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1. 发明专利

JP2013174599A Device and method for surface inspection 有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2013174599A
公开(公告)日：2013-09-05
申请号：JP2013076050
申请日：2013-04-01
申请人： Hitachi Ltd , 株式会社日立製作所 , Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , G01N21/88 , G03F7/20 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and a surface inspection method, which can discriminate scratches in various shapes occurring on a surface of a processed object (for example, an insulator film on a semiconductor substrate) from foreign materials attached to the processed object, and perform inspection when the processed object is subjected to polishing or grinding processing such as CMP, in semiconductor manufacturing and magnetic head manufacturing.SOLUTION: The surface inspection method of the present invention performs epi-illumination and oblique illumination on scratches and foreign materials occurring on a surface of a polished or ground insulator film with substantially equal light flux, and detects a change in intensity of scattered light generated from shallow scratches and the foreign materials between the epi-illumination time and the oblique illumination time to thereby discriminate the shallow scratches from the foreign materials. The method further discriminates linear scratches from the foreign materials by detecting the directivity of the scattered light in the epi-illumination time. The device for the method is also provided.
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照射时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

2. 发明专利

JP2009192541A Defect inspection device 有权
标题翻译：缺陷检查装置
公开(公告)号：JP2009192541A
公开(公告)日：2009-08-27
申请号：JP2009125763
申请日：2009-05-25
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus for discriminably inspecting a scratch having various shapes occurring on the surface and an adhering foreign substance, when polishing or grinding such as CMP (Chemical Mechanical Polishing) is applied to a workpiece (for example, an insulation film on a semiconductor substrate), in manufacturing a semiconductor or a magnetic head. SOLUTION: In this surface inspection method and apparatus, epi-illumination and slanting illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulation film with substantially the same light flux, a shallow scratch and a foreign substance are discriminated by detecting variation of the scattered light intensity generated from the shallow scratch and foreign substance between the epi-illumination time and slanting illumination time. Further, a linear scratch and a foreign substance are discriminated by detecting the directivity of the scattered light during the epi-illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种表面检查装置，用于区分地检查在表面上发生的各种形状的刮痕和粘附的异物，当将CMP（化学机械抛光）的抛光或研磨施加到工件上时例如半导体衬底上的绝缘膜），制造半导体或磁头时。解决方案：在这种表面检查方法和装置中，对抛光或接地绝缘膜的表面上产生的划痕和异物施加外照射和倾斜照明，具有基本上相同的光通量，浅划痕和通过检测在外部照射时间和倾斜照明时间之间从浅划痕和异物产生的散射光强度的变化来区分异物。此外，通过在外照明期间检测散射光的方向性来区分线性划痕和异物。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2007212479A System and method for defect inspection 有权
标题翻译：缺陷检查系统与方法
公开(公告)号：JP2007212479A
公开(公告)日：2007-08-23
申请号：JP2007122717
申请日：2007-05-07
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： HAMAMATSU REI , NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , WATANABE TETSUYA
IPC分类号： G01N21/956 , G01B11/30
摘要： PROBLEM TO BE SOLVED: To provide a system and method for defect inspection which can discriminate various shaped scratches from adhered foreign substances, generated on the surface of any processed subject to be inspected, when implementing of grinding or polishing, such as Chemical Mechanical Polishing (CMP) on the processed subject (for example, insulating film on semiconductor substrate) is conducted, in the manufacturing of semiconductor or magnetic head. SOLUTION: The present invention is characterized in that epi-illumination and oblique illumination are applied by using almost the same luminous flux to scratches or foreign substances generated on surface of polished or ground insulating film to discriminate shallow scratches from foreign substances, based on correlation between the times of the epi-illumination and the oblique illumination, such as the intensity ratios of the scattered lights generated from both the shallow scratches and the foreign substances. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于缺陷检查的系统和方法，其可以在实施研磨或抛光时，例如化学品（例如化学品）中区分各种形状的划痕和被检查的待处理物体的表面上产生的附着异物在半导体或磁头的制造中，对加工对象（例如，半导体基板上的绝缘膜）进行机械抛光（CMP）。解决方案：本发明的特征在于，通过对抛光或接地绝缘膜的表面上产生的划痕或异物使用几乎相同的光通量来应用表面照明和倾斜照明，以区别基于异物的浅划痕关于外照明和倾斜照明的时间之间的相关性，例如由浅刮痕和异物产生的散射光的强度比。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2014211440A 表面検査装置およびその方法有权
标题翻译：用于表面检查的装置和方法
公开(公告)号：JP2014211440A
公开(公告)日：2014-11-13
申请号：JP2014113696
申请日：2014-06-02
申请人：株式会社日立製作所 , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , Hitachi High-Technologies Corp
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA HIROSHI
IPC分类号： G01N21/88 , G01B11/02 , G01B11/30 , G01N21/84 , G01N21/956 , H01L21/027
CPC分类号： G01B11/02 , G01B11/30 , G01N21/84 , G01N21/88 , G01N21/95 , H01L21/30
摘要：【課題】半導体製造や磁気ヘッド製造において、被加工対象物(例えば、半導体基板上の絶縁膜)に対してCMPなどの研磨または研削加工を施した際、その表面に生じる様々な形状を有するスクラッチと付着する異物とを弁別して検査することができるようにした表面検査装置およびその方法を提供することにある。【解決手段】本発明は、研磨または研削された絶縁膜の表面に発生したスクラッチや異物に対してほぼ同じ光束で落射照明と斜方照明とを行い、該落射照明時と斜方照明時との間において浅いスクラッチと異物とから発生する散乱光強度の変化を検出することによって浅いスクラッチと異物とを弁別し、さらに、前記落射照明時における散乱光の指向性を検出することによって線状スクラッチと異物とを弁別することを特徴とする表面検査方法およびその装置である。【選択図】図1
摘要翻译：要解决的问题：提供一种表面检查装置和表面检查方法，该表面检查装置和表面检查方法可以鉴别出附着在外部材料上的处理物体（例如，半导体基板上的绝缘体膜）的表面上出现的各种形状的划痕在半导体制造和磁头制造中对被处理物进行抛光或研磨处理（例如CMP）进行检查。本发明的表面检查方法对划痕和外来物进行表面照明和倾斜照明在具有大致相等的光通量的抛光或接地绝缘体膜的表面上发生的材料，并且检测由外部光照时间和倾斜照明时间之间的浅划痕和异物产生的散射光的强度变化，从而区分来自异物的浅划痕。该方法通过检测外照射时间中的散射光的方向性来进一步鉴别异物的线性划痕。还提供了该方法的设备。

