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1. 发明专利

JP2008100755A Sheet for die sorting and conveyance method of chip having adhesive layer 有权
标题翻译：具有胶粘层的切片和输送方法
公开(公告)号：JP2008100755A
公开(公告)日：2008-05-01
申请号：JP2006286651
申请日：2006-10-20
申请人： Lintec Corp , リンテック株式会社
发明人： HAMAZAKI AKIE , NOHIRA SHINO , KOMIYAMA MIKIO
IPC分类号： B65D85/86 , B65D73/00 , H01L21/683
CPC分类号： H01L21/67132
摘要： PROBLEM TO BE SOLVED: To provide a sheet for die sorting capable of storing and conveying even a chip having an adhesive layer with a tack at a rear surface in a stable state, and also to provide a method which stores and conveys the chip having the adhesive layer by the sheet for the die sorting in a stable state. SOLUTION: The sheet 10 for the die sorting allows a gluing agent layer 11 to be exposed at the outer circumference 13 of a carrier sheet, and the conveyance method of the chip 80 with an adhesive layer 61 which is formed by exposing a base film 12 at a center 14 being the inside the outer circumference part 13 comprises steps of preparing the sheet 10 for the die sorting fixed by a frame body through the gluing agent layer 11 of the outer circumference 13, tacking the adhesive layer 61 of the picked up chip 80 to the base film 12 exposed in the sheet 10 for the die sorting, and conveying the sheet 10 for the die sorting to which the chip 80 is tacked through the adhesive layer 61 to a subsequent process. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于模具分选的片材，其能够在稳定状态下甚至在后表面上存储并输送具有粘性层的粘合剂层的芯片，并且还提供一种存储和传送芯片具有用于模具排列的片材的粘合剂层，其处于稳定状态。解决方案：用于模具分选的片材10允许胶合剂层11暴露在载体片材的外圆周13处，并且芯片80的输送方法具有通过曝光形成的粘合剂层61 在外周部13的内侧的中央部14的基膜12包括以下步骤：准备由框体通过外周13的胶粘剂层11固定的模具分类用片材10，将粘合剂层61固定将芯片80拾取到暴露在片材10中用于模具分类的基底膜12，并且通过粘合剂层61将用于芯片80的模具分类的片材10输送到随后的过程。版权所有（C）2008，JPO＆INPIT

