrip line 10 and a differential tri-plate line 11 are provided on a dielectric body, then the lines are interconnected through vias 6 to form a two-parallel line and the interval of the vias is made to have desired impedance, thereby vertically interconnecting the lines while operating the differential microstrip line 10 and the differential tri-plate line 11 in a differential state and matching the impedance of them.

8. 发明专利

JP2000013138A ARRAY ANTENNA FEEDING DEVICE 失效
公开(公告)号：JP2000013138A
公开(公告)日：2000-01-14
申请号：JP17134498
申请日：1998-06-18
申请人： MITSUBISHI ELECTRIC CORP
发明人： NAKAAZE HIROAKI , ARIGA HIROSHI , SAKURA TAKESHI , NEGISHI NORIMITSU , TANAKA MASARU , MIZUTAME HITOSHI
IPC分类号： H05K9/00 , H01P5/08 , H01Q3/26 , H01Q23/00
摘要： PROBLEM TO BE SOLVED: To eliminate the need of a complicated chassis having a wall for separating the respective systems of modules by loading an air-tight package provided with a micro wave integration circuit having the active element of an amplifier or the like, and the connection terminal of a power source and a signal on a multilayer substrate which is integrally formed by a high frequency interruption line or the like and constituting a plurality of modules. SOLUTION: A multilayer substrate 8 which is integrally formed of a plurality of metallic layers and dielectric layers is constituted of a side metallic layer 9 covering the whole side of the multilayer substrate 8 by making the potential of the outermost layer and that of the lowermost layer to be equal, the connection terminals 10 of a power source and a signal, which are installed in the fitting face of the air-tight package 2 to the multilayer substrate 8 and in a range that is installed in metallic ground conductor layers formed on the uppermost layer and the lowermost layer and is covered by the air-tight package 2, and the feeding line of a microwave signal, which is installed in the metallic layer. A plurality of air-tight packages mounting micro wave integration circuits having active elements are mounted on the multilayer substrate 8 and a device mounting a plurality of modules is constituted.

9. 发明专利

JP2012255934A Optical wavelength converter 有权
标题翻译：光波长转换器
公开(公告)号：JP2012255934A
公开(公告)日：2012-12-27
申请号：JP2011129212
申请日：2011-06-09
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ARIGA HIROSHI , OHATA NOBUO
IPC分类号： G02F1/365 , G02F1/025 , G02F2/02
摘要： PROBLEM TO BE SOLVED: To obtain an optical wavelength converter capable of always achieving control for keeping an optimal working point with a simple configuration.SOLUTION: An optical wavelength converter comprises: a front-end semiconductor optical amplifier 5 for amplifying signal light; an optical demultiplexer 8a for splitting probe light into two; an optical multiplexer 6a for combining the signal light from the front-end semiconductor optical amplifier 5 with the probe light from the optical demultiplexer 8a; a semiconductor optical amplifier (SOA) 7 for amplifying the signal light and the probe light that are combined by the optical multiplexer 6a; a semiconductor optical amplifier (SOA) 9 for amplifying the probe light that is split by the optical demultiplexer 8a; an optical multiplexer 6b for combining light that is output from the SOAs 7 and 9, and outputting the combined light as wavelength converted light; an optical demultiplexer 8b for splitting the wavelength converted light into two; a photodiode 10 for outputting a current corresponding to average power of the wavelength converted light that is split by the optical demultiplexer 8b; and a front-end SOA control circuit 12 for controlling a bias current of the front-end semiconductor optical amplifier 5 so as to maximize a value of a current that is output from the photodiode 10.
摘要翻译：要解决的问题：获得能够始终实现以简单配置保持最佳工作点的控制的光学波长转换器。光波长转换器包括：用于放大信号光的前端半导体光放大器5; 用于将探测光分成两个的光解复用器8a; 用于将来自前端半导体光放大器5的信号光与来自光解复用器8a的探测光组合的光复用器6a; 用于放大由光复用器6a组合的信号光和探测光的半导体光放大器（SOA）7; 用于放大由光解复用器8a分离的探测光的半导体光放大器（SOA）9; 光复用器6b，用于组合从SOA 7和9输出的光，并输出组合的光作为波长转换的光; 用于将波长转换的光分成两个的光解复用器8b; 用于输出与由光解复用器8b分离的波长转换光的平均功率相对应的电流的光电二极管10; 以及前端SOA控制电路12，用于控制前端半导体光放大器5的偏置电流，以便最大化从光电二极管10输出的电流的值。（C）2013， JPO＆INPIT

10. 发明专利

JP2012108238A Optical modulation device 审中-公开
标题翻译：光学调制装置
公开(公告)号：JP2012108238A
公开(公告)日：2012-06-07
申请号：JP2010255794
申请日：2010-11-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： UESUGI TOSHITSUGU , ARIGA HIROSHI
IPC分类号： G02F1/01 , G02F1/015 , G02F1/03
CPC分类号： G02F1/2255 , G02F2001/212
摘要： PROBLEM TO BE SOLVED: To obtain an optical modulation device with which the reflection of input electrical signals can be reduced over the broad band range.SOLUTION: An optical modulation device has an optical modulator 4 with an anode electrode 5, a conformity resistance 8, a first wire 3 connected to the anode electrode 5 and transmitting input electrical signals to the optical modulator 4 to the anode electrode 5, a first conductor pad 2 with capacitance connected to the first wire 3, a second wire 6 connecting the anode electrode 5 and the conformity resistance 8 and a second conductor pad 7 with capacitance connected to the second wire 6.

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