5. 发明专利

JP2006330007A Defect inspection device and its method 有权
标题翻译：缺陷检查装置及其方法
公开(公告)号：JP2006330007A
公开(公告)日：2006-12-07
申请号：JP2006238838
申请日：2006-09-04
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and its method capable of improving detection sensitivity and throughput by setting a threshold value corresponding to the dispersion of signal depending on a pattern by realizing highly effective illumination on a straight line from a direction where no diffracted light enters at the time of detecting the defect such as foreign matter etc., generated in the manufacturing process of an object while forming a pattern on the substrate. SOLUTION: By a highly effective illumination system illuminating from the direction of reducing the diffraction light from the pattern, the dispersed light from the pattern being the cause of the dispersion of the signal is reduced. Further, the threshold value is reduced by a threshold setting means from the calculated dispersion of signal for every region in the chip. Consequently, the detection threshold value is reduced and the detection sensitivity is improved and the improvement of the throughput is realized. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：解决问题：提供一种缺陷检查装置及其方法，该缺陷检查装置及其方法能够通过根据图案设置与信号的色散相对应的阈值，从而通过在直线上实现高效照明来提高检测灵敏度和吞吐量在检测在物体的制造过程中产生的缺陷（例如异物等）的同时在衍射光线入射的方向，同时在基板上形成图案。解决方案：通过从减少来自图案的衍射光的方向照明的高效照明系统，来自图案的分散光是信号分散的原因。此外，根据芯片中每个区域的计算的信号色散，阈值设置装置减小阈值。因此，检测阈值降低，检测灵敏度提高，吞吐量提高。版权所有（C）2007，JPO＆INPIT

