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1. 发明专利

JP2009283783A Formation method of high adhesiveness metal nanoparticle sintered compact film 有权
标题翻译：高粘度金属纳米材料烧结薄膜的形成方法
公开(公告)号：JP2009283783A
公开(公告)日：2009-12-03
申请号：JP2008135884
申请日：2008-05-23
申请人： Harima Chem Inc , Katsuhiro Maekawa , Mamoru Onda , ハリマ化成株式会社 , 克廣前川 , 護御田
发明人： MAEKAWA KATSUHIRO , YAMAZAKI KAZUHIKO , NIIZEKI TOMOTAKE , ONDA MAMORU , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/10 , C09D1/00 , C23C24/08 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a formation method of a metal nanoparticle sintered compact film having high adhesiveness on a substrate whose surface is coated with a liquid excluding agent coating layer. SOLUTION: Onto the substrate whose surface is coated with the liquid excluding agent coating layer, metal nanoparticle dispersion solution is applied with a predetermined applying liquid thickness, and the surface of the applying liquid layer is vertically irradiated with a laser beam of predetermined wavelength, and a laser exposed region of the liquid excluding agent coating layer contact to the metal nanoparticle dispersion solution is selectively removed. Continuously, the applying liquid layer is irradiated with the laser beam of predetermined wavelength, the temperature of the interface between the substrate and the applying liquid layer is raised, and the metal nanoparticle sintered compact film having high adhesiveness on the substrate surface is formed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在其表面涂布有不包括药剂涂层的液体的基材上具有高粘合性的金属纳米颗粒烧结致密膜的形成方法。解决方案：在表面用不含药液的涂层的基材上涂敷金属纳米颗粒分散液，其预定的涂敷液体厚度，并用预定的激光束垂直照射涂布液层的表面选择性地除去与液体排除剂涂层接触的金属纳米颗粒分散溶液的激光曝光区域。连续地对预定波长的激光束照射涂布液层，使衬底和涂布液层之间的界面的温度升高，并且形成在衬底表面上具有高粘合性的金属纳米颗粒烧结致密膜。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2005093814A Method for forming multilayer wiring pattern 有权
标题翻译：形成多层布线图案的方法
公开(公告)号：JP2005093814A
公开(公告)日：2005-04-07
申请号：JP2003326572
申请日：2003-09-18
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： H05K3/28 , H05K3/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a method for forming a novel multilayer wiring structure wherein alignment of the lowest wiring layer with upper wiring layers is maintained with high precision, intricacy of layer connecting conductive route formation is greatly reduced, and wiring suitable for pattern miniaturization is feasible, and to provide a circuit board having multiple wiring layers utilizing this method. SOLUTION: A conductive paste applied layer is formed for lower layer wiring on an insulating substrate by using the inkjet method for drawing. Concerning the parts whereon an upper wiring pattern is placed, an insulating paste applied layer is formed for interlayer insulation except at parts where conduction is to be established between the upper and lower layers. Further, a conductive paste applied layer for upper wiring is laminated, and is treated by heat. A conductive layer is made out of each conductive paste applied layer and an insulating layer is made out of each insulating paste applied layer, which results in a multilayer wiring structure wherein upper and lower layers are insulated from each other at parts where the insulating film exists and connection/conduction is established between them at parts where the insulating film is omitted. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种形成新颖的多层布线结构的方法，其中最高布线层与上布线层的对准以高精度保持，层间连接导电路径形成的复杂度大大降低，布线适合为了图案小型化是可行的，并且提供一种使用该方法的具有多个布线层的电路板。解决方案：通过使用喷墨方法在绝缘基板上形成用于下层布线的导电糊涂层。关于放置上部布线图案的部分，形成用于层间绝缘的绝缘膏施加层，除了要在上层和下层之间建立传导的部分之外。此外，层叠用于上部布线的导电性糊剂涂布层，并进行热处理。由每个导电糊涂层施加导电层，并且由每个绝缘膏施加层制成绝缘层，这导致多层布线结构，其中上层和下层在存在绝缘膜的部分处彼此绝缘并且在省略绝缘膜的部分之间建立它们之间的连接/导通。版权所有（C）2005，JPO＆NCIPI

