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1. 发明专利

JP2004197010A Heat resistant adhesive, method for producing the same, and semiconductor device using the same 审中-公开
公开(公告)号：JP2004197010A
公开(公告)日：2004-07-15
申请号：JP2002369163
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C09J163/00 , C09J9/02 , C09J183/04 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01087 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive comprised of a thermosetting resin composition, which is liquid at room temperature(25°C) and excellent in workability such as casting etc. because of its low viscosity and gives after curing a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, and a semiconductor device using it. SOLUTION: The heat resistant adhesive comprises a thermosetting resin composition whose essential components are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by general formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by general formula (2) (wherein A is a divalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004197009A Thermosetting resin, method for producing the same, and its product 审中-公开
公开(公告)号：JP2004197009A
公开(公告)日：2004-07-15
申请号：JP2002369159
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C08L63/00 , C08K3/00 , C08L35/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/83192 , H01L2224/92125 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solventless thermosetting resin composition, which is excellent in workability such as casting because it is liquid of low viscosity at room temperature(25°C) and gives, after curing, a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, a method for producing the same and its product. SOLUTION: Essential components of the thermosetting resin composition are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by formula (2) (wherein A is a bivalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2004200354A Wiring board and method of manufacturing the same, and member therefor and method of manufacturing the same 审中-公开
公开(公告)号：JP2004200354A
公开(公告)日：2004-07-15
申请号：JP2002366261
申请日：2002-12-18
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： ONDA MAMORU , SATO TAKASHI , YAMADA HIROSHI , KOIZUMI TOYOHARU , SUZUKI MASAHIRO , TAKAHASHI AKIO
IPC分类号： C08L63/00 , C08L79/08 , C08L83/04 , C08L101/00 , H01L23/14 , H05K1/03 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent deformation of the wiring board at the temperature near the soldering temperature without providing any base material for the reinforcement to an insulated substrate in the wiring board, in which the wiring is provided on the surface of the insulated substrate using a resin material or on the surface and interior of the same substrate. SOLUTION: The insulated substrate is formed as the wiring board comprising an oligomer type organic silicon compound which is generated with the reaction between the organic silicon compound expressed by the following chemical formula (R is an organic group including an functional group which shows additional reaction with the epoxy resin, and R' is a methyl group or ethyl group), a hardening agent which realize hardening through the additional reaction of the epoxy resin and the oligomer type organic silicon compound, and a resin material formed through thermal hardening of a mixture of the functional group which is easily coupled with hydrogen and a compound including the reactive unsaturated coupling. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2005002487A Method for producing nonwoven fabric for electric insulation, method for producing prepreg, laminate and printed circuit board 审中-公开
标题翻译：用于生产用于电绝缘的非织造织物的方法，用于生产PREPREG，层压和印刷电路板的方法
公开(公告)号：JP2005002487A
公开(公告)日：2005-01-06
申请号：JP2003165121
申请日：2003-06-10
申请人： Hitachi Ltd , Shin Kobe Electric Mach Co Ltd , 新神戸電機株式会社 , 株式会社日立製作所
发明人： GOTO HIROICHI , HIRAOKA KOICHI , MOGI AKIRA , SUZUKI MASAHIRO , NAGAI AKIRA
IPC分类号： B29B15/10 , D04H1/4342 , D04H1/549 , D06M13/278 , D06M13/477 , D06M23/00 , D06M101/36 , H05K1/03 , D04H1/42 , D04H1/54
摘要： PROBLEM TO BE SOLVED: To provide a method for producing a printed circuit board having an aramid fiber-containing nonwoven fabric for electric insulation as the substrate of a thermosetting resin insulated layer, by which the adhesiveness of the aramid fibers to the thermosetting resin can be improved.
SOLUTION: This method for producing the nonwoven fabric for the electric insulation is characterized by immersing a nonwoven fabric which contains para type aramid fibers as main fibers and binds the fibers to each other with a thermally fusible fibers, in an organic solvent to dissolve a part of the thermally fusible fibers. The method for producing the prepreg is characterized by holding an epoxy resin on the nonwoven fabric for the electric insulation and curing the resin up to a semi-cured state. The method for producing the laminate is characterized by heating and press-forming the layer of the prepreg as the whole or partial layers of a prepreg. The method for producing the printed circuit board is characterized by heating and press-forming the layers of the prepreg to form the insulated layer.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：解决问题的方案：提供一种具有含芳族聚酰胺纤维的电绝缘无纺布作为热固性树脂绝缘层的基材的印刷电路板的制造方法，通过该方法，芳族聚酰胺纤维与热固性树脂的粘合性可以改善树脂。解决方案：该电绝缘用无纺布的制造方法的特征在于，将含有对位芳族聚酰胺纤维作为主纤维的无纺布浸渍在有机溶剂中，并将纤维彼此以热熔纤维结合，溶解热熔纤维的一部分。制备预浸料的方法的特征在于在无纺布上保持环氧树脂进行电绝缘，并将树脂固化至半固化状态。制造层压体的方法的特征在于，将预浸料坯的层作为预浸料坯的整个或部分层进行加热和压制成型。制造印刷电路板的方法的特征在于，加热和压制预浸料的层以形成绝缘层。版权所有（C）2005，JPO＆NCIPI

