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1. 发明专利

JP2008293508A Semiconductor wafer machining method and semiconductor wafer support member 审中-公开
标题翻译：半导体波长加工方法和半导体波长支撑构件
公开(公告)号：JP2008293508A
公开(公告)日：2008-12-04
申请号：JP2008155392
申请日：2008-06-13
申请人： Lintec Corp , リンテック株式会社
发明人： IWAKATA YUICHI , NOGUCHI ISATO , TAGUCHI KATSUHISA , EBE KAZUYOSHI
IPC分类号： G05B19/418 , G06K17/00 , G06K19/07 , G06Q50/00 , G06Q50/04 , H01L21/301 , H01L21/673
CPC分类号： Y02P90/30
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing process management system reducing a burden on a host computer and facilitating information management even when transferring wafers between plants. SOLUTION: This semiconductor wafer machining method comprises processes for fixing a wafer formed with a circuit, to a semiconductor wafer support member 14 made of plastic and provided with a data carrier 1 sending a reply to an inquiry from an interrogator regarding input information, inputting information required for machining the wafer, to the data carrier, and reading the information from the data carrier to machine the wafer based on the information. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供半导体制造过程管理系统，减少主计算机的负担，并且即使在工厂之间转移晶片时也促进信息管理。解决方案：该半导体晶片加工方法包括将形成有电路的晶片固定到由塑料制成的半导体晶片支撑构件14的工艺，并且设置有数据载体1，从询问器发送关于输入信息的询问将加工晶片所需的信息输入到数据载体，以及从数据载体读取信息，以便根据该信息加工晶片。版权所有（C）2009，JPO＆INPIT

2. 发明专利

JP2004119992A Adhesive sheet for manufacturing chip body 有权
公开(公告)号：JP2004119992A
公开(公告)日：2004-04-15
申请号：JP2003418496
申请日：2003-12-16
申请人： Lintec Corp , リンテック株式会社
发明人： NOGUCHI ISATO , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/52
CPC分类号： H01L2221/68336
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip body in which a space between chips is expanded without a conventional expanded process in a process for manufacturing a chip body such as a semiconductor chip, and an adhesive sheet for manufacturing the chip body used properly in the manufacturing method. SOLUTION: The adhesive sheet for manufacturing a chip body has an adhesive layer for sticking a material that is cut, a shrinkable film, and an extensible film stacked, in this order. Preferably, the extensible film has an elastic modulu of less than 1×10 9 N/m 2 , the adhesive layer comprises a radiation curing adhesive, and the heat-shrinkable film and the extensible film are stacked via an adhesive layer having an elastic modulus of not less than 1.0×10 5 N/m 2 . COPYRIGHT: (C)2004,JPO

3. 发明专利

JP2002342910A IDENTIFICATION CARD AND METHOD OF MANUFACTURING THE SAME 失效
公开(公告)号：JP2002342910A
公开(公告)日：2002-11-29
申请号：JP2001147656
申请日：2001-05-17
申请人： LINTEC CORP
发明人： EBE KAZUYOSHI , IWAKATA YUICHI , NAKADA YASUKAZU
IPC分类号： B42D15/10 , G11B5/70 , G11B5/714 , G11B5/80 , G11B5/84 , G11B5/842
摘要： PROBLEM TO BE SOLVED: To provide a card with which the prevention of the forgery of the same card and the authenticity discrimination by a magnetic sensor are possible. SOLUTION: This identification card is formed by randomly distributing plural regions consisting of magnetic powder. The average grain size of the magnetic powder is 0.01 to 10 μm.

