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1. 发明专利

JPH0697338A ELECTRONIC DEVICE 失效
公开(公告)号：JPH0697338A
公开(公告)日：1994-04-08
申请号：JP33658991
申请日：1991-12-19
申请人： HITACHI LTD , HITACHI COMPUTER ELECTRONIC
发明人： SHIN TAKAYUKI , HATADA TOSHIO , OGURO TAKAHIRO , MINAMITANI RINTARO , TSUKAGUCHI TAMOTSU , KOIZUMI SHIGERU , KURIHARA KEIICHI
IPC分类号： F28D15/02 , G06F1/20 , H01L23/473 , H05K7/20
摘要： PURPOSE:To achieve a reduced an installation space, ensured installability equivalent to that of a conventional air-cooled electronic device, a reduced time which installation work requires, a small-sized pump and an improved reliability when a refrigerant leaks or when a pipe is eroded in a liquid-cooled type electronic device. CONSTITUTION:An electronic circuit casing 1 is constituted in such a way that it has an L-shaped cross section. A cooling casing 2 for cooling a liquid refrigerant is connected and fitted to this L-shaped electronic circuit casing 1 by means of couplings 62, whereby the entire casings are assembled into a rectangular-parallelopiped single unit. The cooling casing 2 for the liquid- refrigerant houses a heat exchanger 28, a fan 38, a pump 32, a device 32 for maintaining the purity of the refrigerant, and devices for cooling heat-generating electronic components 20. The cooling casing cools the heat-generating components 20 that are mounted on a substrate 22 with a partition plate 61 sandwiched between the cooling casing and the substrate.

2. 发明专利

JP2004214694A Cooling system for electronic device and electronic device with cooling system 审中-公开
公开(公告)号：JP2004214694A
公开(公告)日：2004-07-29
申请号：JP2004053156
申请日：2004-02-27
申请人： Hitachi Kokusai Electric Inc , Hitachi Ltd , 株式会社日立国際電気 , 株式会社日立製作所
发明人： KUROKAWA KENJU , SAITO AKIRA , FUKUKAWA TOSHIO , HARADA MAKIO , YAZAWA HIDEO , OGURO TAKAHIRO
IPC分类号： F25D1/00 , F25D9/00 , H05K7/20
摘要： PROBLEM TO BE SOLVED: To facilitate cooling pipe piping work, to prevent leakage of a liquid refrigerant, and to improve operation efficiency while preventing dewing and freezing by controlling heat exchange capacity of a heat exchanger unit, in a cooling system for an electronic device and the electronic device with the cooling system.
SOLUTION: A part of a cooling pipe is flattened. This flat part is cooled by contacting with respective electronic parts, and piping work is facilitated. Pipe connecting parts are reduced to prevent leakage of the liquid refrigerant. The operation efficiency is improved while preventing the dewing and the freezing by controlling the heat exchange capacity of the heat exchanger unit of the cooling system in response to an external temperature, an internal temperature of the electronic device and a temperature of liquid refrigerant. The electronic device having electronic systems of two systems has a common liquid refrigerant tank of respective cooling systems of the electronic systems of the two systems, resulting in preventing the dewing and the freezing of the cooling systems of the resting side of the electronic system.
COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2000012748A ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JP2000012748A
公开(公告)日：2000-01-14
申请号：JP17432498
申请日：1998-06-22
申请人： HITACHI LTD
发明人： HARADA MASAHIDE , YAMADA OSAMU , KASAI KENICHI , OGURO TAKAHIRO , NEZU TOSHITADA , UDA TAKAYUKI , SHIRAI MITSUGI
IPC分类号： B23K35/26 , H01L23/36 , H01L23/373 , H01L23/40
摘要： PROBLEM TO BE SOLVED: To enhance the thermal conductivity of a solder material and improve the thermal conductivity of a solder connection part between LSIs and a heat sink by a method, wherein particles of a metal or ceramics having a thermal conductivity larger than that of the solder material per se are mixed with the solder material. SOLUTION: A solder bump composed of tin-silver is formed in a LSI package 3, and this is weld-connected 4 to a ceramic module substrate 2. Next, a substance in which a copper particle containing solder sheet prepared previously is cut off, in response to a back face region of the LSI package 3 is placed on the back face of the LSI package 3, so as to solder-connect 6 to a heat sink 1. With such a connection structure, heat generated in the LSI propagates to the heat sink 1 via the solder connection part 6, and as a result the LSI is cooled. Since copper particles having larger thermal conductivity than that of a solder material itself exist in the solder connection part 6, a more satisfactory heat conduction is attained and satisfactory cooling characteristic is attained.

