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1. 发明专利

JP2004197010A Heat resistant adhesive, method for producing the same, and semiconductor device using the same 审中-公开
公开(公告)号：JP2004197010A
公开(公告)日：2004-07-15
申请号：JP2002369163
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C09J163/00 , C09J9/02 , C09J183/04 , H01L21/60
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73204 , H01L2224/73265 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01087 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an adhesive comprised of a thermosetting resin composition, which is liquid at room temperature(25°C) and excellent in workability such as casting etc. because of its low viscosity and gives after curing a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, and a semiconductor device using it. SOLUTION: The heat resistant adhesive comprises a thermosetting resin composition whose essential components are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by general formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by general formula (2) (wherein A is a divalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

2. 发明专利

JP2004197009A Thermosetting resin, method for producing the same, and its product 审中-公开
公开(公告)号：JP2004197009A
公开(公告)日：2004-07-15
申请号：JP2002369159
申请日：2002-12-20
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： SUZUKI MASAHIRO , TAKAHASHI AKIO , TAKAHASHI KEN , ONDA MAMORU , SATO TAKASHI , ITO YUZO , KOIZUMI TOYOHARU
IPC分类号： C08L63/00 , C08K3/00 , C08L35/00 , C08L83/04 , H01L23/29 , H01L23/31
CPC分类号： H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/83192 , H01L2224/92125 , H01L2924/15747 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide a solventless thermosetting resin composition, which is excellent in workability such as casting because it is liquid of low viscosity at room temperature(25°C) and gives, after curing, a cured resin product excellent in heat resistance, especially in mechanical properties at a higher temperature, a method for producing the same and its product. SOLUTION: Essential components of the thermosetting resin composition are an epoxy resin(a), a reaction product(b) of water and an organic silicon compound shown by formula (1) (wherein R is an organic group containing a functional group which makes addition reaction with the epoxy resin and R' is a methyl or ethyl group), a bismaleimide compound(c) shown by formula (2) (wherein A is a bivalent organic group having at least two carbon atoms) and a curing agent(d). COPYRIGHT: (C)2004,JPO&NCIPI

3. 发明专利

JP2004200354A Wiring board and method of manufacturing the same, and member therefor and method of manufacturing the same 审中-公开
公开(公告)号：JP2004200354A
公开(公告)日：2004-07-15
申请号：JP2002366261
申请日：2002-12-18
申请人： Hitachi Cable Ltd , Hitachi Ltd , 日立電線株式会社 , 株式会社日立製作所
发明人： ONDA MAMORU , SATO TAKASHI , YAMADA HIROSHI , KOIZUMI TOYOHARU , SUZUKI MASAHIRO , TAKAHASHI AKIO
IPC分类号： C08L63/00 , C08L79/08 , C08L83/04 , C08L101/00 , H01L23/14 , H05K1/03 , H05K3/00 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To prevent deformation of the wiring board at the temperature near the soldering temperature without providing any base material for the reinforcement to an insulated substrate in the wiring board, in which the wiring is provided on the surface of the insulated substrate using a resin material or on the surface and interior of the same substrate. SOLUTION: The insulated substrate is formed as the wiring board comprising an oligomer type organic silicon compound which is generated with the reaction between the organic silicon compound expressed by the following chemical formula (R is an organic group including an functional group which shows additional reaction with the epoxy resin, and R' is a methyl group or ethyl group), a hardening agent which realize hardening through the additional reaction of the epoxy resin and the oligomer type organic silicon compound, and a resin material formed through thermal hardening of a mixture of the functional group which is easily coupled with hydrogen and a compound including the reactive unsaturated coupling. COPYRIGHT: (C)2004,JPO&NCIPI

