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1. 发明专利

JP2010211179A Photoelectric composite wiring module and method for manufacturing the same 审中-公开
标题翻译：光电复合接线模块及其制造方法
公开(公告)号：JP2010211179A
公开(公告)日：2010-09-24
申请号：JP2009233978
申请日：2009-10-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： MATSUSHIMA NAOKI , NAKAJO TOKUO , MATSUOKA YASUNOBU , SUGAWARA TOSHIKI , MINAGAWA MADOKA , HAMAMURA SAORI , KANEKO SATOSHI , KONO TSUTOMU
IPC分类号： G02B6/42 , G02B6/122 , G02B6/13 , H01S5/022
CPC分类号： G02B6/4214 , H05K1/0274 , H05K1/185 , H05K3/4602 , H05K3/4644
摘要： PROBLEM TO BE SOLVED: To provide an photoelectric composite wiring module excellent in both performance and mass productivity, wherein the module is enhanced in transfer rate per channel while preventing increase in power consumption by connecting a drive circuit or amplifier circuit LSI of optical elements to electric wiring of the optical elements by a thin film wiring layer in a short distance, and is easy to assemble with high reliability since it adopts an easy connecting system to a transfer device such as a connector and conventional mounting of LSI; and to provide a transfer device using the same. SOLUTION: The photoelectric composite wiring module includes: optical elements 2a and 2b disposed on a first circuit board 1 so as to be optically coupled with an optical waveguide 11 formed on the first circuit board 1; an electric wiring layer 3 laminated on the upper layer of the optical elements, so that the electrodes of the optical elements are electrically connected to wires of the electric wiring layer 3; and an LSI mounted on and electrically connected to the electric wiring layer 3. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供性能和质量生产率优异的光电复合布线模块，其中模块通过连接驱动电路或光放大器电路LSI来防止电力消耗的增加，每个通道的传输速率提高元件通过薄膜布线层在短距离内的电气布线，并且由于采用容易的连接系统到诸如连接器的传输装置和LSI的常规安装，因此易于组装具有高可靠性; 并提供使用其的传送装置。光电复合布线模块包括：设置在第一电路板1上以与形成在第一电路板1上的光波导11光学耦合的光学元件2a和2b; 层叠在光学元件的上层的电布线层3，使得光学元件的电极电连接到电布线层3的导线; 和安装在电连接层3上并与其电连接的LSI。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2013248770A Resin pressurization casting device and pressurization casting method 有权
标题翻译：树脂加压铸造装置和加压铸造方法
公开(公告)号：JP2013248770A
公开(公告)日：2013-12-12
申请号：JP2012123915
申请日：2012-05-31
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKATSUCHI HIROKI , KONO TSUTOMU , MINO MASAYUKI , TSUCHIYA KENJI
IPC分类号： B29C39/44 , B29C39/24
摘要： PROBLEM TO BE SOLVED: To provide a resin pressurization casting device capable of adjusting pressure in a resin tank to become a target casing speed database selected by CAE or the like by obtaining loss including pipe resistance and resin viscosity change by measuring a pressure difference and a flow rate while passing the pipe from the resin tank for storing resin and a mold.SOLUTION: A resin pressurization casting device includes: a resin tank 1; a pipe 4 connecting the resin tank 1 and a mold 8; a flow rate measuring sensor 5 for measuring a resin amount; a resin pressurization sensor 6 for measuring a resin pressure; a target casting speed database 9; and a casting speed control part 10 that stores a measurement value of the flow rate measuring sensor 5, a measurement value of the resin pressurization sensor 6, and pressurization force data of the resin tank 1, obtains a loss coefficient caused by pipe resistance of the pipe 4, controls the pressurization force of the next step to the resin tank 1 and controls the speed of casting of the resin into the mold 8 based on the loss coefficient and information stored in the target casting speed database 9.
摘要翻译：要解决的问题：提供一种树脂加压铸造装置，其能够通过获得由CAE等选择的目标套管速度数据库来调节树脂罐中的压力，通过测量压力差来获得包括管阻和树脂粘度变化的损失，并且流过树脂加压铸造装置的树脂储罐1的树脂加压铸造装置。连接树脂箱1和模具8的管道4; 用于测量树脂量的流量测量传感器5; 用于测量树脂压力的树脂加压传感器6; 目标投射速度数据库9; 以及存储流量测量传感器5的测量值，树脂加压传感器6的测量值和树脂箱1的加压力数据的铸造速度控制部10，获得由管道阻力引起的损失系数管4将下一个步骤的加压力控制到树脂罐1，并且基于存储在目标铸造速度数据库9中的损失系数和信息来控制树脂进入模具8的速度。