4. 发明专利

JP2002299378A ADHESIVE SHEET WITH CONDUCTOR, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002299378A
公开(公告)日：2002-10-11
申请号：JP2001099019
申请日：2001-03-30
申请人： LINTEC CORP
发明人： YAMAZAKI OSAMU , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J9/02 , C09J133/06 , C09J163/00 , H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/10
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device, having no possibility of defects caused by fluidity of an underfill material, its manufacturing method and the adhesive sheet use for manufacturing such a semiconductor device. SOLUTION: The adhesive sheet 1 with a conductor comprises a base 2, an adhesive layer 3 formed on the base 2 and the conductor 4 embedded in the layer 3. The method for manufacturing the semiconductor device comprises the steps of adhering the sheet 1 to a semiconductor wafer, then releasing the base 2 from the layer 3 of the sheet 1, then aligning the layer 3 at the substrate, and adhering the wafer to the substrate via the layer 3.

5. 发明专利

JPH10284446A MANUFACTURE OF CHIP BODY, AND ADHESIVE SHEET FOR MANUFACTURING THE SAME 失效
公开(公告)号：JPH10284446A
公开(公告)日：1998-10-23
申请号：JP2865398
申请日：1998-02-10
申请人： LINTEC CORP
发明人： NOGUCHI ISATO , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J4/02 , H01L21/301
摘要： PROBLEM TO BE SOLVED: To expand a chip interval with no expansion by pasting a to-be-cut object to an adhesive sheet comprising a contraction film, an expandable film, and an adhesive agent layer, fixing an end part of the adhesive sheet, dicing the to-be-cut object, and contracting the contraction film. SOLUTION: Relating to a chip body manufacturing adhesive sheet 10, a contraction film 2 is laminated over the entire surface of an expandable film 4 through a bonding agent layer 3, and a to-be-cut/pasting adhesive agent layer 1 is provided on the entire surface of the contraction film 2. An end part of the chip body manufacturing/adhesive sheet 10 is, at an upper periphery part of a to-be-cut object pasting adhesive agent layer 1, fixed with a ring frame 5, and a to-be-cut object 6 is pasted to an upper inside periphery part of the to-be-cut object adhesive agent layer 1. As the to-be-cut object 6, such thing as a semiconductor is mounted on a lead frame is listed. An elastic modulus of the expandable film is preferred to be less than 1×10 N/m , while a radiation setting type adhesive agent is preferable for the adhesive agent layer 1.

6. 发明专利

JPH10233373A MANUFACTURE OF CHIP BODY AND ADHESIVE SHEET USED IN THE MANUFACTURE 失效
公开(公告)号：JPH10233373A
公开(公告)日：1998-09-02
申请号：JP33995597
申请日：1997-12-10
申请人： LINTEC CORP
发明人： NOGUCHI HAYATO , MINEURA YOSHIHISA , NUMAZAWA HIDEKI , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J133/00 , C09J175/04 , C09J201/00 , H01L21/301 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To easily pick up a chip body by a method wherein an object, to be cut, is pasted on an adhesive sheet which is composed of a shrinkable film and of an adhesive layer, it is diced to form the chip body, the shrinkable film is shrunk and the contact area of the chip body with the adhesive layer is reduced. SOLUTION: An object 5 to be cut is pasted on an adhesive layer 1 at an adhesive sheet 10, it is cut, and chips 6 are obtained. A cutting depth in a dicing operation is set in such a way that a shrinkable film 2 is cut completely up to the halfway part of a nonshrinkable film 4. A laminated body which is composed of the chips 6 and of the adhesive sheet 10 is heated, and the shrinkable film 2 is shrunk. Then, also the adhesive layer 1 is deformed so as to follow the shrinkage of the film 2, and the contact area of the chips 6 with the adhesive layer 1 is reduced. As a result, the adhesive force of the chips 6 to the adhesive layer 1 is reduced, and the chips can be picked up easily by means of a suction collet and without using a push-up pin.