5. 发明专利

JP2003027033A Heat-resistant adhesive 审中-公开
标题翻译：耐热粘合剂
公开(公告)号：JP2003027033A
公开(公告)日：2003-01-29
申请号：JP2001212601
申请日：2001-07-12
申请人： Hitachi Chem Co Ltd , Hitachi Ltd , 日立化成工業株式会社 , 株式会社日立製作所
发明人： MATSUYAMA HARUHIKO , AKABOSHI HARUO , SUZUKI MASAHIRO , KAGEYAMA AKIRA
IPC分类号： C09J179/08 , C09J11/04 , C09J179/04
摘要： PROBLEM TO BE SOLVED: To obtain a heat-resistant adhesive which gives a high bond strength at a low bonding pressure and hence is suitable for die bonding.
SOLUTION: This heat-resistant adhesive comprises a bismaleimide compound, a polyquinoline compound and fine metallic particles of any of Al, Ag, Au, Cu and Ni, which are surface-treated with stearic acid, zinc stearate or aluminum stearate. The adhesive gives a high bond strength at a low bonding pressure and hence is suitable for die bonding.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：获得在低粘合压力下具有高粘合强度的耐热粘合剂，因此适合于芯片粘合。解决方案：该耐热粘合剂包括用硬脂酸，硬脂酸锌或硬脂酸铝进行表面处理的双马来酰亚胺化合物，聚喹啉化合物和Al，Ag，Au，Cu和Ni中任一种的金属微粒。粘合剂在低粘合压力下产生高粘合强度，因此适合于芯片粘接。

6. 发明专利

JP2008004031A Communication method in tcp/ip communication 审中-公开
标题翻译： TCP / IP通信中的通信方法
公开(公告)号：JP2008004031A
公开(公告)日：2008-01-10
申请号：JP2006175577
申请日：2006-06-26
申请人： Hitachi Information & Control Solutions Ltd , Hitachi Ltd , 株式会社日立情報制御ソリューションズ , 株式会社日立製作所
发明人： YATSUDA TSUTOMU , SUZUKI MASAHIRO , TANJI MASAYUKI
IPC分类号： G06F21/20 , G06F13/00 , G09C1/00
摘要： PROBLEM TO BE SOLVED: To reduce burdens on program implementation regarding processing of acquisition and authentication of time and to improve security when the acquisition and authentication of the time are required about TCP/IP communication. SOLUTION: About a communication method on a TCP/IP network including each processing process of open processing, data transfer processing and close processing, either or both of time acquisition processing for one data processor (client device) on the communication network to acquire the time from the other data processor (server device) or authentication processing for authenticating a data processor of a communication partner when one data processor on the communication network to communicate with the other data processor are performed in an open processing process. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：减少在处理采集和验证时间的程序实现方面的负担，并且在需要TCP / IP通信的时间采集和认证时提高安全性。解决方案：关于TCP / IP网络上的通信方法，包括开放处理，数据传输处理和关闭处理的每个处理过程，通信网络上的一个数据处理器（客户端设备）的时间获取处理中的一个或两个，在开放处理过程中执行在通信网络上的一个数据处理器与其他数据处理器进行通信时，从其他数据处理器（服务器设备）获取时间或用于认证通信伙伴的数据处理器的认证处理。版权所有（C）2008，JPO＆INPIT

