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1. 发明专利

JP2003060372A Method of cooling electronic apparatus and electronic apparatus 有权
标题翻译：冷却电子设备和电子设备的方法
公开(公告)号：JP2003060372A
公开(公告)日：2003-02-28
申请号：JP2002198468
申请日：2002-07-08
申请人： Hitachi Ltd , 株式会社日立製作所
发明人： OHASHI SHIGEO , HATADA TOSHIO , TANAKA SHINJI
IPC分类号： G06F1/20 , H01L23/36 , H01L23/473 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To effectively transport heat generated by heating components mounted even in a narrow space of an electronic apparatus, together with other members, irrespective of the components layout. SOLUTION: The electronic apparatus comprises a metallic heat receiving member 14 having a cooling liquid passage mounted on heating components 1 among electronic components, a metallic radiating member 16 having a cooling liquid passage mounted on a cabinet 10 of the electronic apparatus, a resin-made flexible tube 18 having a cooling liquid circulation passage for connecting the passages of the receiving member and the radiating member, and a means for circulating the cooling liquid between the receiving and radiating members.
摘要翻译：要解决的问题：即使在电子设备的狭窄空间中加热部件与其它部件一起，也可有效地传输热量，而不管组件布局如何。解决方案：电子设备包括金属制热体14，其具有安装在电子部件中的加热部件1上的冷却液通道，具有安装在电子设备的机壳10上的冷却液通道的金属散热部件16，树脂制柔性管18具有用于连接接收部件和散热部件的通路的冷却液循环通路，以及使冷却液在接收部件和散热部件之间循环的机构。

2. 发明专利

JP2002196843A ELECTRONIC EQUIPMENT DEVICE 审中-公开
公开(公告)号：JP2002196843A
公开(公告)日：2002-07-12
申请号：JP2001368920
申请日：2001-12-03
申请人： HITACHI LTD
发明人： OHASHI SHIGEO , HATADA TOSHIO , TANAKA SHINJI
IPC分类号： G06F1/20 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To cool a heat generating member by efficiently transporting the generated heat of the heat generating member to a metallic casing wall being a heat dissipating part even in a device in which the heat generating member and the other members are mounted in the narrow casing. SOLUTION: A heat generating member and a metallic casing wall are thermally connected to each other by a heat transporting device in a flexible structure. The heat transporting device is provided with a flat heat receiving header 14 dissipating having a liquid flow channel mounted on the heat generating member 1, a heat member 16 having a liquid flow channel brought into contact with the wall of a metallic casing 10, and a flexible tube 18 for connecting both of them so that liquid sealed inside can be driven or circulated between the heater receiving header and the heat dissipating part by a liquid driving mechanism built in the heat dissipating part. Thus, the heat generating member and the casing wall can be easily connected to each other without being affected by the component array, and heat can be highly efficiently transported according to the driving of liquid. In the heat dissipating part, the heat radiating part an the metallic casing wall are thermally connected to each other so that the heat can be widely dispersed to the casing wall due to the high thermal conductivity of the metallic casing, and that high heat dissipating performance can be obtained.

3. 发明专利

JPH11317491A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11317491A
公开(公告)日：1999-11-16
申请号：JP7513399
申请日：1999-03-19
申请人： HITACHI LTD
发明人： SHIRAI MASAYUKI , OTSUKA KANJI , MIWA TAKASHI , NAKANO TETSUO , KOIDE KAZUO , YAMAGIWA AKIRA , OBA TAKAO , HATADA TOSHIO , MATSUSHIMA HITOSHI , MIYAZAKI KUNIO
IPC分类号： H01L23/12 , H01L23/34 , H01L25/00
摘要： PROBLEM TO BE SOLVED: To reduce cost and improve reliability and performance by providing a bypass capacitor between a plurality of wiring layers formed along each of first and second sides and a wiring layer closet to a plurality of wiring layers along the first side from among a plurality of wiring layers along the second side. SOLUTION: A mounting space 19 of a chip-type bypass capacitor 14 is secured on a power supply layer 4b or a signal layer 4c. The power supply layer 4b or the signal layer 4c that opposes the corner part of a chip 1 is set to a non-wired region and the bypass capacitor 14 is provided, and a wiring layer for connecting the bonding wire 7 is centered in parallel at both the sides. The tip of each wiring faces opposite a pad 1a of the chip 1, thus preventing bonding treatment from being interfered by the bypass capacitor 14. Both the terminals of the bypass capacitor 14 being installed at the non-wired region are connected to the power supply layer 4b and the grounding layer 4a. Also, the bonding wire 7 is connected between the terminal of the wiring layer and the pad 1a of the chip 1.

