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1. 发明专利

JP2005332969A Fixture and fixing method of dicing tape 审中-公开
标题翻译：定位带的固定和固定方法
公开(公告)号：JP2005332969A
公开(公告)日：2005-12-02
申请号：JP2004149851
申请日：2004-05-20
申请人： Lintec Corp , リンテック株式会社
发明人： IRIE EIICHI , KOBAYASHI KENJI , MOCHIDA KINYA
IPC分类号： H01L21/683 , H01L21/301 , H01L21/68
摘要： PROBLEM TO BE SOLVED: To provide a fixture of dicing tape which is lightweight and is easy to treat. SOLUTION: The fixture 10 for holding and fixing the dicing tape stuck on the ring frame in an extended state comprises transformably a small ring shape having an outer diameter smaller than the bore of the ring frame (Fig.(a)), and a large ring shape having a larger outer diameter than the bore of the ring frame (Fig.(b)). Namely, the fixture 10 is provided with a circular arc 10a composed of an elastic material, and a connection 10b for connecting the both ends of the circular arc 10a. The connection 10b is folded up in the circular section 10a, so that the fixture 10 may be transformed into the small ring shape. Further, the connection part 10b is extended so that the fixture 10 may be transformed into the large ring shape. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供重量轻且易于处理的切割胶带固定装置。解决方案：用于保持和固定处于延伸状态的环形框架上的切割带的夹具10可变形地具有外径小于环形框架的孔的小环形（图（a）），和具有比环形框架的孔径大的外径的大环形（图（b））。也就是说，固定装置10设置有由弹性材料构成的圆弧10a和用于连接圆弧10a的两端的连接10b。连接部10b在圆形部分10a中被折叠，使得固定装置10可以变形成小环形。此外，连接部10b被延伸，使得固定件10可以变形为大环形。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2004311576A Method of manufacturing semiconductor device 审中-公开
公开(公告)号：JP2004311576A
公开(公告)日：2004-11-04
申请号：JP2003100413
申请日：2003-04-03
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： TAKU SHINYA , KUROSAWA TETSUYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/301 , H01L21/304 , H01L21/58 , H01L21/68 , H01L21/78
CPC分类号： H01L21/6835 , H01L21/304 , H01L21/3043 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/6834 , H01L2221/68363 , H01L2221/68381 , H01L2221/6839 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/00 , H01L2924/3512
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which can manufacture a high-quality semiconductor device by reducing defective such as crack or chipping of a semiconductor chip and suppressing manufacturing yield and is suitable for stack MCP using a method of peeling off an adhesive tape. SOLUTION: After forming a cutting groove having a thickness more than a finishing thickness on a semiconductor wafer 1' having semiconductor elements formed thereon, an adhesive tape (surface protection tape) is adhered on the surface of the semiconductor wafer, and then back grinding is performed to reduce thickness and separate the semiconductor chip 1 simultaneously. After that, an adhesive layer 2 is formed on the rear surface of the semiconductor chip, then the adhesive tape 24 is released on a suction stage for vacuum-sucking the semiconductor wafer side with a porous material separated into at least two suction areas on a holding table 3. Chip crack in picking up the thin chip is reduced, and the thin chip according to stack MCP products can be produced. COPYRIGHT: (C)2005,JPO&NCIPI

3. 发明专利

JP2004072040A Dicing tape with attribute indication and method for manufacturing same 审中-公开
标题翻译：具有属性指示的标签带及其制造方法
公开(公告)号：JP2004072040A
公开(公告)日：2004-03-04
申请号：JP2002232984
申请日：2002-08-09
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/68 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a dicing tape with an attribute indication showing a name of a product, model number or the like capable of easily managing a process, and to provide a method for manufacturing the same. SOLUTION: The dicing tape 10 with an attribute indication comprises a substrate 1, and an adhesive agent layer 2 formed on the substrate 1 and is shaped into a substantially circular configuration. The attributes of the name and the model number of the tape 10 are recorded on at least a part of the periphery of the tape by stamping or punching. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种切割带，其具有显示能够容易地管理过程的产品，型号等的属性的属性指示，并提供其制造方法。具有属性指示的切割带10包括基板1和形成在基板1上并被成形为大致圆形构造的粘合剂层2。带10的名称和型号的属性通过冲压或冲压记录在带的周边的至少一部分上。版权所有（C）2004，JPO