4. 发明专利

JP2004063710A Wiring board and electronic evice, and method for manufacturing the same 审中-公开
公开(公告)号：JP2004063710A
公开(公告)日：2004-02-26
申请号：JP2002219067
申请日：2002-07-29
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ONDA MAMORU , YOSHIKAZU TAKAYUKI , SATO TAKASHI , KOIZUMI TOYOHARU
IPC分类号： H05K1/14 , H05K3/36 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a technology capable of inspecting a conductivity of a wiring board comprising a rigid board and a felxible substrate before connecting the rigid board and the flexible substrate. SOLUTION: A wiring board comprises a first wiring board 1 with wirings 102 (conductive patterns) provided on the surface, or on the surface and inside, and a second wiring substrate 2 with wirings 202 (conductive patterns) provided on the surface of a film insulation substrate. The substrate 2 is connected to the board 1 so that the wirings 202 provided on the surface of the board 1 are drawn outside region of the board 1, and the wirings 102 of the board 1 and the wirings 202 of the substrate 2 are electrically connected by projective conductors 203. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003069175A Wiring board and its manufacturing method 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：JP2003069175A
公开(公告)日：2003-03-07
申请号：JP2001254649
申请日：2001-08-24
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ONDA MAMORU , YAMADA HIROSHI , SATO TAKASHI
IPC分类号： H05K1/11 , H01L23/14 , H05K3/00 , H05K3/06 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To improve connecting reliability of a first conductor wiring to a second conductor wiring in a double-side wiring board using a glass epoxy board.
SOLUTION: The wiring board comprises the first conductor wiring provided on a first main surface of a tape-like insulating board, and the second conductor wiring provided on a second main surface opposed to the first main surface of the insulating board to be electrically connected to the first wiring. In this wiring board, the insulating board is a board made of a fibrous insulating base and an insulating resin. The first and second wirings are electrically connected by a conductive material filed in an opening provided by punching the insulating board by a die.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：使用玻璃环氧板在双面布线板中提高第一导体布线与第二导体布线的连接可靠性。解决方案：布线板包括设置在带状绝缘板的第一主表面上的第一导体布线和设置在与绝缘板的第一主表面相对的第二主表面上的第二导体布线，以电连接到第一个接线。在该布线板中，绝缘板是由纤维绝缘基底和绝缘树脂制成的板。第一和第二布线通过在通过模具冲压绝缘板所提供的开口中的导电材料电连接。

6. 发明专利

JP2009290082A Producing method of printed circuit board 审中-公开
标题翻译：印刷电路板的制作方法
公开(公告)号：JP2009290082A
公开(公告)日：2009-12-10
申请号：JP2008142702
申请日：2008-05-30
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： MATSUO NAGAYOSHI , SATO TAKASHI
IPC分类号： H05K3/28 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To produce a printed circuit board including a thermosetting solder resist for acquiring both sufficient thickness of coating film and linearity of the boundary between coating domain and non-coating domain.
SOLUTION: The producing method of printed circuit is proposed to form, with the photolithograpy process, metal wires having electric conductivity to both front and rear surfaces or to the single surface of a base material including an electrically insulated polymer resin and to coat the thermosetting type solder resist for protection of such metal wires using a screen formed of a solder resist coating domain not covered with emulsion and a solder resist non-coating domain covering the entire part with the emulsion. In this producing method of printed circuit board, a mesh size used for the screen is set to #200 to #500 and not only the emulsion is arranged in the non-coating domain but also the fine emulsion is uniformly dispersed in the coating domain.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：制造包括热固性阻焊剂的印刷电路板，用于获得涂膜的足够厚度和涂层域与非涂覆区域之间的边界线性。解决方案：印刷电路的制造方法是通过光刻工艺形成具有导电性的前后表面的金属线或包含电绝缘聚合物树脂的基材的单面，并且涂覆使用由未被乳剂覆盖的阻焊涂层域形成的筛网和用乳液覆盖整个部分的阻焊剂非涂覆区域来保护这种金属线的热固型阻焊剂。在这种印刷电路板的制造方法中，用于筛网的筛网尺寸设定为＃200〜＃500，不仅乳液布置在非涂布区域中，而且细乳液均匀地分散在涂布区域中。版权所有（C）2010，JPO＆INPIT

