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1. 发明专利

JP2006260951A Conductive copper paste 审中-公开
标题翻译：导电铜浆
公开(公告)号：JP2006260951A
公开(公告)日：2006-09-28
申请号：JP2005077021
申请日：2005-03-17
申请人： Harima Chem Inc , Osaka Univ , ハリマ化成株式会社 , 国立大学法人大阪大学
发明人： TAKEMOTO TADASHI , NISHIKAWA HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B1/22 , H01B1/00
摘要： PROBLEM TO BE SOLVED: To provide a conductive copper paste capable of, as a main part of a conductive filler, manufacturing a conductive adhesive layer showing excellent conductivity by using copper particles, with the formed conductive adhesive layer capable of keeping excellent conductivity for a long period.
SOLUTION: Low melting-point alloy particles are used as well by less amount than copper particles. A thermo-curable phenol resin of a binder resin is added with flux agent, a trace amount of flux activity suppressing agent, and chelating agent. A conductive copper paste is thus configured. So, before curing of the binder resin, a low melting-point alloy having a low melting-point dissolves, to fill the gap among copper particles, forming metal bonding. Then, when the temperature rises for thermo-curing of resin, the flux activity suppressing agent reacts with the flux active component to lose activity of the flux, providing a conductive copper paste for manufacturing a conductive adhesive layer excellent in conductivity and anti-oxidation characteristics.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种导电铜浆，其能够作为导电填料的主要部分，通过使用铜颗粒制造显示出优异的导电性的导电粘合剂层，所形成的导电粘合剂层能够保持优异的导电性很长一段时间。
解决方案：低熔点合金颗粒的使用量也少于铜颗粒。加入粘合剂树脂的热固性酚醛树脂，添加助熔剂，微量助焊剂活性抑制剂和螯合剂。因此构成导电铜浆。因此，在粘合剂树脂固化之前，具有低熔点的低熔点合金溶解，以填充铜颗粒之间的间隙，形成金属粘合。然后，当树脂的热固化温度升高时，助焊剂活性抑制剂与助焊剂活性成分反应，失去助焊剂的活性，提供导电性铜膏，用于制造导电性和抗氧化特性优异的导电性粘合剂层。版权所有（C）2006，JPO＆NCIPI

2. 发明专利

JP2005225980A Electrically conductive adhesive 有权
标题翻译：电导电胶
公开(公告)号：JP2005225980A
公开(公告)日：2005-08-25
申请号：JP2004036213
申请日：2004-02-13
申请人： Denso Corp , Harima Chem Inc , ハリマ化成株式会社 , 株式会社デンソー
发明人： TERADA NOBUHITO , SHIOI NAOTO , TOTOKAWA SHINJI , NINOMIYA YASUTOKU
IPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , C09J11/04 , C09J11/06 , H01B1/00 , H01B1/22 , H05K3/32
CPC分类号： C09J163/00 , C08G59/42 , C08L63/00 , C09J9/02 , H01B1/22 , H05K3/321 , H05K2201/0239
摘要： PROBLEM TO BE SOLVED: To obtain an electrically conductive adhesive usable as an alternative for solder jointing as a means for electrically conductive joint formation in the surface mounting of electronic parts for vehicle loading and in making electronic parts themselves.
SOLUTION: The electrically conductive adhesive is obtained by dispersing silver powder or the like as electrically conductive medium in a binder resin component consisting of an one-part epoxy-based thermosetting resin essentially comprising an epoxy resin component based on a polycyclic aromatic skeleton-bearing epoxy compound and a cyclic acid anhydride as the curing agent component and also incorporated with a coupling agent as an adhesivity-imparting agent.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得作为用于车辆装载的电子部件的表面安装和制造电子部件本身的用于焊接接合的替代物的导电粘合剂作为用于导电接头形成的装置。解决方案：导电粘合剂通过将银粉等作为导电介质分散在由基于多环芳族骨架的基本上包含环氧树脂组分的单组分环氧基热固性树脂组成的粘合剂树脂组分中的环氧化合物和环状酸酐作为固化剂组分，并且还与作为粘合剂赋予剂的偶联剂结合。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2003347718A Surface mounting method and circuit board 审中-公开
标题翻译：表面安装方法和电路板
公开(公告)号：JP2003347718A
公开(公告)日：2003-12-05
申请号：JP2002155404
申请日：2002-05-29
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： KOYAMA MASAHIDE , MATSUBA YORISHIGE , TERADA NOBUHITO , IZUMITANI AKITO
IPC分类号： B23K35/363 , H01L21/60 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a surface mounting method in which an underfill agent which utilizes a thermo-plastic resin is added with flux activity, and capable of soldering and flux processing to a solder material under the flux activity in a single thermal process. SOLUTION: A thermo-plastic resin that contains, as a main component, an atom group showing flux property in molecule is used as a sealing filler, and the one that softens or melts at the melting point of a solder material is selected. The atom group showing the flux property acts to remove the oxide film of a metal material constituting a bump or a pad provided on the substrate as well as the surface mounting components contacting the thermo-plastic resin. A blind via is eccentrically positioned on the pad for a reproducible good solder joint and sealing/filling, in a single process. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种表面安装方法，其中使用热塑性树脂的底部填充剂添加有助焊剂活性，并且能够以单一的助焊剂活性焊接和焊剂加工到焊料材料热处理。解决方案：使用包含分子中显示焊剂性质的原子团作为主要成分的热塑性树脂作为密封填料，并且选择在焊料的熔点下软化或熔化的材料。显示助焊剂性质的原子团起到除去构成凸起的金属材料的氧化物膜或者设置在基板上的焊盘以及与热塑性树脂接触的表面安装部件的作用。盲孔通过偏心定位在垫上，用于可重复的良好焊接接头和密封/填充，在单个过程中。版权所有（C）2004，JPO