4. 发明专利

JP2005276987A Ultra-thin chip manufacturing process and manufacturing apparatus therefor 审中-公开
标题翻译：超薄切片制造工艺及其制造设备
公开(公告)号：JP2005276987A
公开(公告)日：2005-10-06
申请号：JP2004086330
申请日：2004-03-24
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , KOMIYAMA MIKIO , WATANABE KENICHI
IPC分类号： H01L21/683 , H01L21/00 , H01L21/301 , H01L21/68
CPC分类号： H01L21/67132 , H01L21/67092
摘要： PROBLEM TO BE SOLVED: To provide an ultra-thin chip manufacturing process capable of simplifying production facilities, reducing production cost, and processing an ultra-thin wafer without damaging it. SOLUTION: The ultra-thin chip is manufactured by sequentially undergoing a wafer alignment step of taking out a wafer 2, to which a surface protection tape is adhered on the side thereof facing the surface of a circuit for positioning it; a wafer transfer step of transferring the positioned wafer 2 to supply it on a table 10 with the side, with the circuit surface facing downward; a dicing step of laser-dicing the wafer 2 which is chucked and held on the table 10, from the back of the side facing the circuit surface; a wafer-mounting step of adhering the laser-diced wafer 2 and a dicing frame 11 on the same table 10 to integrate both into a work W; a tape-stripping step of stripping the surface protection tape adhered to the surface of the wafer 2 facing the circuit surface; and a wafer storage step of storing the wafer 2 of which surface protection tape has been stripped. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供能够简化生产设备，降低生产成本，并且在不损坏超薄晶片的情况下处理超薄晶片的超薄芯片制造工艺。解决方案：超薄芯片是通过依次进行晶片取向步骤制造的，其中取出晶片2，其表面保护带被粘附在其面对电路表面的一侧，用于定位它; 传送定位的晶片2以将其提供在具有侧面的台10上的晶片传送步骤，电路表面朝下; 从面向电路表面的一侧的背面激光切割被夹持并保持在工作台10上的晶片2的切割步骤; 将激光切割晶片2和切割框架11粘接在同一工作台10上的晶片安装步骤，以将两者都集成到工件W中; 剥离粘附到晶片2的面向电路表面的表面的表面保护带的带剥离步骤; 以及晶片存储步骤，用于存储表面保护带被剥离的晶片2。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2004311980A Semiconductor manufacturing apparatus and method of manufacturing semiconductor device 有权
公开(公告)号：JP2004311980A
公开(公告)日：2004-11-04
申请号：JP2004085441
申请日：2004-03-23
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： KUROSAWA TETSUYA , TAKU SHINYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/52 , H01L21/301
CPC分类号： H01L2221/6839
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus which manufactures high-quality semiconductor devices by reducing the failures such as cracks, chipping or the like in semiconductor chips and has an adhesive-tape stripping mechanism which suppresses the degradation of the manufacturing yield, and to provide a method of manufacturing semiconductor devices. SOLUTION: The semiconductor manufacturing apparatus has a stripping-off mechanism, which vacuum-chucks the semiconductor-wafer side of the adhesive tape with porous material members, which have been separated into at least two chucking areas, and strips off the adhesive tape 24 glued on a semiconductor wafer, which has been diced into individual chips. The porous material members are held in relation to the stripping direction of the adhesive tape 24 by a holding table 3. In the semiconductor wafer, an adhesive layer is glued on each rear face of the semiconductor chip 1. The adhesive tape is stripped off from the semiconductor wafer by controlling vacuum pipe systems of two or more, which are connected to the porous material members, to switch the vacuum-chuck blocks and the vacuum systems, which have been separated into two or more, at about the same timing of the strip-off. The semiconductor chips are individually peeled off from the table. It is possible to fabricate stacked MCP products by stacking semiconductor chips. COPYRIGHT: (C)2005,JPO&NCIPI