4. 发明专利

JPH09157039A DEVICE FOR PRODUCING MULTILAYER CERAMIC SINTERED COMPACT 失效
公开(公告)号：JPH09157039A
公开(公告)日：1997-06-17
申请号：JP31803395
申请日：1995-12-06
申请人： HITACHI LTD
发明人： OSONE YASUO , HIRASAWA SHIGEKI , TAGAMI BUNICHI , ONOZAWA AKIRA , OGURO TAKAHIRO
IPC分类号： B30B11/02 , C04B35/645 , H01G4/12 , H01G4/30 , H01G13/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To fire a ceramic sintered compact enhanced in dimensional accuracy in the production device for heating and firing the multilayer ceramic sintered compact while exerting a pressure by reducing the temp. distribution in the laminate. SOLUTION: A low-heat-conductivity material is used for a press shaft 13, the shaft is hollowed to increase the heat resistance to reduce the outflow of heat to the outside, and the shaft 13 is heated by a heater 14 to make up for the heat loss. Consequently, the tamp. distribution in the laminate 11 and between the laminates 11 is reduced, and a multilayer ceramic sintered compact is fired while maintaining high dimensional accuracy.

5. 发明专利

JPH0964257A ELECTRONIC CIRCUIT COOLING MODULE, LSI PACKAGE AND COMPUTER 失效
公开(公告)号：JPH0964257A
公开(公告)日：1997-03-07
申请号：JP21865895
申请日：1995-08-28
申请人： HITACHI LTD
发明人： CHINOKA TOSHINORI , TAKEHARA HIROKO , KAWAMURA KEIZO , OGURO TAKAHIRO , KASAI KENICHI
IPC分类号： H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable electronic circuit cooling module, which can efficiently transmit the heat generated from an LSI device to a cooler, securing a high level of chemical stability without reaction to the constituent member of itself, in the long term of use of a heat conductive medium, and an LSI package. SOLUTION: In an electronic circuit cooling module, which has inner structure for transmitting heat to an external cooler 5 for radiating heat generated from an electronic circuit such as an LSI device 3 or the like to outside, the cavity 14 within the module is charged with fluid of 400cps or under in viscosity where a phenolic oxidation inhibiter is added to synthetic oil excellent in heat conductivity, electric insulation, and chemical stability, as a heat conductive medium 9, and the residual air gap 10 is charged with nonoxidizing gas.

6. 发明专利

JPH08195455A COOLER FOR SEMICONDUCTOR 失效
公开(公告)号：JPH08195455A
公开(公告)日：1996-07-30
申请号：JP470295
申请日：1995-01-17
申请人： HITACHI LTD
发明人： SASAKI SHIGEYUKI , ASHIWAKE NORIYUKI , KIMURA HIDEYUKI , KAWAMURA KEIZO , OGURO TAKAHIRO
IPC分类号： H05K7/20 , H01L23/34 , H01L23/467
摘要： PURPOSE: To obtain a cooler for a semiconductor with pins for supplying power to a multichip module mounting a semiconductor element generating heat intensively and communicating signal therewith and having structure for air cooling a low load insertion connector forcibly. CONSTITUTION: Connectors 6 are planted on a printed board 7 at positions corresponding to pins 5 for supplying power and communicating signals on a multilayer ceramic wiring board 1 for mounting a semiconductor element 2. End part 6a of the connector 6 penetrates the printed board 7 farther than the thickness thereof and cooling air 14 is blown thereto by means of a fan 13.

7. 发明专利

JPH0863261A ELECTRONIC DEVICE 失效
公开(公告)号：JPH0863261A
公开(公告)日：1996-03-08
申请号：JP19513994
申请日：1994-08-19
申请人： HITACHI LTD
发明人： SHIN TAKAYUKI , HATADA TOSHIO , TANAKA TETSUYA , KOBAYASHI JUNICHI , TAKANASHI AKIHIRO , OGURO TAKAHIRO , WATANABE YUTAKA
IPC分类号： G06F1/20 , H05K7/20
摘要： PURPOSE: To cool respective semiconductor components according to their heating values and obtaining optimum operation temperature, to improve the calculation throughput and to save the electric power by supplying cooling liquid to the heat-generating semiconductor components independently and controlling their flow rates. CONSTITUTION: To supply cooling air to the heat-generating semiconductor components 2a-2c mounted on a substrate, ducts 4 are provided corresponding to plural substrates. The cooling air supplied by a cooling fan 3a is jetted from holes bored in the ducts 4 to cool the heat-generating semiconductor components 2a and 2c by jetting. Plural cooling fans 3a are fitted so as to send the air by the substrates on which the heat-generating semiconductor components 2a and 2c are mounted individually. Similarly, plural cooling fans 3b are fitted so as to cool the heat-generating semiconductor components 2b. Then heat sensing diodes provided to the heat-generating semiconductor components 2a-2c detect temperature and the rotating speeds of the cooling fans 3a and 3b are controlled according to the detected temperature to vary the cooling capability.