4. 发明专利

JP2009299086A Method of forming thick film layer of metal nano particle sintered body 有权
标题翻译：形成金属纳米颗粒烧结体的薄膜层的方法
公开(公告)号：JP2009299086A
公开(公告)日：2009-12-24
申请号：JP2008151678
申请日：2008-06-10
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： UEDA MASAYUKI , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： C23C18/06 , B22F1/02 , B22F9/00 , B82B3/00 , H01B13/00 , H05K1/09 , H05K3/22 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a thick film layer of a metal nano particle sintered body having the excellent adhesiveness to a base layer and the high conductivity on a substrate by applying a method of heating the metal nano particle dispersion liquid coating film from the substrate surface side by using a hot plate like substrate heating means. SOLUTION: The substrate with a coating film being plotted on its surface is arranged on a hot plate like substrate heating means which is heated at the temperature T plate , and heated from a substrate back side in contact with the substrate heating means. The temperature : T bottom (t) on the substrate surface side of the coating film is set to be in a range of 150-250°C, and set to the temperature selected to be lower than the boiling point T b-solvent of the dispersive solvent contained in the coating film. The surface temperature : T top (t) of the coating film is maintained in a range of the temperature difference ΔT(t)=äT bottom (t)-T top (t)}≥10°C, the coating film is heated to cause the low-temperature sintering of metal nano particles contained therein. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过应用加热金属纳米颗粒的方法形成具有优异的基底粘附性和基底上的高导电性的金属纳米颗粒烧结体的厚膜层的方法通过使用热板如基板加热装置从基板表面侧分散液体涂膜。＆lt; P＆gt;解决方案：将具有涂膜的基板在其表面上绘制在热板上，如在基板加热装置上加热，在温度T 板加热，并从基板背面加热与基板加热装置接触。将涂膜的基材表面侧的温度T 底部（t）设定在150〜250℃的范围内，将其设定为低于沸点涂布膜中所含的分散溶剂的T b-溶剂。涂膜的表面温度T 顶部（t）保持在温差ΔT（t）=äT底部（t）-T top （t）}≥10℃，加热涂膜，使其内含有金属纳米粒子的低温烧结。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2009088340A Method of manufacturing metal nanoparticle sintered compact 有权
标题翻译：金属纳米复合材料的制备方法
公开(公告)号：JP2009088340A
公开(公告)日：2009-04-23
申请号：JP2007257594
申请日：2007-10-01
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ABE SHINTARO , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/12 , B22F1/00 , H01B13/00 , H05K1/09 , H05K3/10
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal nanoparticle sintered compact capable of reducing the scattering of a conductivity of the whole sintered compact layer to be formed and at the same time keeping the conductivity of the whole sintered compact layer obtained in a range of 1×10 -5 Ω cm or below with a high reproducibility, when the metal nanoparticle sintered compact is produced by a low temperature sintering of metal nanoparticles. SOLUTION: After applying a dispersion liquid in which metal nanoparticles with an average particle diameter of 1-100 nm, the surface of which is coated with alkylamine, are dispersed in an organic solvent having a boiling point of 100°C or higher, the metal nanoparticle sintered compact is formed by efficiently removing alkylamine covering the surface of the metal nanoparticles by heating at a temperature of 100°C-200°C under pressurized atmosphere of 1.5 atm-10 atm. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种能够减少要形成的整个烧结体层的电导率的散射的金属纳米颗粒烧结体的制造方法，同时保持整个烧结体层的导电性通过金属纳米粒子的低温烧结制造金属纳米粒子烧结体时，以1×10 -5 Ωcm以下的范围以高的再现性获得。解决方案：在其表面用烷基胺涂覆其中平均粒径为1-100nm的金属纳米颗粒涂布在沸点为100℃或更高的有机溶剂中的分散液之后，金属纳米颗粒烧结体通过在1.5atm-10大气压的加压气氛下在100℃-200℃的温度下加热而有效地除去覆盖金属纳米颗粒表面的烷基胺而形成。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2004059778A Liquid epoxy resin composition for encapsulation filler 审中-公开
公开(公告)号：JP2004059778A
公开(公告)日：2004-02-26
申请号：JP2002221264
申请日：2002-07-30
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ITO DAISUKE , TERADA NOBUHITO
IPC分类号： C08L63/00 , C08G59/48 , C08K3/00 , C08K5/00 , H01L21/56
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for an encapsulation filler which has a function equivalent to flux treatment which removes an oxide film formed on a bump electrode, etc., using a lead-free tin-alloy solder and has desirable resin characteristics as an underfill (encapsulation filler). SOLUTION: The liquid epoxy resin composition used in an encapsulation filling step in flip chip packaging essentially comprises (A) a liquid, thermosetting epoxy resin, (B) an acid anhydride as a hardener and (C) a dispersible hardening accelerator. From 5×10 -2 to 5×10 -1 mol 9-15C dicarboxylic acid, serving as (D) a flux activity-enhancing component having a proton-donating ability, is added to the composition per 1 mol acid anhydride. COPYRIGHT: (C)2004,JPO

