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1. 发明专利

JP2000069667A VOLTAGE CONTROL SYSTEM AND ELECTRONIC DEVICE 失效
公开(公告)号：JP2000069667A
公开(公告)日：2000-03-03
申请号：JP31776698
申请日：1998-11-09
申请人： HITACHI LTD
发明人： KAKITA HIROSHI , KAWAJI MOTONORI , OBA TAKAO , KANAI JIRO , TOYA SHINICHIRO , HIDAKA HIROYUKI , KOKAYU YOSHIHIRO
IPC分类号： G06F1/18 , H02J1/00
摘要： PROBLEM TO BE SOLVED: To provide a voltage control system and an electronic device which does not require redesigning of a substrate itself, even when the power supply voltage is changed due to the replacement of a main electronic component. SOLUTION: A main electronic component 200A and a sub-electronic component 300 are mounted on a substrate 100. The substrate 100 is provided with a first power supply layer 12 and a second power supply layer 14 connected to the power supplies 32, 34 and an exclusive power supply layer 16 which is freed from the power supply. The main electronic component 200A receives voltages from the power supply layers 12, 14, while the sub-electronic part 300 receives voltages via the main electronic component 200A and an exclusive power supply layer 16.

2. 发明专利

JPH04280460A SEMICONDUCTOR COOLER AND CONTACT MEMBER USED FOR ITS DEVICE 失效
公开(公告)号：JPH04280460A
公开(公告)日：1992-10-06
申请号：JP4319391
申请日：1991-03-08
申请人： HITACHI LTD
发明人： KUWABARA HEIKICHI , NAKAJIMA TADAKATSU , OHASHI SHIGEO , HATADA TOSHIO , MATSUSHIMA HITOSHI , SATO MOTOHIRO , INOUE KO , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/36
摘要： PURPOSE:To improve the insulation property of a contact member capable of desorption with semiconductors by making the, contact member out of a core material consisting of a metallic material and a pack where an insulating film is provided on the outside of this core material. CONSTITUTION:A contact member 1 is arranged between a heat sink 8 and an LSI chip 7. For the contact member 1, liquid such as grease is charged in an insulating pack 2 to improve heat conductivity. It is put in such a structure that it can absorbs the displacement of the height of the LSI chip 7 by changing the thickness of the contact member 1. Especially, the pack material of the container-shaped pack 2, which forms a contact shoe, is put in multilayer structure, and a thin metallic material is provided for the core material 40, and insulating films are provided on both sides of the core material 40. Moreover, the pack material of the containershaped pack 2 is made a metallic foil, and an insulating resin foil is stacked on both sides or single side of it. Hereby, the insulation property of the contact member 1 capable of desorption with the heat sink 8 and the semiconductor parts represented by the LSI chip 7 can be improved.

3. 发明专利

JPH04206555A COOLING DEVICE FOR ELECTRONIC EQUIPMENT 失效
公开(公告)号：JPH04206555A
公开(公告)日：1992-07-28
申请号：JP32924890
申请日：1990-11-30
申请人： HITACHI LTD
发明人： HATADA TOSHIO , MATSUSHIMA HITOSHI , KUWABARA HEIKICHI , NAKAJIMA TADAKATSU , OHASHI SHIGEO , INOUE KO , SATO MOTOHIRO , OTSUKA KANJI , SHIRAI MASAYUKI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/36 , H01L23/367 , H01L23/40 , H01L23/433
摘要： PURPOSE:To make it possible to connect easily various heat sinks according to the amount of heat generation of a semiconductor chip by a method wherein an elastomer layer, which is an elastic heat conductor, is provided between a heat diffusion plate and a coupling plate and the coupling plate is provided with a removable heat sink fixing means. CONSTITUTION:Heat generated in a semiconductor chip 1 is transferred to a heat diffusion plate 3 via an elastomer layer 7 and a coating gel layer 9. Moreover, the heat is transferred to a coupling plate 4, a grease layer 21 and a jacketing layer 13 via a coil spring-shaped elastomer layer 5 and is exhausted by a cooling fluid. As a result, the elastomer layer 5 absorbs the displacement of the chip 1 by the connection of the jacketing layer 13 and the like with external heat sinks and an excess force is never applied to the chip 1. Accordingly, the heat sinks can be easily connected by simply bolting. Even if the thermal displacement of the chip is generated by a temperature difference between the jacketing layer 3 and the plate 3, the elastomer layer 5 can absorb the displacement. Thereby, the reliability of the chip 1 is improved.