7. 发明专利

JP2008015901A Access control method for external storage device, and controller, host system or external storage device performing access control method 有权
标题翻译：用于外部存储设备的访问控制方法和控制器，主机系统或执行访问控制方法的外部存储设备
公开(公告)号：JP2008015901A
公开(公告)日：2008-01-24
申请号：JP2006188151
申请日：2006-07-07
申请人： Hitachi Information & Control Solutions Ltd , Hitachi Ltd , 株式会社日立情報制御ソリューションズ , 株式会社日立製作所
发明人： YOSHIDA KATSUMI , NAKANO YOSHIHIRO , FUKUMARU HIROAKI , HIUGA KAZUHIRO , SUZUKI MASAHIRO
IPC分类号： G06F3/06
摘要： PROBLEM TO BE SOLVED: To provide an access control method for a controller, capable of enabling error recovery processing of HDD without changing the time-out time of a conventional host. SOLUTION: In the controller 20 including a processing part for attaining various functions by a control program through respective interface parts for accessing the host 10 and the HDD 30, the processing part reports an error to the host (U323) without giving reset instruction to the HDD (U322) when a normal response including completion of error recovery processing is not received from the HDD within the time-out time in accessing the HDD based on an access request from the host, and accesses (U325) the HDD again after giving the reset instruction to the HDD (U324) based on a repeated access request from the host (U311). The error recovery processing (U330) of the HDD is completed during this period. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够在不改变常规主机的超时时间的情况下实现HDD的错误恢复处理的控制器的访问控制方法。解决方案：在包括用于通过控制程序通过用于访问主机10和HDD 30的各个接口部分实现各种功能的处理部分的控制器20中，处理部分向主机（U323）报告错误而不给出复位基于来自主机的访问请求在超时时间内从HDD接收到包括完成错误恢复处理的正常响应的指令（U322），并再次访问（U325）HDD 在基于来自主机（U311）的重复访问请求给予HDD（U324）的复位指令之后。在此期间完成HDD的错误恢复处理（U330）。版权所有（C）2008，JPO＆INPIT

8. 发明专利

JP2006012297A Access control program of magnetic disk apparatus, access control apparatus using the access control program, and magnetic disk apparatus 审中-公开
标题翻译：磁盘设备的访问控制程序，使用访问控制程序的访问控制装置和磁盘设备
公开(公告)号：JP2006012297A
公开(公告)日：2006-01-12
申请号：JP2004188185
申请日：2004-06-25
申请人： Hitachi Information & Control Systems Inc , Hitachi Ltd , 株式会社日立ハイコス , 株式会社日立製作所
发明人： ISHIKURA HIDEJI , TANJI MASAYUKI , FUKUMARU HIROAKI , SUZUKI MASAHIRO
IPC分类号： G11B5/012 , G06F3/06 , G11B5/09 , G11B20/10 , G11B20/12
摘要： PROBLEM TO BE SOLVED: To provide an access control program of a magnetic disk apparatus in which a suppression effect of the fixed point floating of a magnetic head can be improved. SOLUTION: Since a cylinder in which write-in or read-out is not performed and a skip is performed is provided among different cylinders in which the write-in or read-out of a magnetic disk is performed, a function in which a logic address specified to a read and write command issued by equipment utilizing the magnetic disk apparatus is converted to a converted logic address in which an interval between the last logic address of a cylinder priorly accessing to a cylinder performing write-in or read-out and an initial logic address of a cylinder accessing next is so that the logic address is skipped by the logic address corresponding to a skip cylinder and a function issuing a read and write command specifying this converted logic address to the magnetic disk apparatus are given, the number of skip cylinders is decided within a range in which the total of the number of cylinders required to use and the number of skip cylinders does not exceed the number of cylinders possessed by the magnetic disk. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种可以提高磁头固定点漂浮的抑制效果的磁盘装置的访问控制程序。解决方案：由于在执行磁盘的写入或读出的不同气缸中提供不执行写入或读出并执行跳跃的气缸，所以在执行磁盘的写入或读出的不同气缸中提供了一种功能对由使用磁盘装置的设备发出的读写命令指定的逻辑地址被转换为转换后的逻辑地址，在该转换逻辑地址中，先前访问执行写入或读取的气缸的气缸的最后逻辑地址之间的间隔，并且接下来访问的气缸的初始逻辑地址是使得逻辑地址被跳过与跳过气缸相对应的逻辑地址，并且向磁盘设备发出指定该转换的逻辑地址的读和写命令的功能，跳过气缸的数量决定在使用的气缸总数和跳过气缸数不超过m所具有的气缸数的范围内恶意磁盘。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2004101199A Oscillation-packing type atomic reactor fuel rod 审中-公开
标题翻译：振动包装型原子反应堆燃料油
公开(公告)号：JP2004101199A
公开(公告)日：2004-04-02
申请号：JP2002259237
申请日：2002-09-04
申请人： Hitachi Ltd , Japan Nuclear Cycle Development Inst States Of Projects , 株式会社日立製作所 , 核燃料サイクル開発機構
发明人： SUZUKI MASAHIRO , ISHII KATSUNORI , HINAI HIROSHI , SHIGETOME YOSHIAKI , KONO SHUSAKU , SASAHIRA AKIRA , KONUKI NORIHIKO
IPC分类号： G21C3/26 , G21C3/62 , G21C21/04
CPC分类号： Y02E30/34 , Y02E30/38
摘要： PROBLEM TO BE SOLVED: To reduce the kinds of fuel particles, to enhance the filling ratio, to improve a yield, and to reduce a manufacturing cost.
SOLUTION: The atomic reactor fuel rod forms a fuel area 16 of a predetermined fuel density by loading fuel particles in a cladding tube 10, and applying oscillation thereto, and seals both ends of the cladding tube by end plugs 18 and 20. The fuel particles loaded in the cladding tube consist of spherical fuel particles and monolithic lump-shaped fuel particles. The grain size of the spherical fuel particles is larger than the grain size of the monolithic lump-shaped fuel particles, and both kinds of fuel particles are mixed in a substantially uniform manner. For example, there are two kinds, i.e., spherical fuel particles 30 of large grain size and monolithic lump-shaped fuel particles 34 of small grain size. The grain size of spherical fuel particles is 700-1,000 μm, and the grain size of monolithic lump-shaped fuel particles is ≤100 μm, and the charging ratio of spherical fuel particles is 50-70 wt.%.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了降低燃料粒子的种类，提高填充率，提高收率，降低制造成本。解决方案：原子反应堆燃料棒通过在包壳管10中加载燃料颗粒并施加振动而形成具有预定燃料密度的燃料区域16，并通过端塞18和20密封包层管的两端。装载在包层管中的燃料颗粒由球形燃料颗粒和整体块状燃料颗粒组成。球形燃料颗粒的粒度大于单块块状燃料颗粒的粒径，并且两种燃料颗粒以基本均匀的方式混合。例如，具有大粒径的球形燃料粒子30和小粒径的整体块状燃料粒子34有两种。球形燃料颗粒的粒径为700-1,000μm，单块块状燃料颗粒的粒径≤100μm，球形燃料颗粒的装料率为50-70wt％。版权所有（C）2004，JPO