3. 发明专利

JP2012101448A Calculation method and analysis program of shrinkage strain 有权
标题翻译：收缩应变的计算方法和分析程序
公开(公告)号：JP2012101448A
公开(公告)日：2012-05-31
申请号：JP2010252020
申请日：2010-11-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO TSUTOMU , MORITA AYUMI , MINO MASAYUKI , NAKATSUCHI HIROKI , OKANO TAKUYA , KOBAYASHI MASAHITO
IPC分类号： B29C45/76 , B29K101/10
摘要： PROBLEM TO BE SOLVED: To provide a calculation method of shrinkage strain by which the shrinkage strain of a resin is predicted in consideration of temperature history and the resin pressure of a thermosetting resin filled in a mold.SOLUTION: In the calculation method of the shrinkage strain, the resin shrinkage strain of the thermosetting resin is previously stored in a recording device as a formula of the shrinkage strain which includes the change of the reaction rate of the resin material, the change of the resin temperature and the resin pressure. The equation of continuity, Navier-Stokes equations and energy conservation equation are arithmetically operated by analysis system based on a 3-dimensional solid element decomposition-processed based on the shape of a space where the resin is filled and the content including the shrinkage strain of the thermosetting resin based on the formula of the shrinkage strain which is stored in the recording device is output.
摘要翻译：要解决的问题：提供考虑到温度历史和填充在模具中的热固性树脂的树脂压力来预测树脂的收缩应变的收缩应变的计算方法。解决方案：在收缩应变的计算方法中，将热固性树脂的树脂收缩应变预先存储在记录装置中，作为收缩应变的公式，其包括树脂材料的反应速率的变化，树脂温度和树脂压力的变化。连续性方程，Navier-Stokes方程和能量守恒方程由基于分解系统的分析系统运算，该三维固体元素基于填充树脂的空间的形状和含有收缩应变的含量进行分解处理输出基于存储在记录装置中的收缩应变式的热固性树脂。版权所有（C）2012，JPO＆INPIT