4. 发明专利

JPH1191024A WATER REPELLENT MATERIAL AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH1191024A
公开(公告)日：1999-04-06
申请号：JP25468997
申请日：1997-09-19
申请人： HITACHI LTD
发明人： MUROI KATSUMI , WATABE YOSHITO , HATADA TOSHIO , KOGURE HIROSHI , KOKUNI KENSAKU
IPC分类号： B01J35/02 , B32B7/02 , B32B9/00 , C23C28/00 , F28F13/18
摘要： PROBLEM TO BE SOLVED: To make last the configuration of a water repellent treatment for a long period of time by forming a foul-decomposing catalyst thin film layer on the hydrated oxide layer, and also forming a water repellent skin film thereon. SOLUTION: A hydrated oxide film layer 1 is formed on the upper surface of a base plate 5 consisting of aluminum or aluminum alloy. Since the surface form of the hydration oxide film layer 1 has the unevenness of a nanometer order, it is in an extremely complicate uneven structure. A foul decomposing catalyst layer 2 is formed on the hydrated oxide film layer 1 via a binder 3, and further, a water repellent substance 4 is formed on the foul decomposing catalyst layer 2 and binder 3. For the water repellent film layer 4, there is used a fluorine compound having a constitution permitting gas to pass therethrough. For the foul decomposing catalyst, TiO2 is given as a typical catalyst, there is employed substances in a fine particle or film state. As an example, minute particles of TiO2 being a kind of catalysts are adhered on the surface via a binder.

5. 发明专利

JPH10197184A HEAT TRANSFER TUBE EQUIPPED WITH INTERNAL FIN AND HEAT EXCHANGER 失效
公开(公告)号：JPH10197184A
公开(公告)日：1998-07-31
申请号：JP372997
申请日：1997-01-13
申请人： HITACHI LTD
发明人： ITO MASAAKI , SHIKAZONO NAOKI , UCHIDA MARI , HATADA TOSHIO , YASUDA HIROSHI , KOGURE HIROSHI
IPC分类号： F25B39/00 , F28F1/40 , F28F13/18
摘要： PROBLEM TO BE SOLVED: To improve heat transmitting performance of transfer of condensing or boiling heat and prevent deformation of fine intermittent fins upon mechanical expanding of a tube by a method wherein the crests of recesses and projections are flattened substantially while the sectional configuration of the projection at a plane along the lengthwise direction of the fin is formed of a truncated or oblong shape. SOLUTION: Fine recesses and projections are provided on the inner diametral side end of a multitude of threads of primary fins 101 and are provided with the crest 102 of a projection and the trough 103 of the recess while the crest 102 is formed of a substantially flat rectangular form. The crest 102 of projection of the intermittent fins is formed of a substantially flat rectangular shape before expanding the tube in such a manner whereby an area, receiving the expanding force of the pipe, is enlarged and the amount of burs due to deformation is reduced. Further, a secondary groove is provided so as to be orthogonal to the primary fin 101 whereby the generation of fine projected acute angle parts on the crest can be avoided. According to this method, the deformation of the inner surface of the fins can be minimized and, as a result, a high heat transmitting performance, proper to the intermittent fin having fine recesses and projections, can be maintained.