10. 发明专利

JPS60214933A Manufacture of paper carrying belt 失效
标题翻译：造纸带的制造
公开(公告)号：JPS60214933A
公开(公告)日：1985-10-28
申请号：JP7230384
申请日：1984-04-11
申请人： Hitachi Cable Ltd
发明人： SUZUKI MASAHIRO , UEDA SUTEO
IPC分类号： B65G15/32 , B29C41/04 , B29D29/00 , B29D29/06 , B29K29/00
CPC分类号： B29D29/06 , B29C41/04
摘要： PURPOSE:To arrange so that no sag may occur by blending inorganic powder having coefficient of friction lower than cured liquid rubber into curable liquid rubber and curing the mixture in a centrifugal molding device. CONSTITUTION:Inorganic powder having coefficient of friction lower than cured liquid rubber of curable nature is blended into curable liquid rubber to obtain a mixture. For instance, calcium carbonate averaging 1.4mum of grain size and curing agent are added to liquid polyurethane rubber and are stirred and mixed into a curable liquid mixture. Next, the mixture is injected into a cylindrical centrifugal molding device and then is centrifugally cured into a cured cylindrical object. The external surface of the curved cylindrical object is polished to a smoothing finish and cut sideways in the form of belt, thus obtaining a paper carrying belt. The paper carrying belt has an internal surface 20 of cured liquid polyurethane rubber having high coefficient of friction and an external smooth surface 21 of film mainly composed of calcium carbonate powder having low coefficient of friction.
摘要翻译：目的：通过将具有比固化液体橡胶低的摩擦系数的无机粉末与可固化液体橡胶混合并在离心模塑装置中固化该混合物来进行布置。构成：将可固化性的固化液橡胶的摩擦系数低于无机粉末混合到可固化液体橡胶中，得到混合物。例如，将平均1.4μm的粒径的碳酸钙和固化剂加入到液体聚氨酯橡胶中，并搅拌并混合到可固化的液体混合物中。接下来，将混合物注入圆柱形离心模塑装置中，然后离心固化成固化的圆柱形物体。将弯曲的圆柱形物体的外表面抛光到平滑光洁度并以带状形式侧向切割，从而获得携带带。送纸带具有高摩擦系数的固化液体聚氨酯橡胶的内表面20和主要由低摩擦系数的碳酸钙粉末组成的膜的外部光滑表面21。

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