6. 发明专利

JP2003338474A Machining method of brittle member 审中-公开
标题翻译：脆性成员加工方法
公开(公告)号：JP2003338474A
公开(公告)日：2003-11-28
申请号：JP2002146595
申请日：2002-05-21
申请人： Lintec Corp , リンテック株式会社
发明人： HORIGOME KATSUHIKO , MOCHIDA KINYA , IZUMI TADASHI
IPC分类号： C09J7/02 , C09J201/00 , H01L21/301 , H01L21/304 , H01L21/68 , H01L21/683
CPC分类号： H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386
摘要： PROBLEM TO BE SOLVED: To provide a machining method of a brittle member, wherein the brittle member is fixed to a smooth and hard substrate while the same can be surely separated irrespective of a heat treatment process when machining the brittle member, such as a semiconductor wafer or the like. SOLUTION: The brittle member is machined by a method wherein an adhesive double coated member, having a brittle member fixing part large enough to fix the brittle member and having an extended part at least in one part of the peripheral part of the brittle member fixing part, is employed when the brittle member is fixed to the substrate, larger than the brittle member, through the adhesive double coated member, then, arbitral machining is applied on the brittle member. Thereafter, the adhesive double coated member is separated from the brittle member at the boundary surface between the adhesive double coated member and the substrate from a starting point at the extended part of the adhesive double coated member. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供一种脆性构件的加工方法，其中脆性构件固定到光滑硬质基材上，而不管加工脆性构件时的热处理过程如何，都可以确定地分离脆性构件。作为半导体晶片等。解决方案：脆性构件通过一种方法加工，其中粘合剂双涂层构件具有脆性构件固定部分，该脆性构件固定部分足够大以固定脆性构件并且具有延伸部分至少在脆性区域的周边部分的一部分中当脆性构件通过粘合剂双重涂覆构件固定到基底上而大于脆性构件时，采用构件固定部分，然后对脆性构件施加仲裁加工。此后，粘合剂双面涂布构件在粘合剂双涂层构件的延伸部分的起点处从粘合剂双涂层构件和基底之间的边界表面与脆性构件分离。版权所有（C）2004，JPO

7. 发明专利

JP2008098428A Method of manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2008098428A
公开(公告)日：2008-04-24
申请号：JP2006278827
申请日：2006-10-12
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： KUROSAWA TETSUYA , TAKU SHINYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/301 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that allows to eliminate a dicing tape and a push-up pin or the like, which are conventionally used, in a series of semiconductor device manufacturing steps. SOLUTION: A first manufacturing method for a semiconductor device is composed of a step for sticking a surface protection sheet on a circuit face of a semiconductor wafer having a surface formed with a circuit, a step for grinding a rear face of the wafer, a step for dividing the wafer into individual pieces by performing full-cut dicing of the wafer from the ground-face side for each circuit while the wafer is being supported by the surface protection sheet, a step for suckingly fixing the wafer to a suction table, which has a plurality of independently-controllable suction parts so as to suckingly fix the wafer as a whole, while arranging the ground face of the wafer oppositely to the suction table, a step for exfoliating and removing the surface protection sheet from the wafer divided into individual pieces, a step for partially releasing or weakening a suction force by controlling each suction part of the suction table so as to pick up the wafer divided into individual pieces for each chip, and a step for bonding each chip to a semiconductor substrate. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种在一系列半导体器件制造步骤中能够消除常规使用的切割带和上推销等的半导体器件制造方法。解决方案：半导体器件的第一制造方法由用于将表面保护片粘贴在具有形成有电路的表面的半导体晶片的电路面上的步骤，用于研磨晶片的背面的步骤通过在晶片被表面保护片支撑的同时，对于每个电路从地面侧进行晶片切割切割，将晶片分割成单独的步骤，将晶片吸附到吸力工作台，其具有多个可独立控制的吸引部分，以便将晶片的接地面与吸盘对置布置，同时将晶片的整体吸入固定，用于从晶片剥离和去除表面保护片的步骤分为单独的部件，通过控制吸力台的每个吸入部分来部分地释放或削弱吸力的步骤，以便拾取分成各个部件的晶片fo r每个芯片，以及用于将每个芯片接合到半导体衬底的步骤。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2007220693A Wafer transcription method 有权
标题翻译： WAFER转录方法
公开(公告)号：JP2007220693A
公开(公告)日：2007-08-30
申请号：JP2004055720
申请日：2004-03-01
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , KOMIYAMA MIKIO , WATANABE KENICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a transcription method of wafers that can be picked up by using a universal pickup device. SOLUTION: A wafer 1, of which a circuit side is fixed on a first frame 3 through a first adhesive sheet 2, is transcribed into a state where a side opposite to the circuit side is fixed on a second frame 6 through a second adhesive sheet 7 by the wafer transcription method. The wafer 1 fixed on the first frame 3 is permitted to abut on a transcription table 5 having a diameter larger than that of the wafer 1 but smaller than the inner diameter of the first frame 3, with the first adhesive sheet 2 at the bottom. Then the first frame 3 is pulled down. Under such conditions, the second frame 6 with the second adhesive sheet 7 stuck thereon is arranged above the wafer 1. After sticking the second adhesive sheet 7 on the wafer 1, the first adhesive sheet 2 is peeled from the wafer 1, and the wafer 1 is transcribed on the second frame 6. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可以通过使用通用拾取装置拾取的晶片的转录方法。解决方案：电路侧通过第一粘合片2固定在第一框架3上的晶片1被转录成与电路侧相对的一侧通过第一框架6固定在第二框架6上的状态第二粘合片7通过晶片转录法。固定在第一框架3上的晶片1被允许邻接在第一粘合片2在底部的直径大于晶片1但直径小于第一框架3的内径的转录台5上。然后第一个框架3被拉下来。在这种条件下，第二粘合片7贴在其上的第二框架6被布置在晶片1的上方。将第二粘合片7粘贴在晶片1上之后，将第一粘合片2从晶片1剥离，并且晶片 1在第二帧6上转录。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2003324112A Method for manufacturing semiconductor device 审中-公开
标题翻译：制造半导体器件的方法
公开(公告)号：JP2003324112A
公开(公告)日：2003-11-14
申请号：JP2002128660
申请日：2002-04-30
申请人： Lintec Corp , リンテック株式会社
发明人： MOCHIDA KINYA , SENOO HIDEO
IPC分类号： H01L21/52
CPC分类号： H01L24/27 , H01L2224/83191
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device having excellent cost performance by a simple method by using an optimal adhesive sheet as an adhesive agent for die-bonding.
SOLUTION: The method for manufacturing the semiconductor device comprises steps of: dicing a semiconductor wafer in which a protection tape is stuck to a circuit surface to form an aggregate of chips; adhering and laminating adhesive films for die-bonding each having the approximately same size as each chip of the aggregate on the back side of each chip; picking up the chips by the adhesive film from the protection tape; and die-bonding the chips on a chip carrying substrate by the adhesive film.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种通过使用最佳粘合片作为芯片接合用粘合剂的简单方法来制造具有优异成本性能的半导体器件的方法。解决方案：制造半导体器件的方法包括以下步骤：将保护带粘附到电路表面的半导体晶片切割以形成芯片聚集体; 在每个芯片的背面上粘合和层压具有与每个芯片的每个芯片大致相同尺寸的芯片接合的粘合膜; 通过粘合膜从保护胶带拾取芯片; 并且通过粘合剂膜将芯片芯片粘合在携带芯片的衬底上。版权所有（C）2004，JPO