2. 发明专利

JP2007220693A Wafer transcription method 有权
标题翻译： WAFER转录方法
公开(公告)号：JP2007220693A
公开(公告)日：2007-08-30
申请号：JP2004055720
申请日：2004-03-01
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , KOMIYAMA MIKIO , WATANABE KENICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a transcription method of wafers that can be picked up by using a universal pickup device. SOLUTION: A wafer 1, of which a circuit side is fixed on a first frame 3 through a first adhesive sheet 2, is transcribed into a state where a side opposite to the circuit side is fixed on a second frame 6 through a second adhesive sheet 7 by the wafer transcription method. The wafer 1 fixed on the first frame 3 is permitted to abut on a transcription table 5 having a diameter larger than that of the wafer 1 but smaller than the inner diameter of the first frame 3, with the first adhesive sheet 2 at the bottom. Then the first frame 3 is pulled down. Under such conditions, the second frame 6 with the second adhesive sheet 7 stuck thereon is arranged above the wafer 1. After sticking the second adhesive sheet 7 on the wafer 1, the first adhesive sheet 2 is peeled from the wafer 1, and the wafer 1 is transcribed on the second frame 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以通过使用通用拾取装置拾取的晶片的转录方法。解决方案：电路侧通过第一粘合片2固定在第一框架3上的晶片1被转录成与电路侧相对的一侧通过第一框架6固定在第二框架6上的状态第二粘合片7通过晶片转录法。固定在第一框架3上的晶片1被允许邻接在第一粘合片2在底部的直径大于晶片1但直径小于第一框架3的内径的转录台5上。然后第一个框架3被拉下来。在这种条件下，第二粘合片7贴在其上的第二框架6被布置在晶片1的上方。将第二粘合片7粘贴在晶片1上之后，将第一粘合片2从晶片1剥离，并且晶片 1在第二帧6上转录。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2005276987A Ultra-thin chip manufacturing process and manufacturing apparatus therefor 审中-公开
标题翻译：超薄切片制造工艺及其制造设备
公开(公告)号：JP2005276987A
公开(公告)日：2005-10-06
申请号：JP2004086330
申请日：2004-03-24
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , KOMIYAMA MIKIO , WATANABE KENICHI
IPC分类号： H01L21/683 , H01L21/00 , H01L21/301 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/67092
摘要： PROBLEM TO BE SOLVED: To provide an ultra-thin chip manufacturing process capable of simplifying production facilities, reducing production cost, and processing an ultra-thin wafer without damaging it. SOLUTION: The ultra-thin chip is manufactured by sequentially undergoing a wafer alignment step of taking out a wafer 2, to which a surface protection tape is adhered on the side thereof facing the surface of a circuit for positioning it; a wafer transfer step of transferring the positioned wafer 2 to supply it on a table 10 with the side, with the circuit surface facing downward; a dicing step of laser-dicing the wafer 2 which is chucked and held on the table 10, from the back of the side facing the circuit surface; a wafer-mounting step of adhering the laser-diced wafer 2 and a dicing frame 11 on the same table 10 to integrate both into a work W; a tape-stripping step of stripping the surface protection tape adhered to the surface of the wafer 2 facing the circuit surface; and a wafer storage step of storing the wafer 2 of which surface protection tape has been stripped. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够简化生产设备，降低生产成本，并且在不损坏超薄晶片的情况下处理超薄晶片的超薄芯片制造工艺。解决方案：超薄芯片是通过依次进行晶片取向步骤制造的，其中取出晶片2，其表面保护带被粘附在其面对电路表面的一侧，用于定位它; 传送定位的晶片2以将其提供在具有侧面的台10上的晶片传送步骤，电路表面朝下; 从面向电路表面的一侧的背面激光切割被夹持并保持在工作台10上的晶片2的切割步骤; 将激光切割晶片2和切割框架11粘接在同一工作台10上的晶片安装步骤，以将两者都集成到工件W中; 剥离粘附到晶片2的面向电路表面的表面的表面保护带的带剥离步骤; 以及晶片存储步骤，用于存储表面保护带被剥离的晶片2。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2005209940A Method for manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2005209940A
公开(公告)日：2005-08-04
申请号：JP2004015880
申请日：2004-01-23
申请人： Lintec Corp , リンテック株式会社
发明人： KOMIYAMA MIKIO
IPC分类号： H01L21/52 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which the generation of chip notches, chip cracks and package cracks can be prevented at the time of carrying chips or packages between processes, chip alignment at the time of cutting an adhesive layer is high and manufacturing efficiency is high. SOLUTION: The manufacturing method includes a process for forming a groove having cut depth shallower than the thickness of a semiconductor wafer from the circuit surface side of the semiconductor wafer, a process for sticking a surface protecting adhesive sheet to the circuit surface of the semiconductor wafer, a process for scraping the rear face of the semiconductor wafer up to prescribed thickness and dividing wafers into individual pieces, a process for laminating a chip fixing adhesive sheet to the rear side of an aggregate of individual chips, a process for fixing the surface protecting adhesive sheet side on a wafer mounting table while supporting the aggregate of individual chips and then cutting off the chip fixing adhesive sheet in each chip, a process for picking up each chip with the chip fixing adhesive sheet, and a process for bonding the chip on a substrate for mounting the chip through the chip fixing adhesive sheet. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种制造半导体器件的方法，其中在工艺之间承载芯片或封装时可以防止产生芯片缺口，芯片裂纹和封装裂纹，在芯片对准时切割粘合层高，制造效率高。解决方案：制造方法包括从半导体晶片的电路表面侧形成具有比半导体晶片的厚度浅的切割深度的凹槽的工艺，将表面保护粘合片粘附到电路表面的工艺半导体晶片，用于将半导体晶片的背面刮除达规定厚度并将晶片分割为单个片的方法，将芯片固定粘合片层压到单个芯片的集合体的后侧的工序，固定工序在晶片安装台上的表面保护粘合片侧面，同时支撑各个芯片的聚集体，然后切断每个芯片中的芯片固定粘合片，用芯片固定粘合片拾取每个芯片的处理，以及粘合该芯片用于通过芯片固定粘合片安装芯片。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JPH0745557A WAFER STICKING ADHESIVE SHEET 失效
公开(公告)号：JPH0745557A
公开(公告)日：1995-02-14
申请号：JP18470493
申请日：1993-07-27
申请人： LINTEC CORP
发明人： KOMIYAMA MIKIO , SENOO HIDEO , HOSONO SHIGERU , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J4/00 , C09J163/00 , C09J175/14 , H01L21/301 , H01L21/58 , H01L21/68
摘要： PURPOSE:To avoid the deviation in chip bodies for enabling the pick up to be stably performed by a method wherein the modulus of elasticity after radiation setting of radiation setting adhesive layer comprising a bonding agent and radiation polymeric oligomer is to be specified. CONSTITUTION:The title wafer sticking adhesive sheet 1 is formed by forming a radiation setting adhesive layer 3 on a base substance 2 further forming a die bonding agent layer 4 on the layer 3. The modulus of elasticity of the radiation setting adhesive layer 3 after the radiation setting step is specified to be 1X10 [dynes/cm ]-1X10 [dynes/cm ] comprising the radiation setting adhesive layer 3, an acryl base adhesive is preferable while as for the radiation polymeric oligomer, respective oligomers, etc., of urethane acrylate base, epoxy denatured urethane acrylate base, epoxy acrylate base are applicable.