6. 发明专利

JPH10196984A AIR CONDITIONER 失效
公开(公告)号：JPH10196984A
公开(公告)日：1998-07-31
申请号：JP373097
申请日：1997-01-13
申请人： HITACHI LTD
发明人： KUDO MITSUO , HATADA TOSHIO , NAKAMURA HIROO , TAKADA YOSHIHIRO , FUNAKOSHI SAHO , KOGURE HIROSHI , TAKAKU SHOJI , MORIMOTO MOTOO
IPC分类号： F24F1/00
摘要： PROBLEM TO BE SOLVED: To provide a heat pump type air conditioner which enables miniaturization of a unit with an improved heating capacity and exertion of a high heating capacity even at a low outdoor air temperature. SOLUTION: An air conditioner composed of an outdoor unit 10 equipped with a compressor 11, an outdoor heat exchanger 13, an outdoor fan 17 and an expansion mechanism 16 and of an indoor unit 20 equipped with an indoor heat exchanger 21 and a cross flow fan 24. The indoor heat exchanger 21 is constituted of indoor main heat exchangers (22a, 22b) and an indoor precooler 30 disposed sequentially from the upstream side along an air flow 21 generated by the cross flow fan 24 and the outdoor heat exchanger 13 is constituted of an outdoor main heat exchanger 14 and an outdoor precooler 32 disposed sequentially from the upstream side along an air flow 18 generated by the outdoor fan 17. These are connected by piping so that a refrigerant may flow from the indoor precooler 30 to the indoor main heat exchangers (22a, 22b) and from the outdoor main heat exchanger 14 to the outdoor precooler 32 at the time of a heating cycle.

7. 发明专利

JPH1054683A HEAT EXCHANGER 失效
公开(公告)号：JPH1054683A
公开(公告)日：1998-02-24
申请号：JP20981896
申请日：1996-08-08
申请人： HITACHI LTD
发明人： SHIKAZONO NAOKI , HATADA TOSHIO , ITO MASAAKI , KIMURA HIDEYUKI , TAKEDA SUMIYOSHI , KOKUNI KENSAKU , IZUSHI MINETOSHI , YASUDA HIROSHI
IPC分类号： F28F1/32
摘要： PROBLEM TO BE SOLVED: To provide a heat exchanger, high in a fin efficiency, capable of intercepting heat transfer generated from neighboring heat transfer tubes through fins, high in actual density and the degree of freedom and reduced in pressure loss. SOLUTION: In a heat exchanger, a plurality of heat transfer tubes, having individually independent fins fixed thereto with a given pitch, are arranged horizontally so as to be arrayed in a multitude of stages, and a pipeline, reciprocating alternately across an initial stage and a final stage, is formed while air stream is supplied so as to intersect with a plurality of heat transfer tubes respectively. In this case, a plurality of heat transfer tubes 2 are arrayed in zigzag with respect to the air stream from the initial stage to the final stage while a fin 1 is provided with a hexagonal configuration and is attached to the heat transfer tube 1 so that one set of opposing angles are faces upward and downward. Further, the hexagonal fins 1, fixed to neighboring heat transfer tubes, are in contact with each other through one side of the hexagonal configuration while the fore rim and rear rim of one series of hexagonal fins 1, contacted across the initial stage and the final stage, are constituted so as to show the recessed and projected configurations.