10. 发明专利

JP2008098427A Semiconductor device manufacturing method 审中-公开
标题翻译：半导体器件制造方法
公开(公告)号：JP2008098427A
公开(公告)日：2008-04-24
申请号：JP2006278826
申请日：2006-10-12
申请人： Lintec Corp , Toshiba Corp , リンテック株式会社 , 株式会社東芝
发明人： TAKU SHINYA , KUROSAWA TETSUYA , MOCHIDA KINYA , WATANABE KENICHI
IPC分类号： H01L21/301
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that contributes to simplification of a manufacturing process and improvement in product quality while allowing continuous execution of a pre-dicing method and a mounting process adopting flip chip bonding.
SOLUTION: The semiconductor device manufacturing method includes a step, in which an adhesive film 11 for die bonding is laminated on a circuit face of a semiconductor wafer 1 having a surface formed with a circuit, a step, in which the adhesive film 11 is completely cut and a groove 3 having a cut depth shallower than a thickness of the wafer is formed in a laminated body, composed of the adhesive film 11 and the wafer 1, from the wafer surface, a step for sticking a surface protection sheet 4 on the cut adhesive-film-face side, a step for thinning a thickness of the wafer 1 by grinding a rear face of the wafer 1 while dividing the wafer into individual chips, a step for picking up the individual chips together with the adhesive film 11 respectively, and a step for placing the individual chips respectively at each prescribed position in a chip mounting substrate via the adhesive film 11.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种有助于简化制造工艺和提高产品质量的半导体器件制造方法，同时允许连续执行预切割方法和采用倒装芯片接合的安装工艺。解决方案：半导体器件制造方法包括以下步骤：其中用于管芯接合的粘合膜11层压在具有形成有电路的表面的半导体晶片1的电路面上，其中粘合膜 11被完全切割，并且具有比晶片厚度浅的切割深度的凹槽3由晶片表面形成在由粘合膜11和晶片1组成的层叠体中，用于粘贴表面保护片在切割的粘合剂膜表面侧的步骤，通过在将晶片分成单独的芯片的同时研磨晶片1的后表面来减薄晶片1的厚度的步骤，用于将粘合剂与粘合剂一起拾取各个芯片的步骤并且分别通过粘合膜11将各个芯片分别放置在芯片安装基板的每个规定位置的步骤。版权所有（C）2008，JPO＆INPIT

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