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    • 1. 发明专利
    • REVERSE CONDUCTION THYRISTER
    • JPS5645073A
    • 1981-04-24
    • JP12082879
    • 1979-09-21
    • HITACHI LTD
    • SHIMIZU YOSHITERUYAO TSUTOMUOOTA TAKEHIRO
    • H01L21/322H01L29/167H01L29/74
    • PURPOSE:To improve characteristics, in a device of conversely parallel, by providing a thyrister and a diode in a common semiconductor substrate through a separating region and making lifetime of minor carriers of a diode operating region shorter in the section near the separating region and larger in the section far from the separating region. CONSTITUTION:A diode high-impurity-concentration layer 20 is dispersedly formed in the center on reverse surface of an Si substrate 18, an anode emitter layer 19 is provided to surround the layer 20, and a reinforcing support plate 26 is attached onto this side. And then, No.2 base layer 22 is provided on the substrate 18, an annular cathode emitter layer 23 is dispersedly formed thereon, and a diode region and a thyrister region are separated by a separating region 27. Wgile a thyrister and a diode are connected in conversely parallel to provide a conversely conducted thyrister, by using an electron wire in a diode near the region 27 in such a constitution, Au lifetime killer is injected using an electron wire allowing a noninjected section 24 to exist. It is possible, by doing so, to control peak value of reverse recovery current.
    • 3. 发明专利
    • Semiconductor device
    • 半导体器件
    • JPS57117276A
    • 1982-07-21
    • JP316481
    • 1981-01-14
    • Hitachi Ltd
    • SAKURADA SHIYUUROKUMATSUZAKI HITOSHIIKEDA HIROHIKOOOTA TAKEHIRO
    • H01L29/73H01L21/331H01L23/482H01L29/08H01L29/417H01L29/74H01L29/744
    • H01L29/41716H01L23/4824H01L29/0804H01L29/0839H01L29/41708H01L29/74H01L2924/0002Y10S148/14H01L2924/00
    • PURPOSE: To enlarge controllable withstand current quantity of a semiconductor device by a method wherein an N type emitter is extended continuously up to the lower part of bonding pad part of a cathode electrode, and an insulator of silicon oxide film, etc., is interposed between the cathode electrode and the N type emitter.
      CONSTITUTION: A switching functional part 300A constitutes a P-N-P-N thyristor having structure in which a P type emitter 304 is short-circuited to an anode electrode 301. An N type emitter 307 is provided facing with the P type emitter 304 interposing an N type base 305 and a P type base 306 between them. The N type emitter 307 has structure extended up to a bonding pad part 300B. A gate electrode 303 is provided on the P type base 306 as to interposed the N type emitter 307 between them. At the bonding pad part 300B, a silicon oxide film 308 is interposed between a cathode electrode 302 and the N type emitter.
      COPYRIGHT: (C)1982,JPO&Japio
    • 目的:为了扩大半导体器件的可控耐受电流量,其中N型发射极连续延伸到阴极电极的焊盘部分的下部,并插入氧化硅膜等的绝缘体 在阴极电极和N型发射极之间。 构成:开关功能部件300A构成具有P型发射极304与阳极301短路的结构的PNPN晶闸管。设置有N型发射极307,P型发射极304与N型基极305 和它们之间的P型基底306。 N型发射器307具有延伸到接合焊盘部分300B的结构。 在P型基底306上设置有用于在它们之间插入N型发射体307的栅电极303。 在接合焊盘部分300B处,氧化硅膜308插在阴极电极302和N型发射极之间。
    • 5. 发明专利
    • Formation of metallic pattern
    • 形成金属图案
    • JPS6165455A
    • 1986-04-04
    • JP18635284
    • 1984-09-07
    • Hitachi Ltd
    • NAGABORI WATARUNISHIYAMA TATSUOOOTA TAKEHIRO
    • H01L21/3205H01L21/88
    • PURPOSE:To prevent the contamination of the metallic layer surface with thermal decomposition gas and its deposition by burning off a photo resist layer under a reduced pressure. CONSTITUTION:The photo resist layer 3 is formed by coating in the partof no need of metallic patterns. After a metal 4 is evaporated over the surface of the semiconductor substrate 1, a very small air gap is formed between an SiO2 layer 2 and the metallic layer 4 by burning off the photo resist layer 3 under a reduced pressure. Then, the thermal decomposition gas of photo resist is diffused by dilution and immediately exhausted to the vacuum exhaust system. This action prevents the contamination of the surface of the metallic layer 4 with thermal decomposition gas and its deposition.
    • 目的:防止金属层表面被热分解气体污染,并通过在减压下烧掉光致抗蚀剂层而沉积。 构成:光刻胶层3通过不需要金属图案的方式涂覆而形成。 在半导体衬底1的表面上蒸发金属4之后,通过在减压下烧掉光刻胶层3,在SiO 2层2和金属层4之间形成非常小的气隙。 然后,光刻胶的热分解气体通过稀释扩散,并立即排出到真空排气系统。 这种作用防止金属层4的表面被热分解气体及其沉积物污染。
    • 6. 发明专利
    • SEMICONDUCTOR DEVICE
    • JPS5610967A
    • 1981-02-03
    • JP8496479
    • 1979-07-06
    • HITACHI LTD
    • SHIMIZU YOSHITERUNAGANO TAKAHIROSAKURADA SHIYUUROKUOOTA TAKEHIRO
    • H01L29/08H01L29/74H01L29/744
    • PURPOSE:To obtain the preferable arc extinguishing characteristics of the semiconductor device by forming a rectangular emitter of cathode side on one main surface of a circular semiconductor substrate, forming a control electrode on an exposed base layer, forming an emitter of anode side at the cathode and emitter projected portion on the other main surface thereof, and connecting it with an emitter shorting layer. CONSTITUTION:An emitter layer 6 of cathode side is radially formed in rectangular state from a half portion of radius on one main surface of an Si substrate 1, and a P-N junction between the base layer 5 and the layer 6 is exposed in mesa portion. An emitter 3 of anode side is formed on the projected portion of the exposed junction end to the anode side to form a shorting emitter architecture with an emitter shorting layer 2. A cathode electrode 9 is attached onto the layer 6, a control electrode 8 is attached onto the layer 5, a lead wire 10 is attached to the central portion P, and an anode electrode 3 is attached onto the other main surface. Since the layer 2 is expanded in sector state to increase the shorting emitter effect in this configuration, it can increase the stored carrier drawing effect to execute uniform arc distinguishing operation to thus eliminate the concentration of the current to partial portion so as to obtain a high speed arc extinguishing operation therein.