4. 发明专利

JPH11317477A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11317477A
公开(公告)日：1999-11-16
申请号：JP7513599
申请日：1999-03-19
申请人： HITACHI LTD
发明人： SHIRAI MASAYUKI , OTSUKA KANJI , MIWA TAKASHI , NAKANO TETSUO , KOIDE KAZUO , YAMAGIWA AKIRA , OBA TAKAO , HATADA TOSHIO , MATSUSHIMA HITOSHI , MIYAZAKI KUNIO
IPC分类号： H01L23/12 , H01L23/34
摘要： PROBLEM TO BE SOLVED: To fully achieve cooling using a plastic package without losing signal propagation characteristics by mounting a semiconductor chip to a heat diffusing plate, mounting a heat sink to the opposite surface, at the same time providing a wiring board, and jointing it to the heat diffusing plate. SOLUTION: A chip 1 is jointed to a pedestal part that is formed at the center of a heat diffusing plate 2 via an elastomer 3 having rubber-like elasticity having a filler with improved thermal conductivity. Around the chip 1, a wiring board 4 where wiring is made into multiple layers is jointed to the heat diffusing plate 2 via a soft material, for example an elastomer 5 having a filler with improved thermal conductivity. Also, a heat sink 9 is jointed onto the upper surface of the hat diffusion plate 2 via a soft material such as the elastomer 8. An aluminum material with improved thermal conductivity is used for the heat sink 9, and further a plurality of deep grooves are formed, so that the cooling area is widened.

5. 发明专利

JPH06125187A ELECTRONIC DEVICE 失效
公开(公告)号：JPH06125187A
公开(公告)日：1994-05-06
申请号：JP27398992
申请日：1992-10-13
申请人： HITACHI LTD
发明人： KONDO YOSHIHIRO , HATADA TOSHIO , MATSUSHIMA HITOSHI , KOMATSU TOSHIHIRO , YAMAZAKI SUSUMU , IINO TOSHIYOSHI , IWAI SUSUMU , HONMA TETSURO , YAMADA HIROSHI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H05K7/20 , G11B33/14
摘要： PURPOSE:To provide an electronic device which is improved in reliability by making the temperature distribution uniform inside the enclosure of the device and, at the same time, is reduced in noise from the enclosure as a whole. CONSTITUTION:In the enclosure 15 of the this device, a plurality of systems of flow passages are formed by providing partitions and cooling fans (through fans 14 and axial fans 20) are respectively installed to the flow passages. At the same time, the exits 26 of the flow passages are provided in the bottom and the cooling fans are positioned to the corners of the passages. In addition, the entrance section 41 of the enclosure 15 is constituted in a double structure so as to reduce noise to the outside.

6. 发明专利

JPH03250652A LSI COOLING DEVICE AND COMPUTER COOLING DEVICE 失效
公开(公告)号：JPH03250652A
公开(公告)日：1991-11-08
申请号：JP4541390
申请日：1990-02-28
申请人： HITACHI LTD
发明人： HATADA TOSHIO , MATSUSHIMA HITOSHI , KONDO YOSHIHIRO , INOUE KO , OTSUKA KANJI , SHIRAI MASAYUKI , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/473 , F28F3/02 , H01L23/367 , H01L23/467 , H05K7/10 , H05K7/20
摘要： PURPOSE:To minimize pressure loss and improve a cooling performance by installing small-sized fins where the line sizes are designed so that Reynolds' number may be a specific value or below in an LSI heat sink. CONSTITUTION:A computer is mounted with a plurality of boards 21 in an enclosure 23 and interconnected with each other. Each board 21 is provided with a memory 22 and an LSI package 1 and the like. Each LSI package 1 is provided with fine line-fins 3. It is necessary to mount 0.3mm-sized-fine line- fins 3 for cooling service on the LSI package 1, for example, in order to install a cooling heat sink to one LSI package. The fine line-fins 3 are directly connected with a heat diffusion board 8 positioned on the top of the package. The diameter D of the fine line-fins 3 is 0.3mm. If the wind velocity is assumed to be V=1m/s, Reynolds' number Re is 20. The region where a flow peeling off section 15 is formed is adapted to remain relatively small by specifying the Reynolds' number Re

7. 发明专利

JPH11317473A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH11317473A
公开(公告)日：1999-11-16
申请号：JP7513499
申请日：1999-03-19
申请人： HITACHI LTD
发明人： SHIRAI MASAYUKI , OTSUKA KANJI , MIWA TAKASHI , NAKANO TETSUO , KOIDE KAZUO , YAMAGIWA AKIRA , OBA TAKAO , HATADA TOSHIO , MATSUSHIMA HITOSHI , MIYAZAKI KUNIO
IPC分类号： H01L23/12 , H01L23/34
摘要： PROBLEM TO BE SOLVED: To prevent mismatchings caused by the difference in the expansion coefficient of a materials for constituting a package by forming an area between a semiconductor chip and a cooling part and the entire surface of the semiconductor chip in a structure which is covered with a specific soft material. SOLUTION: Since a chip 1 and a wiring layer are connected by a soft material, such as elastomers 3, 5 and 8 for connecting members, a bonding wire 7 in a loop is used for absorbing the displacement of each rigid body. Also, since epoxy potting with strong stiffness cannot be used due to the similar reasons for sealing, recently potting is made by using silicon gel that has been highly regarded as a reliable sealing material as a coating gel 11. Also, for soft material, namely the elastomers 3, 5, and 8 and the coating gel 11, a materials with an coefficient of elasticity of 0.001-100 kg/mm , preferably 0.01-10 kg/mm , is used.

