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1. 发明专利

JP2005276987A Ultra-thin chip manufacturing process and manufacturing apparatus therefor 审中-公开
标题翻译：超薄切片制造工艺及其制造设备
公开(公告)号：JP2005276987A
公开(公告)日：2005-10-06
申请号：JP2004086330
申请日：2004-03-24
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , KOMIYAMA MIKIO , WATANABE KENICHI
IPC分类号： H01L21/683 , H01L21/00 , H01L21/301 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/67092
摘要： PROBLEM TO BE SOLVED: To provide an ultra-thin chip manufacturing process capable of simplifying production facilities, reducing production cost, and processing an ultra-thin wafer without damaging it. SOLUTION: The ultra-thin chip is manufactured by sequentially undergoing a wafer alignment step of taking out a wafer 2, to which a surface protection tape is adhered on the side thereof facing the surface of a circuit for positioning it; a wafer transfer step of transferring the positioned wafer 2 to supply it on a table 10 with the side, with the circuit surface facing downward; a dicing step of laser-dicing the wafer 2 which is chucked and held on the table 10, from the back of the side facing the circuit surface; a wafer-mounting step of adhering the laser-diced wafer 2 and a dicing frame 11 on the same table 10 to integrate both into a work W; a tape-stripping step of stripping the surface protection tape adhered to the surface of the wafer 2 facing the circuit surface; and a wafer storage step of storing the wafer 2 of which surface protection tape has been stripped. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够简化生产设备，降低生产成本，并且在不损坏超薄晶片的情况下处理超薄晶片的超薄芯片制造工艺。解决方案：超薄芯片是通过依次进行晶片取向步骤制造的，其中取出晶片2，其表面保护带被粘附在其面对电路表面的一侧，用于定位它; 传送定位的晶片2以将其提供在具有侧面的台10上的晶片传送步骤，电路表面朝下; 从面向电路表面的一侧的背面激光切割被夹持并保持在工作台10上的晶片2的切割步骤; 将激光切割晶片2和切割框架11粘接在同一工作台10上的晶片安装步骤，以将两者都集成到工件W中; 剥离粘附到晶片2的面向电路表面的表面的表面保护带的带剥离步骤; 以及晶片存储步骤，用于存储表面保护带被剥离的晶片2。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004311980A Semiconductor manufacturing apparatus and method of manufacturing semiconductor device 有权
公开(公告)号：JP2004311980A
公开(公告)日：2004-11-04
申请号：JP2004085441
申请日：2004-03-23
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： KUROSAWA TETSUYA , TAKU SHINYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/52 , H01L21/301
CPC分类号： H01L2221/6839
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which manufactures high-quality semiconductor devices by reducing the failures such as cracks, chipping or the like in semiconductor chips and has an adhesive-tape stripping mechanism which suppresses the degradation of the manufacturing yield, and to provide a method of manufacturing semiconductor devices. SOLUTION: The semiconductor manufacturing apparatus has a stripping-off mechanism, which vacuum-chucks the semiconductor-wafer side of the adhesive tape with porous material members, which have been separated into at least two chucking areas, and strips off the adhesive tape 24 glued on a semiconductor wafer, which has been diced into individual chips. The porous material members are held in relation to the stripping direction of the adhesive tape 24 by a holding table 3. In the semiconductor wafer, an adhesive layer is glued on each rear face of the semiconductor chip 1. The adhesive tape is stripped off from the semiconductor wafer by controlling vacuum pipe systems of two or more, which are connected to the porous material members, to switch the vacuum-chuck blocks and the vacuum systems, which have been separated into two or more, at about the same timing of the strip-off. The semiconductor chips are individually peeled off from the table. It is possible to fabricate stacked MCP products by stacking semiconductor chips. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2014135337A Semiconductor wafer processing sheet and manufacturing method of the same 有权
标题翻译： SEMICONDUCTOR WAFER PROCESSING SHEET AND MANUFACTURING METHOD OF THE SAME
公开(公告)号：JP2014135337A
公开(公告)日：2014-07-24
申请号：JP2013001515
申请日：2013-01-09
申请人： Lintec Corp , リンテック株式会社
发明人： AZUMA YUICHIRO , ICHIKAWA ISAO , SHINODA HIROFUMI , WATANABE KENICHI
IPC分类号： H01L21/52 , C09J7/02 , C09J201/00 , H01L21/301 , H01L21/56 , H01L23/00 , H01L23/28
摘要： PROBLEM TO BE SOLVED: To reduce damages on an adhesive resin layer at the time of manufacturing a semiconductor wafer processing sheet including the adhesive resin layer and at the time of attachment to a wafer.SOLUTION: A semiconductor wafer processing sheet 10 according to the present embodiment comprises an adhesive resin layer which is laminated in a peelable manner on an adhesive layer of a nearly circular pressure sensitive adhesive sheet having a base material and the adhesive layer provided on one surface of the base material, in which a planar shape of the adhesive resin layer is polygonal, and a tensile strength of the adhesive resin layer is 10 MPa and under.
摘要翻译：要解决的问题：为了减少在制造包括粘合树脂层的半导体晶片处理片材时以及在附着于晶片时的粘合树脂层的损伤。解决方案：根据本发明的半导体晶片处理片材实施方案包括粘合树脂层，其以可剥离的方式层压在具有基材的近似圆形压敏粘合剂的粘合剂层上，并且粘合层设置在基材的一个表面上，其中粘合剂的平面形状树脂层为多边形，粘合树脂层的拉伸强度为10MPa以下。