4. 发明专利

JP2011103089A Estimation method of void volume change produced in resin filled in porous body, and flow analysis method of resin material in porous body 有权
标题翻译：多孔体内填充的树脂中产生的无效体积变化的估计方法以及多孔体内树脂材料的流动分析方法
公开(公告)号：JP2011103089A
公开(公告)日：2011-05-26
申请号：JP2009258364
申请日：2009-11-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO TSUTOMU , NAKATSUCHI HIROKI , SUZUKI KEIJI , ONODA MITSURU , GOTO KAZUO , KAGEYAMA YASUAKI , KOJIMA KEIMEI , IKEDA KENJI , MOROOKA HISASHI
IPC分类号： G06F17/50 , B29C45/73 , B29C45/78 , B29K105/04
CPC分类号： G06F17/5018 , G06F2217/16 , G06F2217/41
摘要： PROBLEM TO BE SOLVED: To prevent dielectric breakdown by the selection of a condition to prevent a void using analysis.
SOLUTION: In regard to a temporal change of a gas production amount or the number of mols when a solid member is heated, a database is experimentally structured in advance. By use of a gas production amount from the member and a ratio of specific heat of gas as inputs for analysis, the condition to prevent the void is selected by the analysis and the estimation of the void to be produced in a resin, when the solid member is heated.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过选择使用分析来防止空隙的条件来防止介质击穿。解决方案：关于固体部件被加热时的气体产生量或摩尔数的时间变化，数据库被预先实验构成。通过使用来自构件的气体产生量和气体比热比作为用于分析的输入的比例，通过分析和估计在树脂中产生的空隙来选择防止空隙的条件，当固体会员加热版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2012081703A Method for analyzing growth of void of resin in porous body 有权
标题翻译：分析多孔体内树脂空隙生长的方法
公开(公告)号：JP2012081703A
公开(公告)日：2012-04-26
申请号：JP2010231764
申请日：2010-10-14
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： NAKATSUCHI HIROKI , KONO TSUTOMU , SUZUKI KEIJI , ONODA MITSURU , GOTO KAZUO , KAGEYAMA YASUAKI , SATO NAOHIRO
IPC分类号： B29C43/32 , B29C43/02 , B29K105/04 , G06F17/50
CPC分类号： G06F17/5009 , G06F17/5018 , G06F2217/76 , Y02T10/82
摘要： PROBLEM TO BE SOLVED: To provide a method for analyzing growth of voids of a resin in a porous body that allows comprehensive prediction of the generation/growth, flow behavior, and distribution of voids in a resin in resin impregnation molding of a porous body.SOLUTION: The method is configured to analyze the distribution of voids, generated inside a porous body impregnated with a resin material, by heating and compressing the porous body with a mold. The method comprises the following steps, that is: a step for dividing the shape of the porous body, filled with a resin material, into three-dimensional solid elements; a step for inputting physical properties of the porous body, filled with a resin material, and boundary conditions including pressurizing force for pressurizing the porous body with the mold; and a step for obtaining the resin-density distribution in the porous body, divided into the three-dimensional solid elements, by a fluid analysis while using a database obtained by experimentally measuring in advance a temporal change in volume of gas generated from the resin material when the porous body is heated with the mold. It is configured to illustrate the following distributions side by side on a screen, that is, the obtained resin-density distribution of the porous body divided into the three-dimensional solid elements, and the resin-density distribution of the porous body before being pressurized with the mold.
摘要翻译：要解决的问题：提供一种分析多孔体中的树脂的生长的方法，其能够综合地预测树脂的树脂浸渍成型中的树脂的生成/生长，流动行为和空隙的分布多孔体。解决方案：该方法被配置为通过用模具加热和压缩多孔体来分析在浸渍有树脂材料的多孔体内产生的空隙的分布。该方法包括以下步骤：将填充有树脂材料的多孔体的形状分成三维固体元素的步骤; 用于输入填充有树脂材料的多孔体的物理性质的步骤和包括用于对模具加压多孔体的加压力的边界条件; 以及通过流体分析获得分解成三维固体元素的多孔体中的树脂密度分布的步骤，同时使用通过实验测量获得的数据库，从而获得由树脂材料产生的气体的时间变化当多孔体被模具加热时。其结构是在屏幕上并排示出以下分布，即所获得的分为三维固体元素的多孔体的树脂密度分布和加压前的多孔体的树脂密度分布与模具。版权所有（C）2012，JPO＆INPIT

6. 发明专利

JP2006093722A Electronic apparatus 审中-公开
标题翻译：电子设备
公开(公告)号：JP2006093722A
公开(公告)日：2006-04-06
申请号：JP2005296174
申请日：2005-10-11
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： KONO TSUTOMU , IIDA MAKOTO , NAKAMURA SHOZO , KURAMOTO HIROKI , NAKAGAWA TAKESHI
IPC分类号： H05K5/00 , B29C33/12 , B29C45/14 , B29C45/26 , B29L9/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic apparatus in which deformation such as warpage is hardly generated and which has a structure suitable for recycling.
SOLUTION: A plurality of lower holes 1a, 1b are formed in a metal plate 1 as the framework of the box body of the electronic apparatus, and hooks 2a, 2b integrally molded on the backside of a molding part 2 as the external face of the box body are installed to each of the lower holes one by one. The lower hole 1b at a center constrains the movement of the hook 2b in an xy plane. Sliding regions for moving the hooks 2a in the direction (direction toward the fixed hook 2b) toward the center of the mold shrinkage of the molding part 2 are secured in other lower holes 1a. A boss hole 2c for a fixing screw is formed at the head of at least one sliding hook 2a. A screw for fixing a part housed in the box body is fitted into the boss hole 2c.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子装置，其中难以产生翘曲等变形并且具有适于再循环的结构。解决方案：在作为电子设备的箱体的框架的金属板1中形成有多个下孔1a，1b和作为外部的成型部件2的背面一体地模制的钩2a，2b 箱体的表面逐一安装到每个下孔上。在中心的下孔1b将钩2b的运动限制在xy平面中。用于使钩2a沿朝向固定钩2b的方向朝向成型部2的模具收缩的中心移动的滑动区域被固定在其他下部孔1a中。在至少一个滑动钩2a的头部上形成有用于固定螺钉的凸台孔2c。用于将容纳在箱体中的部分固定的螺钉装配到凸台孔2c中。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2004092958A Method for manufacturing refrigerator 审中-公开
公开(公告)号：JP2004092958A
公开(公告)日：2004-03-25
申请号：JP2002252340
申请日：2002-08-30
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OGAWA MASAKAZU , IZEKI TAKASHI , KONO TSUTOMU , ARAKI KUNINARI
IPC分类号： F16L59/04 , F25D23/08
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a refrigerator in which removal from a mold can be done in a short period of time and distortion is less.
SOLUTION: In the method for manufacturing a refrigerator, an outer box and an inner box are surrounded by an outer case and an inner case and an urethane resin is filled in a cavity, i.e., an internal space of the outer box and the inner box and is foamed to mold a heat insulation material. A plurality of temperature adjustment units, i.e., separate members are arranged on an outline of the outer case or the inner case or when there is an area where a thickness of the cavity partially becomes thick, the temperature adjustment units are arranged such that a boundary of the adjacent temperature adjustment units is provided on an outline of the area.
COPYRIGHT: (C)2004,JPO