8. 发明专利

JPH0786471A SEMICONDUCTOR MODULE 失效
公开(公告)号：JPH0786471A
公开(公告)日：1995-03-31
申请号：JP23279693
申请日：1993-09-20
申请人： HITACHI LTD
发明人： ASHIWAKE NORIYUKI , OGURO TAKAHIRO , KASAI KENICHI , KAWAMURA KEIZO , KIMURA HIDEYUKI , NISHIHARA ATSUO , HATADA TOSHIO , IINO TOSHIYOSHI
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473
摘要： PURPOSE:To provide a semiconductor module with high capacity of absorbing dynamic displacement caused by thermal deformation and good heat radiation by providing a coupler with a built-in valve that connects and disconnects the tubes that charge and discharge cooling fluid and from the ducts formed in the housing. CONSTITUTION:Helium gas or a fluid such as an insulating oil is sealed inside the space surrounded by a housing 7 and a board 2. Ducts 13 through which cooling fluid flows are formed integrally with a housing 7 on the upper surface of the housing 7 and an upper lid is attached covering the ducts 13. A coupler 14 in which a valve mechanism is built is provided on the housing 7 or the upper lid and the cooling fluid is charged and discharged from and to the outside through the coupler 14. In such a way large thermal deformation caused by high heat radiating density is absorbed the heat from a semiconductor device is radiated efficiently.

9. 发明专利

JPH0766339A SEMICONDUCTOR COOLING DEVICE 失效
公开(公告)号：JPH0766339A
公开(公告)日：1995-03-10
申请号：JP21568293
申请日：1993-08-31
申请人： HITACHI LTD
发明人： SASAKI SHIGEYUKI , NAKAJIMA TADAKATSU , OSONE YASUO , ASHIWAKE NORIYUKI , KIMURA HIDEYUKI , KAWAMURA KEIZO , OGURO TAKAHIRO , KASAI KENICHI , IDEI AKIO
IPC分类号： H01L23/473
摘要： PURPOSE:To efficiently cool semiconductor elements by making a coolant to uniformly flow on the rear surfaces of the semiconductor elements. CONSTITUTION:Tubular coolant supplying members 5 made to communicate with a coolant supplying header 4 are respectively provided against numerous semiconductor elements 3 arranged on a multilayer interconnection board 1 in such a state where the members 5 are protruded towards the elements 3. Ceiling members 8 having coolant jetting ports 7 at their centers are respectively provided to the members 5 with tubular flexible members 6 in between in the flowing direction of a coolant 12 and the members 6 are pressed against the rear surfaces of the elements 3. When the coolant 12 is supplied, very small gaps 13 are formed, because the members 8 come off from the elements 3 to positions where the jetting pressure of the coolant 12 balances with the pressing force of the members 6. The coolant 12 flows through the gaps 13 and cools the elements 3.

10. 发明专利

JPH0750375A COOLING DEVICE 失效
公开(公告)号：JPH0750375A
公开(公告)日：1995-02-21
申请号：JP17225194
申请日：1994-07-25
申请人： HITACHI LTD
发明人： YAMADA MINORU , MASAKI AKIRA , YAMAMOTO MASAKAZU , NAKANISHI KEIICHIRO , NISHIDA TAKASHI , OGURO TAKAHIRO , KOBAYASHI FUMIYUKI , IMAI KUNINORI
IPC分类号： H01L23/473
摘要： PURPOSE:To provide a multichip cooling equipment which is small in size and excellent in efficiency. CONSTITUTION:A large number of integrated circuit chips 2 mounted on the surface of a board 3 are sealed off in a multichip module and cooled down. A cooling block 1 is fixed to the back of each chip 2 to cool it down, and pipes which guide coolant upward or downward respectively are provided to the upside of each block 1. The cooling block 1 is connected to the adjacent cooling block 1 with the pipes, a flexible pipe (bellows) 12, and an inlet pipe which guides coolant downward. Heat released from the integrated circuit chips 2 is conducted to the cooling blocks 1 and dissipated through coolant which circulates inside the cooling block 1. A downward coolant guide enables coolant to flow toward the base of the block 1. The cooling blocks 1 are arranged at an interval nearly equal to the size of a chip.

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