6. 发明专利

JP2006201179A Surface inspection device and its method 有权
标题翻译：表面检测装置及其方法
公开(公告)号：JP2006201179A
公开(公告)日：2006-08-03
申请号：JP2006028261
申请日：2006-02-06
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956 , G01B11/30 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection device and its method where a scratch, having various shapes occurring on the surface of a processed object (for example, an insulating film on a semiconductor substrate) and an adhering foreign substance are discriminated and inspected, when the processed object is polished or ground through CMP or the like, in the manufacturing of semiconductors or of magnetic heads. SOLUTION: In the surface inspection method and its device, epi-illumination and oblique illumination are applied to the scratch and the foreign substance occurring on the surface of the polished or ground insulating film with substantially the same luminous flux, a shallow scratch and foreign substance are discriminated by detecting variation of the intensity of the scattered light generated from the shallow scratch and foreign substance between the epi-illumination and oblique illumination, and a linear scratch and foreign substance are discriminated, by detecting the directivity of the scattered light in the epi-illumination. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决问题：提供一种表面检查装置及其方法，其中在加工对象（例如半导体基板上的绝缘膜）的表面上出现各种形状的刮痕和附着的异物为通过CMP等对被处理物进行抛光或研磨时，在半导体或磁头的制造中进行鉴别和检查。解决方案：在表面检查方法及其装置中，外露照明和倾斜照明被施加到具有基本上相同的光通量的抛光或接地绝缘膜的表面上产生的划痕和异物，浅划痕通过检测从外部照明和倾斜照明之间的浅划痕和异物产生的散射光的强度的变化来区分外来物质，并且通过检测散射光的方向性来区分线性划痕和异物在epi照明。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2008261893A Inspection apparatus 有权
标题翻译：检查装置
公开(公告)号：JP2008261893A
公开(公告)日：2008-10-30
申请号：JP2008205955
申请日：2008-08-08
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： ISHIMARU ICHIRO , NOGUCHI MINORU , MORIYAMA ICHIRO , TANABE YOSHIKAZU , HACHIKAKE YASUO , KENBO YUKIO , WATANABE KENJI , TSUCHIYAMA YOJI
IPC分类号： G01N21/956
摘要： PROBLEM TO BE SOLVED: To provide a surface inspection apparatus which enables an inspection discriminating between scratches, which are generated on a surface and have various shapes, and foreign substances sticking to the surface when a polishing or grinding like CMP etc. is performed on an object to be processed (for example, an insulation film on a semiconductor substrate) in semiconductor manufacture or magnetic head manufacture, and to provide its method. SOLUTION: The inspection apparatus is characterized by the followings. Epi illumination and oblique illumination with almost the same luminous flux are applied on the scratches and foreign substances generated on the polished or grinded surface of the insulation film. Discrimination between shallow scratches and the foreign substances is performed by detecting variations in the intensities of scattered light arising from the shallow scratches and foreign substances during the epi illumination and oblique illumination, further, discrimination between linear scratches and the foreign substances is performed by detecting the directivity of the scattered light during the epi illumination. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种表面检查装置，其能够进行检查，以区分在表面上产生并具有各种形状的划痕和当像CMP等的研磨或研磨时粘附到表面的异物在半导体制造或磁头制造中对被处理物体（例如，半导体衬底上的绝缘膜）进行，并提供其方法。
解决方案：检查装置的特征如下。 Epi照明和具有几乎相同光通量的倾斜照明被施加在在绝缘膜的抛光或研磨表面上产生的划痕和异物上。通过检测在epi照明和倾斜照明期间由浅刮痕和异物产生的散射光的强度的变化来进行浅痕迹和异物之间的区别，此外，通过检测线性划痕和异物来区分线性划痕在epi照明期间散射光的方向性。版权所有（C）2009，JPO＆INPIT