8. 发明专利

JP2010184365A Support device for designing particle dispersion to thermosetting resin, support method and program 审中-公开
标题翻译：用于设计颗粒分散到热固性树脂的支持装置，支持方法和程序
公开(公告)号：JP2010184365A
公开(公告)日：2010-08-26
申请号：JP2009028371
申请日：2009-02-10
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAEKI JUNICHI , KONO TSUTOMU , TERAMAE TOSHIYA
IPC分类号： B29C37/00 , B29C45/76 , G06F17/50
CPC分类号： Y02T10/82
摘要： PROBLEM TO BE SOLVED: To estimate a behavior of a stirred particle rapidly precisely in a process of compounding the particle in a thermosetting resin.
SOLUTION: The support device of designing the particle dispersion to the thermosetting resin is composed of a model-making part 12 and a flow-analyzing part 13. The model-making part 12 defines shapes of a stirring vessel and a liquified resin part. An analyzing part 14 of the number of the particles in a cluster in the flow-analyzing part 13 calculates a change rate with time of the number of the particles in the cluster fed in the liquified thermosetting resin to obtain an approximate increase amount or an approximate decrease amount of the number of the particles in the cluster after a lapse of a minute time and successively obtain the number of the particles in the cluster at a new time. A thermosetting resin viscosity-analyzing part 15 in the flow-analyzing part 13 calculates the viscosity in the analyzing part 14 of the number of the particles in the cluster by using a viscosity calculating equation. A temperature and shear rate-analyzing part 16 in the flow-analyzing part 13 calculates a temperature and a distribution of a shear rate, and substitutes the result in the analyzing part 14 of the number of the particles in the cluster to successively calculate the distribution and change with time of the number of the particles in the cluster in a stirred layer.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：在将热塑性树脂中的颗粒复合的过程中快速精确地估计搅拌的颗粒的行为。解决方案：将颗粒分散体设计成热固性树脂的支撑装置由模制部件12和流动分析部件13构成。模制部件12限定搅拌容器和液化树脂的形状部分。流分析部13中的簇中的粒子数的分析部14计算在液化热固性树脂中供给的簇中的粒子数目随时间的变化率，以获得近似增加量或近似值在经过一段时间之后减少簇中的颗粒数量，并在新的时间连续获得簇中的颗粒数。流分析部13中的热固性树脂粘度分析部15通过使用粘度计算式来计算分析部14中的粒子数的粘度。流量分析部13中的温度和剪切速率分析部16计算剪切速度的温度和分布，并将分析部14中的粒子数的结果代入群中，以连续地计算分布并且随着时间的推移随着时间的推移而在簇中的颗粒数量发生变化。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2010108150A Thermal stress analysis method of electronic component and resin flow analysis method 有权
标题翻译：电子元件和树脂流动分析方法的热应力分析方法
公开(公告)号：JP2010108150A
公开(公告)日：2010-05-13
申请号：JP2008278269
申请日：2008-10-29
申请人： Elpida Memory Inc , Hitachi Ltd , エルピーダメモリ株式会社 , 株式会社日立製作所
发明人： KONO TSUTOMU , MINO MASAYUKI , TAKESHIMA HIDEHIRO , ITO HIROYUKI , GOI TOMOKO
IPC分类号： G06F17/50 , B29C45/76
CPC分类号： G01N3/00 , G01N2203/0214
摘要： PROBLEM TO BE SOLVED: To evaluate a curvature deformation amount by taking a relationship between a filling rate and a linear expansion coefficient of fillers filled in a resin into account in a resin in a resin filling process of a package. SOLUTION: A thermal stress analysis method of an electronic component performs a resin flow analysis by filling particles simulating fillers in a resin to calculate a filler filling rate at every spot in a package. Here, the method converts the filler filling rate at every spot into a linear expansion coefficient by using a database in which the filler filling rate and the linear expansion coefficient are experimentally calculated. The method can predict a curvature deformation amount by means of a structure analysis taking a linear expansion coefficient obtained from a distribution of the filler filling rates in the package into account by using the converted linear expansion coefficient as an input value for a thermal stress analysis. Further, after calculating a curvature deformation amount of a semiconductor package having a sheet shape in the manner, the method calculates curvature deformation amounts of individual packages by dividing the package into the respective substrate areas in which each chip operates electrically. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：通过在包装的树脂填充过程中考虑在树脂中填充的填料的填充率和线膨胀系数之间的关系来评估曲率变形量。解决方案：电子部件的热应力分析方法通过将模拟填料的颗粒填充到树脂中来计算填料中每个点的填充剂填充率来进行树脂流动分析。这里，通过使用实验计算填充填充率和线膨胀系数的数据库，将各点的填充填充率变换为线膨胀系数。该方法可以通过使用由转换的线性膨胀系数作为热应力分析的输入值而考虑从包装中的填料填充率的分布获得的线性膨胀系数的结构分析来预测曲率变形量。此外，在以这种方式计算具有片状的半导体封装的曲率变形量之后，该方法通过将封装分成其中每个芯片电连接的各个衬底区域来计算各个封装的曲率变形量。版权所有（C）2010，JPO＆INPIT