7. 发明专利

JP2004071858A Wiring board and electronic device, and manufacturing method of wiring board and manufacturing method of electronic device 审中-公开
标题翻译：接线板及电子设备及制造方法及电子设备的制造方法
公开(公告)号：JP2004071858A
公开(公告)日：2004-03-04
申请号：JP2002229625
申请日：2002-08-07
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ONDA MAMORU , YOSHIKAZU TAKAYUKI , SATO TAKASHI
IPC分类号： H05K3/46 , H01L23/12
CPC分类号： H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/15153 , H01L2924/15321 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To prevent shape defect and exposure defect of a wiring provided to the bottom of a recess in the wiring board provided with the recess for mounting a semiconductor chip. SOLUTION: In the wiring board, a wiring (conductor pattern) is provided to the surface and the inside of an insulating substrate, the insulating substrate has a recess, and the wiring is provided to the surface and the inside of the insulating substrate and the bottom of the recess of the insulation substrate. The wiring board comprises a first wiring substrate provided with a wiring in the surface and the inside of the first insulating substrate with an opening of a predetermined shape and a second wiring substrate provided with a wiring in a region overlapping with an opening of the first insulating substrate of a film-like second insulating substrate. The second wiring substrate is adhered to close one opening end of the opening of the first insulating substrate. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了防止设置在设置有用于安装半导体芯片的凹部的布线板中的凹部的底部的布线的形状缺陷和曝光缺陷。解决方案：在布线板中，在绝缘基板的表面和内部设置布线（导体图案），绝缘基板具有凹部，并且布线被设置在绝缘基板的表面和内部基板和绝缘基板的凹部的底部。布线基板包括：第一布线基板，其在第一绝缘基板的表面和内部具有预定形状的开口，并且在与第一绝缘体的开口重叠的区域中设置布线的第二布线基板薄膜状第二绝缘基板的基板。第二布线基板被粘合以封闭第一绝缘基板的开口的一个开口端。版权所有（C）2004，JPO

8. 发明专利

JP2004273516A Method of manufacturing wiring board 有权
公开(公告)号：JP2004273516A
公开(公告)日：2004-09-30
申请号：JP2003058332
申请日：2003-03-05
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： SHIBATA AKIJI , KOIZUMI TOYOHARU , ISHIHARA TAKESHI , SATO TAKASHI
IPC分类号： H05K3/42 , H01L21/48 , H05K1/18 , H05K3/00 , H05K3/10
CPC分类号： H05K3/0094 , H01L21/4857 , H01L21/486 , H05K1/183 , H05K3/108 , H05K3/421 , H05K2201/0355 , H05K2201/0394 , H05K2201/09581 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165
摘要： PROBLEM TO BE SOLVED: To reduce a time required for manufacturing a double-sided wiring board equipped with aerial wiring in its manufacturing method. SOLUTION: The method of manufacturing the wiring board comprises processes of boring an opening penetrating through an insulating board and a first conductor film while the first conductor film is bonded on the first main surface of the insulating board, bonding a second conductor film on the second main surface of the insulating board where the opening has been bored, forming a conductive film on all the first main surface of the insulating board after the process of bonding the second conductor film is carried out, masking the predetermined opening with a resist, forming a plating film on the first conductor film and inside the opening provided on the surface of the insulating board, forming a first conductor pattern by patterning the first conductor film, forming a second conductor pattern by patterning the second conductor film, and removing the plating resist and eliminating the conductive film covered with the plating resist. COPYRIGHT: (C)2004,JPO&NCIPI