7. 发明专利

JPH08245932A ANTISTATIC ADHESIVE SHEET 失效
公开(公告)号：JPH08245932A
公开(公告)日：1996-09-24
申请号：JP7990695
申请日：1995-03-10
申请人： LINTEC CORP
发明人： KOMIYAMA MIKIO , NUMAZAWA HIDEKI , EBE KAZUYOSHI
IPC分类号： B32B7/10 , C09J5/00 , C09J7/02 , C09J133/00 , C09J201/00
摘要： PURPOSE: To obtain an antistatic adhesive sheet lowering peeled charge without inducing pollution of a material to be adhered, giving excellent visibility of the material to be adhered in adhesion and usable of a photo-crosslinking type re-peelable adhesive by forming an antistatic layer and an adhesive layer in turn on a substrate film. CONSTITUTION: The objective sheet is composed of a substrate film 1, an antistatic layer 2 formed on one principal face of the substrate film 1 and an adhesive layer 3 formed on the antistatic layer. It is preferable that the antistatic layer 2 is composed of an electroconductive filler selected from tin oxide-based, indium oxide-based and zinc oxide-based having

8. 发明专利

JPH02269171A ADHESIVE SHEET FOR ADHERING WAFER 失效
公开(公告)号：JPH02269171A
公开(公告)日：1990-11-02
申请号：JP9041489
申请日：1989-04-10
申请人： LINTEC CORP
发明人： TAGUCHI KATSUHISA , SENOO HIDEO , EBE KAZUYOSHI , KOGURE MASAO
IPC分类号： C09J7/02 , H01L21/68 , H01L21/683
摘要： PURPOSE:To obtain the title sheet which shows stabilized adhesion properties for a long period of time without softening of the adhesive, excellent stress relaxation as long as large elongation and no looseness, by using, as a base material, a film of a specific polymer composition. CONSTITUTION:A polymer composition containing (A) a polyol-containing vinyl chloride polymer which is prepared by polymerizing vinyl chloride monomer or a mixture thereof with another copolymerizable monomer in an aqueous medium containing a polyol soluble in vinyl chloride monomer and (B) an isocyanate is made into a film and the film is used as a base. The base material is coated with an adhesive layer which is composed of an adhesive and an irradiation-polymerizable compound such as trimethylolpropane triacrylate to give the subject sheet. The adhesive is preferably an acrylic polymer containing an acrylic acid ester such as ethyl methacrylate as a major unit.

9. 发明专利

JP2004031956A Adhesive sheet for manufacturing chips 有权
公开(公告)号：JP2004031956A
公开(公告)日：2004-01-29
申请号：JP2003174654
申请日：2003-06-19
申请人： Lintec Corp , リンテック株式会社
发明人： NOGUCHI HAYATO , MINEURA YOSHIHISA , NUMAZAWA HIDEKI , EBE KAZUYOSHI
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/68
CPC分类号： H01L21/6836 , H01L2221/68327 , H01L2924/30105
摘要： PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing chips, which enables a manufacturer to pick up thin and large area chips easily without using push up pins when the chips are picked up. SOLUTION: The adhesive sheet for manufacturing the chips is formed by laminating a base film which does not shrink, a shrinkable film whose shrinkage rate is 10 to 90% and an adhesive layer in this order. COPYRIGHT: (C)2004,JPO

10. 发明专利

JP2003123332A SHEET FOR MANUFACTURING OPTICAL DISK 审中-公开
公开(公告)号：JP2003123332A
公开(公告)日：2003-04-25
申请号：JP2001311966
申请日：2001-10-09
申请人： LINTEC CORP
发明人： KUBOTA ARATA , KOBAYASHI MASAMORI , EBE KAZUYOSHI
IPC分类号： C08J5/18 , B29C59/02 , B29L17/00 , G11B7/24 , G11B7/245 , G11B7/254 , G11B7/257 , G11B7/26
摘要： PROBLEM TO BE SOLVED: To provide a sheet for manufacturing an optical disk which is capable of decreasing the deposits to a stamper. SOLUTION: A stamper receptive layer 11 of the sheet for manufacturing the optical disk is composed of a polymeric material which has energy ray curability and is 10 to 10 Pa in the storage elastic modules before the curing.

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