10. 发明专利

JP2008230089A Design supporting device for resin molding, supporting method and supporting program 有权
标题翻译：用于树脂模制的设计支持设备，支持方法和支持计划
公开(公告)号：JP2008230089A
公开(公告)日：2008-10-02
申请号：JP2007074108
申请日：2007-03-22
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： SAEKI JUNICHI , KONO TSUTOMU
IPC分类号： B29C45/76 , G06F17/50
CPC分类号： G06F17/5009 , G06F2217/16 , G06F2217/41 , G06F2217/80
摘要： PROBLEM TO BE SOLVED: To predict quickly and highly accurately the packing behavior at the time of resin injection regarding a thermosetting resin molding having a complicated obstacle.
SOLUTION: The model preparing section consists of a space-and-obstacle separation model preparing section and a space-and-obstacle synthesis model preparing section. The space-and-obstacle synthesis model preparing section handles the obstacle in which narrow spaces are provided regularly as a porous body. The thermosetting resin flow analyzing section consists of a space-and-obstacle separation analyzing section and a space-and-obstacle synthesis analyzing section and both have viscosity calculating formula on the thermosetting resin. The space-and-obstacle separation analyzing section analyzes by combining masses, kinetic momentums and energy conservation equations, the space-and-obstacle synthesis analyzing section analyzes by combining conservation equations objectifying the shape simplified as the porous body, and the resin flow behavior is analyzed while conducting the data giving-and-receiving in the interface of the space-and-obstacle separation model and the space-and-obstacle synthesis model.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了快速准确地预测树脂注射时对具有复杂障碍物的热固性树脂模制品的填充行为。解决方案：模型准备部分由空间和障碍物分离模型准备部分和空间与障碍物合成模型准备部分组成。空间障碍物合成模型准备部分处理作为多孔体定期提供狭窄空间的障碍物。热固性树脂流分析部由空间障碍物分离分析部和空间障碍物合成分析部构成，两者都具有热固性树脂的粘度计算式。空间障碍物分离分析部分通过组合质量，动力学和能量守恒方程进行分析，通过将简化为多孔体的形状组合的守恒方程和树脂流动行为相结合的空间与障碍物合成分析部分在空间和障碍物分离模型和空间障碍物合成模型的界面中进行数据给出和分析的同时进行分析。版权所有（C）2009，JPO＆INPIT

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