8. 发明专利

JP2005300553A Defect inspection device and method 有权
标题翻译：缺陷检查装置和方法
公开(公告)号：JP2005300553A
公开(公告)日：2005-10-27
申请号：JP2005172304
申请日：2005-06-13
申请人： Hitachi High-Technologies Corp , Hitachi Ltd , 株式会社日立ハイテクノロジーズ , 株式会社日立製作所
发明人： NOGUCHI MINORU , OSHIMA YOSHIMASA , NISHIYAMA HIDETOSHI , MATSUMOTO SHUNICHI , KENBO YUKIO , MATSUNAGA RYOJI , SAKAI SHIGETOSHI , NINOMIYA TAKANORI , WATANABE TETSUYA , NAKAMURA HISATO , JINGU TAKAHIRO , MORISHIGE YOSHIO , CHIKAMATSU SHUICHI
IPC分类号： G01N21/956 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a defect inspection device and method, capable of improving detection sensitivity and throughput by realizing, at the detecting of defects, such as a foreign matter generated in a manufacturing process for forming a pattern on a substrate to produce an object, a linear high-efficiency lighting from a direction on which no diffracted light from the pattern is incident in order to reduce the diffracted light, and setting a threshold according to the dispersion of signals by patterns. SOLUTION: Scattered light, from the pattern that causes dispersion of signals, is reduced by a high-efficiency lighting optical system, lighting from a direction reducing the scattered light from the pattern, and the detection threshold is reduced by a means which sets the threshold, based on the dispersion of signals calculated each area within a chip, whereby improvement in the detection sensitivity and improvement in throughput are realized. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种缺陷检查装置和方法，其能够通过在检测诸如在用于在基板上形成图案的制造工艺中产生的异物等缺陷的检测来提高检测灵敏度和生产率为了产生物体，从不存在来自图案的衍射光入射的方向的线性高效照明，以便减少衍射光，并根据图案的信号色散设置阈值。解决方案：通过高效率照明光学系统减少来自引起信号色散的图案的散射光，从减少来自图案的散射光的方向进行照明，并且通过以下方式减少检测阈值：基于芯片内每个区域计算的信号的色散设置阈值，从而实现检测灵敏度的提高和吞吐量的提高。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2014059310A Inspection device 审中-公开
标题翻译：检查装置
公开(公告)号：JP2014059310A
公开(公告)日：2014-04-03
申请号：JP2013223396
申请日：2013-10-28
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： AIKO KENJI , CHIKAMATSU SHUICHI , NOGUCHI MINORU , IWATA HISAFUMI
IPC分类号： G01N21/956 , G01B11/30 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To obtain a defect inspection device that suppresses an influence of surface roughness of a specimen surface or scattered light from a normal circuit pattern, and can detect a defect and the like of the specimen surface with high sensitivity by increasing a gain of the scattered light from the defect or a foreign substance.SOLUTION: When a lens with a large NA value is used, a lens outer diameter is 10a, and an angle formed between an oblique optical system and a wafer is α1. When an elevation angle of the oblique detection optical system is made small for detecting much defect scattered light by reducing wafer surface roughness or surface roughness beneath an oxide film and scattered light from the circuit pattern, the elevation angle is α2
摘要翻译：要解决的问题：为了获得抑制来自正常电路图案的样品表面的表面粗糙度或散射光的影响的缺陷检查装置，并且可以通过增加增益来高灵敏度地检测样品表面的缺陷等来自缺陷或异物的散射光。解决方案：当使用具有大NA值的透镜时，透镜外径为10a，倾斜光学系统和晶片之间形成的角度为α1。当倾斜检测光学系统的仰角小，通过降低氧化膜下方的晶片表面粗糙度或表面粗糙度和来自电路图案的散射光来检测许多缺陷散射光时，仰角为α2<α1，而外部透镜的直径10b小于透镜外径10a，散射光的聚光能力降低。当透镜直径增加到10c以增加聚光能力时，透镜和晶片7造成彼此的干扰。通过产生消除了干涉部分的透镜，可以使得透镜的孔径尺寸大于外径10b，同时保持小仰角α2，从而提高缺陷检测能力和改善透镜性能可以同时实现。

10. 发明专利

JP2012211926A Inspection device and inspection method 审中-公开
标题翻译：检查装置和检查方法
公开(公告)号：JP2012211926A
公开(公告)日：2012-11-01
申请号：JP2012173713
申请日：2012-08-06
申请人： Hitachi High-Technologies Corp , 株式会社日立ハイテクノロジーズ
发明人： SHIMURA HIROSHI , NOGUCHI MINORU , ITO MASAAKI , AIKO KENJI , CHIKAMATSU SHUICHI , OTSUKI SHIGEO , ABE SHIGERU , OCHI MASATADA , SEKIGUCHI TAKAAKI , YAMASHITA HIROYUKI
IPC分类号： G01N21/956 , G01B11/30 , H01L21/66
CPC分类号： G01N21/9501 , G01N21/94 , G01N21/95607 , G01N21/95623 , G06K9/2036 , G06K2209/19 , G06T7/0006 , G06T2207/30148
摘要： PROBLEM TO BE SOLVED: To enhance a capture rate of defects and classification performance.SOLUTION: An inspection device includes: a stage that is mounted with an object to be inspected on which a circuit pattern including groups of straight lines parallel to one another is formed and travels; an illumination optical system that generates a plurality of slit-shaped beams being slit-shaped light and forms a first illumination region and a second illumination region on a surface of the object to be inspected; a detection optical system that separates first light from the first illumination region and second light from the second illumination region and detects the first light by a first image sensor and the second light by a second image sensor; a processor for obtaining a signal indicating a defect based on signals obtained by the first image sensor and the second image sensor.
摘要翻译：要解决的问题：提高缺陷的捕获率和分类性能。检查装置包括：安装有待检查对象的台，其上形成有包括彼此平行的直线组的电路图案并行进; 照明光学系统，其产生多个狭缝状光束为狭缝状的光，并且在被检测物的表面上形成第一照明区域和第二照明区域; 检测光学系统，其将来自第一照明区域的第一光和来自第二照明区域的第二光分离，并且通过第一图像传感器检测第一光，并且通过第二图像传感器检测第二光; 基于由第一图像传感器和第二图像传感器获得的信号获得指示缺陷的信号的处理器。版权所有（C）2013，JPO＆INPIT

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