7. 发明专利

JP2003082064A Liquid epoxy resin composition for sealing filler 有权
标题翻译：用于密封填料的液体环氧树脂组合物
公开(公告)号：JP2003082064A
公开(公告)日：2003-03-19
申请号：JP2001362370
申请日：2001-11-28
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： ITO DAISUKE , TERADA NOBUHITO , GOTO HIDEYUKI
IPC分类号： C08G59/42 , H01L21/60 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide a liquid epoxy resin composition for a sealing filler imparted with a function comparable to the function attained by a flux treatment to remove the oxide film such as a bump electrode using a lead-free tin alloy solder and exhibiting desired resin properties also as an underfill (sealing filler). SOLUTION: The liquid epoxy resin composition for the sealing and filling stage in a flip chip mounting process is produced by using (A) a liquid thermosetting epoxy resin and (B) a curing agent composed of an acid anhydride as essential components and adding (C) a 9-15C dicarboxylic acid as a flux activity promoting component having proton donative property in an amount of 5×10 to 5×10 mol based on 1 mol of the acid anhydride.
摘要翻译：要解决的问题：提供一种用于密封填料的液体环氧树脂组合物，其具有与通过焊剂处理获得的功能相当的功能，以使用无铅锡合金焊料去除氧化膜，例如凸块电极，并显示期望的树脂性能也作为底层填料（密封填料）。解决方案：通过使用（A）液态热固性环氧树脂和（B）由酸酐组成的固化剂作为必要成分并添加（C（C）），制造用于倒装芯片安装工艺中的密封和填充阶段的液体环氧树脂组合物）9-15C二羧酸作为助催化活性促进成分，具有质子供体性，相对于1摩尔酸酐为5×10 -2至5×10 -1摩尔。