8. 发明专利

JPH04196395A ELECTRONIC COMPUTER AND COOLING DEVICE THEREOF 失效
公开(公告)号：JPH04196395A
公开(公告)日：1992-07-16
申请号：JP32282390
申请日：1990-11-28
申请人： HITACHI LTD
发明人： OHASHI SHIGEO , NAKAJIMA TADAKATSU , KUWABARA HEIKICHI , HATADA TOSHIO , MATSUSHIMA HITOSHI , SANO MOTOHIRO , INOUE KO , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： G06F1/00 , F28D15/02 , G06F1/20 , H05K7/20
摘要： PURPOSE:To enhance a semiconductor element in operational speed so as to enable a computer system to operate at a higher speed by a method wherein the evaporator of a refrigerator and a specific semiconductor element out of semiconductor elements which increases in operational speed when it is cooled down are thermally coupled through a cooling member. CONSTITUTION:A cooling source is generated by a refrigerator 15 and brought into thermal contact with an evaporator 31, and a cooling member 4 which is flexible and high in thermal conductivity is arranged between the evaporator 31 and a semiconductor element 1 to enable them to be thermally coupled together. For instance, a specific element such as a CMOS or the like is enhanced in operational speed when it is cooled down. The cooling member 4, which connects the semiconductor element 1 to the evaporator that serves as a cooling source, is able to make its surface come into close contact with the surface of elements various in height to fill a gap between them small in contact thermal resistance, whereby heat can be dissipated enough from the semiconductor element 1 to lessen the element 1 in operating temperature. By this setup, a specific element which limits the operational speed of a system as a whole is lessened in operating temperature and enhanced in operational speed by dissipating heat with a cooling structure high in heat dissipation value, whereby an electronic computer can be enhanced in operation speed.

9. 发明专利

JPH0448762A SEMICONDUCTOR SUBSTRATE FOR ELECTRONIC APPARATUS 失效
公开(公告)号：JPH0448762A
公开(公告)日：1992-02-18
申请号：JP15518090
申请日：1990-06-15
申请人： HITACHI LTD
发明人： KONDO YOSHIHIRO , MATSUSHIMA HITOSHI , HATADA TOSHIO , OBA TAKAO , YAMAGIWA AKIRA
IPC分类号： H01L23/467
摘要： PURPOSE:To improve cooling performance due to proper array of IC chip groups and to further activate a board by arranging the groups of both-side mounting at the upstream side of cooling fluid from the group of one-side mounting. CONSTITUTION:If IC chip 2 groups of one-side mounting 3 and IC chip 2 groups of both-side mounting 4 are mixed, the groups of the mounting 4 are arranged at the upstream side and the groups of the mounting 3 are arranged at the downstream side to suppress the highest temperature of the chip to a relatively low value. The reason is because, if the groups of the mounting 4 are arranged at the upstream side, cooling air having not large air temperature rise can be activated. Since the groups of the mounting 3 at the downstream side occupies a large weight of heat dissipating from a board, the rise of the chip temperature can be suppressed to a small value even by considering the air temperature rise due to the groups of the mounting 4 at the upstream side. Further, in order to improve cooling performance, when the IC chip 2 groups are arranged in a zigzag manner, the effect is further large.

10. 发明专利

JPS61194846A MANUFACTURE OF LSI 失效
公开(公告)号：JPS61194846A
公开(公告)日：1986-08-29
申请号：JP3455985
申请日：1985-02-25
申请人： HITACHI LTD
发明人： IGARASHI TOSHIO , OBA TAKAO , TAKAHASHI SHIGEKAZU , MIZUNO AKIRA
IPC分类号： H01L21/8222 , G11C11/407 , H01L21/82 , H01L21/822 , H01L27/04 , H01L27/06 , H01L27/082 , H01L27/118
摘要： PURPOSE:To form an LSI in response to the type of a power source in a used device by using an input/output level converter which is converted in a circuit by the way of metal wiring. CONSTITUTION:When a TTL circuit and an ECL circuit are mixed in a used device and +5V, -5V and -2V are prepared as a power source, an input level converter and an output level converter 30 formed of a master LSI are used as the first connecting configuration. In this case, an internal circuit 29 is operated by a negative power source, and the output level converter converts the negative output of the internal circuit into a TTL level. When the ECL circuit is not provided in the used device and a negative power source is not contained, the converter 30 is metal-wired to form the second connecting configuration. In this case, the circuit 29 operates only by the positive power source, and the converter 30 converts the positive output of the internal circuit into a signal of TTL level.

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