6. 发明专利

JPH09253964A BASE MATERIAL FOR ADHESIVE TAPE, ADHESIVE TAPE USING THIS BASE MATERIAL, AND MANUFACTURE OF THIN BASE MATERIAL 失效
公开(公告)号：JPH09253964A
公开(公告)日：1997-09-30
申请号：JP5965196
申请日：1996-03-15
申请人： LINTEC CORP
发明人： NAGAMOTO KOICHI , KOMIYAMA MIKIO , EBE KAZUYOSHI
IPC分类号： B23Q3/08 , B24B37/04 , B24B37/30 , B28D7/04 , C08F299/06 , C08J5/18 , C09J4/00 , C09J7/02 , C09J175/14 , H01L21/301 , H01L21/304 , H01L21/67
摘要： PROBLEM TO BE SOLVED: To provide a base material for adhesive tape having a flat surface and having a remarkably high thickness precision by forming the base material of a radiation hardened product obtained by radiation hardening a mixture containing an urethane acrylate oligomer and a reactive diluted monomer, and specifying the rupture elongation. SOLUTION: An adhesive tape 1 is formed of a base material 2 and an adhesive layer 3 laminated on the base material. The base material 2 is formed by casting a liquefied resin obtained by mixing an urethane acrylate oligomer, a reactive diluted monomer, and a photo initiator, and hardening it by radiation of UV rays or electron beam head. The physical properties of the base material 2 are set as follows: Rupture elongation is 10% or more, preferably 100% or more of the radiation hardened material, and initial elasticity is 100-100,000kg/cm , preferably, 500-50,000kg/cm .

7. 发明专利

JPH08245932A ANTISTATIC ADHESIVE SHEET 失效
公开(公告)号：JPH08245932A
公开(公告)日：1996-09-24
申请号：JP7990695
申请日：1995-03-10
申请人： LINTEC CORP
发明人： KOMIYAMA MIKIO , NUMAZAWA HIDEKI , EBE KAZUYOSHI
IPC分类号： B32B7/10 , C09J5/00 , C09J7/02 , C09J133/00 , C09J201/00
摘要： PURPOSE: To obtain an antistatic adhesive sheet lowering peeled charge without inducing pollution of a material to be adhered, giving excellent visibility of the material to be adhered in adhesion and usable of a photo-crosslinking type re-peelable adhesive by forming an antistatic layer and an adhesive layer in turn on a substrate film. CONSTITUTION: The objective sheet is composed of a substrate film 1, an antistatic layer 2 formed on one principal face of the substrate film 1 and an adhesive layer 3 formed on the antistatic layer. It is preferable that the antistatic layer 2 is composed of an electroconductive filler selected from tin oxide-based, indium oxide-based and zinc oxide-based having

8. 发明专利

JPH0786212A ADHESIVE SHEET FOR STICKING OF WAFER 失效
公开(公告)号：JPH0786212A
公开(公告)日：1995-03-31
申请号：JP18470393
申请日：1993-07-27
申请人： LINTEC CORP
发明人： KOMIYAMA MIKIO , HOSONO SHIGERU , TAGUCHI KATSUHISA , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J4/00 , C09J133/06 , C09J163/10 , C09J175/14 , H01L21/301
摘要： PURPOSE:To obtain a desired interval between chips and prevent the slippage of chips at pickup by equally dispersing radiation copolymer oligomers having specified gain diameters, in a radiation hardening type of adhesive layer. CONSTITUTION:An adhesive sheet 1 for sticking of a wafer is composed of a base material 2 and a layer 3 consisting of the radiation hardening type of adhesive agent made on this base material 2. The radiation hardening type of adhesive layer 3 is made of an adhesive agent and a radiation-polymeric oligomer. Moreover, for the radiation hardening adhesive layer 3, groups having adhesive agents for their main ingredients and groups having radiation-polymeric oligomers for their main ingredients are dispersed equally. The equal dispersion means that the groups on one side between both ingredients form nearly globular particles and the groups on the other side bury the peripheries of the particles, and that the distribution of particles is equal. It is to be desired that the diameter of the particle should be 1-30mum, especially desired that it should be 1-10mum.

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