8. 发明专利

JPH06301450A AIR-COOLED ELECTRONIC EQUIPMENT 失效
公开(公告)号：JPH06301450A
公开(公告)日：1994-10-28
申请号：JP8969593
申请日：1993-04-16
申请人： HITACHI LTD
发明人： KONDO YOSHIHIRO , HONMA TETSURO , IWAI SUSUMU , YAMADA HIROSHI , MORITA KAZUO , ITO HIROSHI , MATSUSHIMA HITOSHI , HATADA TOSHIO , IIDA AKIYOSHI , SHIMOIDE SHINICHI , KUMAGAI KENTA
IPC分类号： G06F1/20
摘要： PURPOSE:To perform efficient cooling and further to make the temperature distribution of a chip uniform and to obtain a reliability improving method, a method for reducing fan power, reduction of the noise of the whole housing, and diverse development of design. CONSTITUTION:Flow passages of >=2 systems are formed in the housing of a high- performance arithmetic machine 1 to provide cooling fans 7 between heat generation bodies in the respective flow passages, provide a flow passage exit below, arrange the cooling fans 7 separately from each other, provide a cooling fan in a corner of a bent flow passage, arrange the cooling fans 7 separately in the horizontal direction, constitute the whole housing in double structure, form the CPU package of a core in a duct shape, or provide a resin molding at the center part of a front panel. Thus, >=2 flow passages are provided and the cooling fans 7 are provided between the heat generation bodies in the respective flow passages to actualize maintenance similar to conventional maintenance, and to make the temp. distribution of each package and each heat generation body uniform, cooling performance improvement, reliability improvement, reduction of fan power, and reduction of the noise of the whole housing are obtained, and inexpensive and diverse design development can be performed.

9. 发明专利

JPH06177299A COOLING DEVICE 失效
公开(公告)号：JPH06177299A
公开(公告)日：1994-06-24
申请号：JP32642292
申请日：1992-12-07
申请人： HITACHI LTD
发明人： SATO KAZUO , SHIKIDA MITSUHIRO , OHASHI SHIGEO , HATADA TOSHIO , ASHIWAKE NORIYUKI , TANAKA SHINJI , HARADA TAKESHI
IPC分类号： H01L23/467 , H05K7/20
摘要： PURPOSE:To provide a thin, low-power and efficient cooling device by using a flexible film with fixed ends and means for driving the film to change its mode of deformation. CONSTITUTION:A cooling device 1 comprises two flat electrodes 31 and 32 opposed with a gap 37 that is defined by side plates 5 and 6. The gap contains a flexible film 4 whose ends are fixed by the electrodes 31 and 32 and the side plates 5 and 6. The flexible film changes its mode of deformation by a driving means. Such a cooling device, with an S-shaped flexible film fixed in the gap 37, is attached to a semiconductor package 2 in such a manner that one electrode 31 is in close contact. The electrodes 31 and 32 are alternately energized to move the S-shaped part of the film.

10. 发明专利

JPH0697338A ELECTRONIC DEVICE 失效
公开(公告)号：JPH0697338A
公开(公告)日：1994-04-08
申请号：JP33658991
申请日：1991-12-19
申请人： HITACHI LTD , HITACHI COMPUTER ELECTRONIC
发明人： SHIN TAKAYUKI , HATADA TOSHIO , OGURO TAKAHIRO , MINAMITANI RINTARO , TSUKAGUCHI TAMOTSU , KOIZUMI SHIGERU , KURIHARA KEIICHI
IPC分类号： F28D15/02 , G06F1/20 , H01L23/473 , H05K7/20
摘要： PURPOSE:To achieve a reduced an installation space, ensured installability equivalent to that of a conventional air-cooled electronic device, a reduced time which installation work requires, a small-sized pump and an improved reliability when a refrigerant leaks or when a pipe is eroded in a liquid-cooled type electronic device. CONSTITUTION:An electronic circuit casing 1 is constituted in such a way that it has an L-shaped cross section. A cooling casing 2 for cooling a liquid refrigerant is connected and fitted to this L-shaped electronic circuit casing 1 by means of couplings 62, whereby the entire casings are assembled into a rectangular-parallelopiped single unit. The cooling casing 2 for the liquid- refrigerant houses a heat exchanger 28, a fan 38, a pump 32, a device 32 for maintaining the purity of the refrigerant, and devices for cooling heat-generating electronic components 20. The cooling casing cools the heat-generating components 20 that are mounted on a substrate 22 with a partition plate 61 sandwiched between the cooling casing and the substrate.

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