4. 发明专利

JP2010010392A Sheet peeling device and peeling method 有权
标题翻译：薄膜剥离装置和剥离方法
公开(公告)号：JP2010010392A
公开(公告)日：2010-01-14
申请号：JP2008167941
申请日：2008-06-26
申请人： Lintec Corp , リンテック株式会社
发明人： WATANABE KENICHI
IPC分类号： H01L21/683 , B23K26/00 , B23K101/40
摘要： PROBLEM TO BE SOLVED: To shorten a processing step for a wafer which has a recessed portion and a remaining edge portion. SOLUTION: A sheet peeling device 10 includes a table 11 which holds the semiconductor wafer W, a peeling means 12 of peeling an adhesion sheet S stuck on the semiconductor wafer W, and a reforming means 13 of irradiating the semiconductor wafer W with laser light to form a brittle portion WE. The semiconductor wafer W has the recessed portion W1 and the remaining edge portion W2 connecting with an outer circumference of the recessed portion W1. The reforming means 13 forms the brittle portion WE at the remaining edge portion W2 and an outer edge of a bottom surface W1a. The adhesion sheet S is peeled to peel the adhesion sheet S in a state where the remaining edge portion W2 is bonded, from a formation region of the recessed portion W1a while dividing the formation region of the recessed portion W1a and the remaining edge portion W2. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：缩短具有凹部和剩余边缘部分的晶片的加工步骤。解决方案：片材剥离装置10包括保持半导体晶片W的工作台11，剥离粘附在半导体晶片W上的粘合片S的剥离装置12以及用半导体晶片W照射半导体晶片W的重整装置13 激光形成脆性部分WE。半导体晶片W具有与凹部W1的外周连接的凹部W1和剩余边缘部W2。重整装置13形成剩余边缘部分W2的脆性部分WE和底部表面W1a的外边缘。在分割凹部W1a的形成区域和剩余的边缘部分W2的同时，从凹部W1a的形成区域剥离粘合片材S，在剩余的边缘部分W2接合的状态下剥离粘合片材S. 版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008103494A Fixed jig, and method and apparatus for picking up chip 审中-公开
标题翻译：固定夹头，以及用于取芯片的方法和装置
公开(公告)号：JP2008103494A
公开(公告)日：2008-05-01
申请号：JP2006283984
申请日：2006-10-18
申请人： Lintec Corp , リンテック株式会社
发明人： WATANABE KENICHI , SEGAWA TAKESHI , FUJIMOTO YASUSHI
IPC分类号： H01L21/683 , H01L21/52 , H01L21/67
CPC分类号： H01L21/6838 , H01L21/67132 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
摘要： PROBLEM TO BE SOLVED: To provide a fixed jig which can suck a chip group where a semiconductor wafer is individualized not to move freely, and can strip and suck one chip from the chip group selectively and surely. SOLUTION: In a fixed jig 3 consisting of a jig base mount 30 and an adhesion layer 31, a recess 2 is provided in one side of the jig base mount 30. The recess 2 is sectioned into small chambers 15 by a partition wall 12 having the substantially same height as that of the sidewall 35. An adhesion layer 31 is provided at the upper edge of the sidewall 35 and the partition wall 12 to cover the recess 2, and a through hole 17 communicating with the outside is formed in each small chamber 15. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种固定夹具，其能够吸收半导体晶片被个体化而不能自由移动的芯片组，并且可以选择性且可靠地从芯片组剥离和吸取一个芯片。解决方案：在由夹具基座30和粘合层31组成的固定夹具3中，在夹具基座30的一侧设置有凹部2.凹部2通过隔壁壁12具有与侧壁35大致相同的高度。粘合层31设置在侧壁35的上边缘和分隔壁12上以覆盖凹部2，形成与外部连通的通孔17 在每个小房间里。15.版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP2014234424A 接着シートおよび接着シートの貼付方法ならびに接着シートの製造方法有权
标题翻译：粘合片，粘合片的粘贴方法和胶粘剂的制造方法
公开(公告)号：JP2014234424A
公开(公告)日：2014-12-15
申请号：JP2013115805
申请日：2013-05-31
申请人：リンテック株式会社 , Lintec Corp
发明人： OKAMOTO KOJI , WATANABE KENICHI
IPC分类号： C09J7/02 , B32B3/14 , B32B7/12 , B32B27/00
摘要：【課題】被着体の方位を他の装置に認識させることができる接着シートおよび接着シートの貼付方法ならびに接着シートの製造方法を提供すること。【解決手段】接着シートASは、基材シートBSと、前記基材シートBSの一方の面に積層された接着剤AD層とを備え、前記接着剤AD層は、第1接着剤AD1層と第2接着剤AD2層とが同一面内で隣接した状態で積層されることで、所定の法則性をもって被着体WFに貼付されたときに、当該被着体WFの方位を特定することができる境界CLを有する。【選択図】図1
摘要翻译：要解决的问题：提供能够使分离的装置识别粘合目标的取向的粘合片; 粘合片的粘贴方法; 和粘合片的制造方法。解决方案：所提供的粘合片AS包括：基底片BS; 以及层叠在基板BS一侧的表面上的粘合剂AD层，而粘合剂AD层具有边界CL，当粘合剂AD层在粘合目标WF上层合时，按照规定的法则粘贴到粘附目标WF上，第一粘合剂AD1层和第二粘合剂AD2层在相同的平面内相互相邻，粘合目标WF的取向的识别。