8. 发明专利

JP2009283783A Formation method of high adhesiveness metal nanoparticle sintered compact film 有权
标题翻译：高粘度金属纳米材料烧结薄膜的形成方法
公开(公告)号：JP2009283783A
公开(公告)日：2009-12-03
申请号：JP2008135884
申请日：2008-05-23
申请人： Harima Chem Inc , Katsuhiro Maekawa , Mamoru Onda , ハリマ化成株式会社 , 克廣前川 , 護御田
发明人： MAEKAWA KATSUHIRO , YAMAZAKI KAZUHIKO , NIIZEKI TOMOTAKE , ONDA MAMORU , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/10 , C09D1/00 , C23C24/08 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a formation method of a metal nanoparticle sintered compact film having high adhesiveness on a substrate whose surface is coated with a liquid excluding agent coating layer. SOLUTION: Onto the substrate whose surface is coated with the liquid excluding agent coating layer, metal nanoparticle dispersion solution is applied with a predetermined applying liquid thickness, and the surface of the applying liquid layer is vertically irradiated with a laser beam of predetermined wavelength, and a laser exposed region of the liquid excluding agent coating layer contact to the metal nanoparticle dispersion solution is selectively removed. Continuously, the applying liquid layer is irradiated with the laser beam of predetermined wavelength, the temperature of the interface between the substrate and the applying liquid layer is raised, and the metal nanoparticle sintered compact film having high adhesiveness on the substrate surface is formed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在其表面涂布有不包括药剂涂层的液体的基材上具有高粘合性的金属纳米颗粒烧结致密膜的形成方法。解决方案：在表面用不含药液的涂层的基材上涂敷金属纳米颗粒分散液，其预定的涂敷液体厚度，并用预定的激光束垂直照射涂布液层的表面选择性地除去与液体排除剂涂层接触的金属纳米颗粒分散溶液的激光曝光区域。连续地对预定波长的激光束照射涂布液层，使衬底和涂布液层之间的界面的温度升高，并且形成在衬底表面上具有高粘合性的金属纳米颗粒烧结致密膜。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2009070727A Forming method of metal nanoparticle sintered body layer having fine pattern form 有权
标题翻译：具有精细图案的金属纳米材料烧结体层的形成方法
公开(公告)号：JP2009070727A
公开(公告)日：2009-04-02
申请号：JP2007239237
申请日：2007-09-14
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B13/00 , B22F1/02 , B22F7/04 , H01B1/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal nanoparticle sintered body capable of attaining a high adhesion property in an interface of a base layer and a sintered body layer, by restraining degradation of bulk density, mechanical strength, and conductivity of the sintered body layer as a whole formed, and further, by heightening density of the sintered body layer as a whole obtained, in manufacturing a metal nanoparticle sintered body on a substrate by sintering metal nanoparticles at low temperature. SOLUTION: Dispersion liquid with metal nanoparticles with a mean particle size of 1 to 100 nm having the surface coated with alkylamine dispersed in a hydrocarbon solvent with a boiling point of 150°C or more is coated on a substrate, and then is put under heat treatment at a temperature of 150 to 300°C under a non-pressurized reduction atmosphere to efficiently take off the alkylamine coating the surface and have the sintered body formed with excellent adhesiveness with the substrate through dense fusion among the metal nanoparticles themselves. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种金属纳米颗粒烧结体的制造方法，其能够通过抑制堆积密度，机械强度和低密度聚乙烯的降解，从而在基层和烧结体层的界面上获得高附着性另外，通过提高烧结体层的密度，通过在低温下烧结金属纳米粒子而在基板上制造金属纳米粒子烧结体，整体上形成了烧结体层的导电性。解决方案：将具有分散在沸点为150℃或更高的烃溶剂中的烷基胺表面涂覆的平均粒度为1至100nm的金属纳米颗粒的分散液涂覆在基材上，然后是在非加压还原气氛下，在150〜300℃的温度下进行热处理，以有效地脱除表面的烷基胺，并且通过金属纳米颗粒本身之间的致密融合，使与烧结体形成与基板的粘合性良好的烧结体。版权所有（C）2009，JPO＆INPIT

10. 发明专利

JP2009006337A Ultrafine solder composition 有权
标题翻译：超声焊接组合物
公开(公告)号：JP2009006337A
公开(公告)日：2009-01-15
申请号：JP2007168121
申请日：2007-06-26
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： B23K35/26 , B23K35/22 , B23K35/363 , C22C13/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an ink-like solder composition which can be used for a soldering equivalent to that using an Sn-Ag based alloy solder by utilizing metal nano particles with the mean particle size being ≤100 nm suitable for the inkjet printing, blending the mixture of Sn nano particles and Ag nano particles, and using the melting of these metal nano particles at low temperature and the subsequent alloying thereof. SOLUTION: In the ink-like solder composition, the mixing ratio W Sn :W Ag of Sn nano particles and Ag nano particles is selected in a range of (95:5) to (99.5:0.5) corresponding to the blending ratio of Sn to Ag in the Sn-Ag based alloy solder; the ratio d1:d2 is selected in a range of (4:1) to (10:1) while the mean particle size d1 of Sn nano particles and the mean particle size d2 of Ag nano particles being in a range of 2-100 nm. The flux component of 0.5-2 pts.mass is added per 10 pts.mass of Sn nano particles 10, and dispersed in a non-polar solvent of high boiling point. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种油墨状焊料组合物，其可以用于与使用Sn-Ag基合金焊料相当的焊接，其利用平均粒度为≤100nm的金属纳米颗粒适合于喷墨印刷，混合Sn纳米颗粒和Ag纳米颗粒的混合物，并且在低温下使用这些金属纳米颗粒的熔融以及随后的合金化。解决方案：在油墨状焊料组合物中，Sn纳米颗粒和Ag纳米颗粒的混合比W Sn ： Ag 选择在（ 95:5）〜（99.5:0.5），相当于Sn-Ag系合金焊料中Sn与Ag的配合比例。比例d1：d2选择在（4:1）至（10:1）的范围内，而Sn纳米颗粒的平均粒径d1和Ag纳米颗粒的平均粒径d2在2-100范围内 nm。每10分钟的Sn纳米颗粒10加入0.5-2pts.mass的助熔剂组分，并分散在高沸点的非极性溶剂中。版权所有（C）2009，JPO＆INPIT

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