9. 发明专利

JP2003298234A Multilayer wiring board, its manufacturing method, and wiring board 审中-公开
标题翻译：多层接线板及其制造方法和接线板
公开(公告)号：JP2003298234A
公开(公告)日：2003-10-17
申请号：JP2002098552
申请日：2002-04-01
申请人： Hitachi Cable Ltd , 日立電線株式会社
发明人： ONDA MAMORU , YOSHIKAZU TAKAYUKI , SATO TAKASHI
IPC分类号： H05K1/11 , H05K1/14 , H05K3/36 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board, which is capable of easily providing a region that is locally high in wiring density to each wiring layer of the multilayer wiring board. SOLUTION: Wiring (conductor pattern) is provided in layers on an insulating board for the formation of the multilayer wiring board as an insulator layer is interposed between wiring layers. A first wiring board where one or more wiring layers are provided is provided on the first insulating board, and a second wiring board where a wiring layer is provided is provided on the first wiring board for the formation of the multilayer wiring board. The second wiring board is laminated and bonded on the first wiring board, and the wiring of the first wiring board is electrically connected to that of the second wiring board for the formation of the multilayer wiring board. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种制造多层布线板的方法，其能够容易地为多层布线板的每个布线层提供布局密度局部高的区域。解决方案：在用于形成多层布线板的绝缘板上设置布线（导体图案），因为在布线层之间插入绝缘体层。在第一绝缘板上设置有设置有一个或多个布线层的第一布线板，并且在用于形成多层布线板的第一布线板上设置布置有布线层的第二布线板。第二配线基板被层压并接合在第一布线板上，并且第一布线板的布线与用于形成多层布线板的第二布线板的布线电连接。版权所有（C）2004，JPO

10. 发明专利

JP2014238950A 開閉装置及びその開閉方法有权
标题翻译：打开/关闭装置及其打开/关闭方法
公开(公告)号：JP2014238950A
公开(公告)日：2014-12-18
申请号：JP2013120346
申请日：2013-06-07
申请人：株式会社日立製作所 , Hitachi Ltd
发明人： SATO TAKASHI , TSUCHIYA KENJI , MORITA AYUMI
IPC分类号： H01H33/42
CPC分类号： H01H33/666 , H01H3/40 , H01H33/42
摘要：【課題】電極表面の荒れを防止することは勿論、絶縁性能が高い開閉装置を提供する。【解決手段】固定電極11A,11B、該固定電極に対して閉極又は開極される可動電極12A,12Bを各々備える複数の開閉部10A,10Bと、該複数の開閉部のそれぞれの前記固定電極に対して閉極又は開極する可動電極を操作する操作手段とを備え、前記操作手段は、1つの原動部位1と2つの従動部位2A,2Bから成ると共に、該原動部位及び従動部位は、互いに間欠動作し、かつ、前記従動部位の一部が前記原動部位と当接することによって前記原動部位から前記従動部位に動力が伝達されない状態においては前記従動部位の状態が固定され、前記原動部位が初期位置から最終位置まで変位する状態においては一方の前記従動部位の状態を遷移させ、それに遅れて他方の前記従動部位の状態を変更することによって、時間差を発生させながら前記複数の開閉部が駆動される。【選択図】図1
摘要翻译：要解决的问题：提供一种不仅能够防止电极表面的粗糙度而且提高绝缘性能的开闭装置。解决方案：打开/关闭装置包括：多个打开/关闭部分10A和10B，其各自包括固定的电极11A和11B以及相对于固定电极闭合或打开的可动电极12A和12B; 以及操作装置，用于在多个打开/关闭部分中的每一个中操作相对于固定电极闭合或打开的可动电极。操作装置包括一个移动部分1和两个从动部分2A和2B。动子部分和从动部分彼此间歇地操作。由于从动部分的一部分与动子部分抵接，在从动件部分向从动部分传递动力的状态下，从动部分的状态是固定的，并且在动子部分移位的状态下从初始位置到最终位置，一个从动部分的状态被移动。随后通过改变另一从动件部分的状态，在产生时间差的同时驱动多个打开/关闭部件。

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