7. 发明专利

JP2014154843A Support device and data management method 有权
标题翻译：支持设备和数据管理方法
公开(公告)号：JP2014154843A
公开(公告)日：2014-08-25
申请号：JP2013025884
申请日：2013-02-13
申请人： Lintec Corp , リンテック株式会社
发明人： MATSUSHITA KAORI , YAMAGUCHI KAZUTOSHI , WATANABE KENICHI , OKAMOTO NAOYA
IPC分类号： H01L21/683
CPC分类号： B65H16/04 , B65H18/026 , B65H18/103 , B65H75/242 , B65H2301/4132 , B65H2301/51122 , B65H2403/52 , B65H2404/411 , B65H2557/13 , B65H2701/194
摘要： PROBLEM TO BE SOLVED: To provide a support device in which a data carrier member can be installed on an inner circumferential surface of a tubular member to prevent damage caused by contact with a support shaft and a shaft part for operating fixture means has high flexural rigidity.SOLUTION: A support device 21 for supporting a tubular member 6 around which a long object RS is wound comprises: a support shaft 213 for supporting the tubular member 6 by extrapolating the tubular member from an opening at one end side in a length direction; a fixing plate 217 which is integrated into the support shaft 213 for fixing the tubular member 6 from an inner circumferential side; and operation means including an operation shaft 214 which protrudes forwards from a distal end of the support shaft 213 for operating the fixing plate 217 and of which the diameter is smaller than that of the support shaft 213. Further, a protection member 218 is provided which is mounted in the distal end of the support shaft 214 and through which the operation shaft 214 is inserted, and the protection member 218 includes a diameter reduced part 218b of which the diameter is smaller than that of the support shaft 213.
摘要翻译：要解决的问题：为了提供一种支撑装置，其中数据载体构件可以安装在管状构件的内周表面上，以防止由与支撑轴接触的损伤和用于操作固定装置的轴部产生的损伤具有高抗弯刚度解决方案：用于支撑缠绕有长物体RS的管状构件6的支撑装置21包括：支撑轴213，用于通过从长度方向上的一端侧的开口外推管状构件6来支撑管状构件6; 固定板217，其一体地固定在支撑轴213中，用于将管状构件6从内周侧固定; 以及操作装置，其包括从用于操作固定板217的支撑轴213的远端向前突出并且其直径小于支撑轴213的直径的操作轴214.此外，提供保护构件218，安装在支撑轴214的远端并且操作轴214插入其中，并且保护构件218包括其直径小于支撑轴213的直径的直径减小部分218b。

8. 发明专利

JP2004311576A Method of manufacturing semiconductor device 审中-公开
公开(公告)号：JP2004311576A
公开(公告)日：2004-11-04
申请号：JP2003100413
申请日：2003-04-03
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： TAKU SHINYA , KUROSAWA TETSUYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/301 , H01L21/304 , H01L21/58 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/304 , H01L21/3043 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2221/68381 , H01L2221/6839 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can manufacture a high-quality semiconductor device by reducing defective such as crack or chipping of a semiconductor chip and suppressing manufacturing yield and is suitable for stack MCP using a method of peeling off an adhesive tape. SOLUTION: After forming a cutting groove having a thickness more than a finishing thickness on a semiconductor wafer 1' having semiconductor elements formed thereon, an adhesive tape (surface protection tape) is adhered on the surface of the semiconductor wafer, and then back grinding is performed to reduce thickness and separate the semiconductor chip 1 simultaneously. After that, an adhesive layer 2 is formed on the rear surface of the semiconductor chip, then the adhesive tape 24 is released on a suction stage for vacuum-sucking the semiconductor wafer side with a porous material separated into at least two suction areas on a holding table 3. Chip crack in picking up the thin chip is reduced, and the thin chip according to stack MCP products can be produced. COPYRIGHT: (C)2005,JPO&NCIPI

9. 发明专利

JP2014216551A シート貼付装置および貼付方法有权
标题翻译：薄片贴边装置及薄片贴边方法
公开(公告)号：JP2014216551A
公开(公告)日：2014-11-17
申请号：JP2013094164
申请日：2013-04-26
申请人：リンテック株式会社 , Lintec Corp
发明人： OKAMOTO KOJI , WATANABE KENICHI
IPC分类号： H01L21/683 , H01L21/301
CPC分类号： H01L21/67132 , H01L21/67259 , H01L21/67282
摘要：【課題】被着体の基準部を他の装置に認識できるようにして接着シートを被着体に貼付可能なシート貼付装置および貼付方法を提供すること。【解決手段】シート貼付装置1は、接着シートASを供給する供給手段2と、所定の位置に基準部VNが形成された被着体WFに前記接着シートASを押圧して貼付する押圧手段3と、前記接着シートASにおける前記被着体WFに貼付された領域内の所定の位置に、前記基準部VNに対して位置的に所定の法則性をもたせた所定の位置認識用マークを付与するマーク付与手段4とを備えている。【選択図】図1
摘要翻译：要解决的问题：提供一种片粘贴装置，其能够将粘合片粘贴到被卡住的身体，使得其参考部分能够被其他装置识别，并提供粘贴方法。解决方案：片材粘贴装置1包括用于供给粘合片AS的供给装置2，用于将粘合片AS按压并粘贴到具有形成在预定位置的基准部分VN的待粘贴的物体WF的加压装置3，以及给定预定标记的标记装置用于位置识别，在参考部分VN具有预定的位置规则性，粘合片AS粘附在待粘住的身体WF的区域中的预定位置。

10. 发明专利

JP2008098428A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008098428A
公开(公告)日：2008-04-24
申请号：JP2006278827
申请日：2006-10-12
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： KUROSAWA TETSUYA , TAKU SHINYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that allows to eliminate a dicing tape and a push-up pin or the like, which are conventionally used, in a series of semiconductor device manufacturing steps. SOLUTION: A first manufacturing method for a semiconductor device is composed of a step for sticking a surface protection sheet on a circuit face of a semiconductor wafer having a surface formed with a circuit, a step for grinding a rear face of the wafer, a step for dividing the wafer into individual pieces by performing full-cut dicing of the wafer from the ground-face side for each circuit while the wafer is being supported by the surface protection sheet, a step for suckingly fixing the wafer to a suction table, which has a plurality of independently-controllable suction parts so as to suckingly fix the wafer as a whole, while arranging the ground face of the wafer oppositely to the suction table, a step for exfoliating and removing the surface protection sheet from the wafer divided into individual pieces, a step for partially releasing or weakening a suction force by controlling each suction part of the suction table so as to pick up the wafer divided into individual pieces for each chip, and a step for bonding each chip to a semiconductor substrate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在一系列半导体器件制造步骤中能够消除常规使用的切割带和上推销等的半导体器件制造方法。解决方案：半导体器件的第一制造方法由用于将表面保护片粘贴在具有形成有电路的表面的半导体晶片的电路面上的步骤，用于研磨晶片的背面的步骤通过在晶片被表面保护片支撑的同时，对于每个电路从地面侧进行晶片切割切割，将晶片分割成单独的步骤，将晶片吸附到吸力工作台，其具有多个可独立控制的吸引部分，以便将晶片的接地面与吸盘对置布置，同时将晶片的整体吸入固定，用于从晶片剥离和去除表面保护片的步骤分为单独的部件，通过控制吸力台的每个吸入部分来部分地释放或削弱吸力的步骤，以便拾取分成各个部件的晶片fo r每个芯片，以及用于将每个芯片接合到半导体衬底的步骤。版权所有（C）2008，JPO＆INPIT

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