3. 发明专利

JP2004140174A Electronic component and method of manufacturing the same, and conductive paste used in the same 审中-公开
标题翻译：电子元件及其制造方法及其使用的导电浆料
公开(公告)号：JP2004140174A
公开(公告)日：2004-05-13
申请号：JP2002303179
申请日：2002-10-17
申请人： Harima Chem Inc , Matsushita Electric Ind Co Ltd , ハリマ化成株式会社 , 松下電器産業株式会社
发明人： KAWAGUCHI ISAO , TAKENAKA AKIRA , GOTO HIDEYUKI , SAITO HIROSHI
IPC分类号： H01F41/04 , H01B1/00 , H01B1/22 , H01B13/00 , H01F17/00
摘要： PROBLEM TO BE SOLVED: To reduce a temperature and pressure at which transferring is carried out, and also to shorten a transferring time.
SOLUTION: An electronic component comprises a substrate 1, an adhesive layer 50 supplied on the substrate 1, a transferred pattern formed by transferring, onto the adhesive, conductive paste which is composed of a solvent, a powder conductor, and a binder and with which trenches 31 of an intaglio plate 32 formed of flexible resin are filled up, and a conductor pattern formed by baking the transferred pattern. The conductive paste is cured at a temperature not lower than the volatilization temperature of the solvent and lower than a melting point of the conductive paste, and is one not firmly fixed in the trenches. Hence, there is no need of penetrating the adhesive layer 50 to the conductive paste 42 and curing it. Consequently, the temperature and the pressure at which the conductive paste 42 is transferred to the substrate 1 can be low and the time required for transferring is shortened.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：降低进行转印的温度和压力，并缩短转印时间。解决方案：电子部件包括基板1，提供在基板1上的粘合剂层50，通过将由溶剂，粉末导体和粘合剂构成的导电浆料转印到粘合剂上而形成的转印图案并且填充由柔性树脂形成的凹版32的沟槽31以及通过烘烤转印图案形成的导体图案。导电性糊剂在不低于溶剂的挥发温度的温度下固化，低于导电性糊剂的熔点，且不牢固地固定在沟槽中。因此，不需要将粘合剂层50穿透到导电膏42并使其固化。因此，将导电膏42转印到基板1上的温度和压力可以低，并且转印所需的时间缩短。版权所有（C）2004，JPO

4. 发明专利

JP2004055345A Conductive paste for microscopic circuit formation 有权
公开(公告)号：JP2004055345A
公开(公告)日：2004-02-19
申请号：JP2002211455
申请日：2002-07-19
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： GOTO HIDEYUKI , SAITO HIROSHI
IPC分类号： H05K3/12 , H01B1/22 , H01B1/24
摘要： PROBLEM TO BE SOLVED: To provide baking type conductive paste capable of forming extremely minute conductor wiring.
SOLUTION: This conductive paste is prepared by using an organosilsesquioxane-system oligomer soluble in an organic solvent instead of glass fritt powder dispersed as a solid-phase constituent in paste, and by dispersing metal powder or the like of a conductive medium in a solution prepared by dissolving the organosilsesquioxane-system oligomer in an organic solvent. When a coating layer of the paste is formed, a silicone-system oligomer resin deposited by the evaporation of the organic solvent is used as an organic binder. In baking, a ladder type siloxane skeleton of the silicone-system oligomer is thermally converted into a silicon oxide melt and used as an inorganic binder constituent for tightly fitting and fixing the obtained sintered conductor layer to a ceramic substrate.
COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2009299086A Method of forming thick film layer of metal nano particle sintered body 有权
标题翻译：形成金属纳米颗粒烧结体的薄膜层的方法
公开(公告)号：JP2009299086A
公开(公告)日：2009-12-24
申请号：JP2008151678
申请日：2008-06-10
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： UEDA MASAYUKI , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： C23C18/06 , B22F1/02 , B22F9/00 , B82B3/00 , H01B13/00 , H05K1/09 , H05K3/22 , H05K3/38
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a thick film layer of a metal nano particle sintered body having the excellent adhesiveness to a base layer and the high conductivity on a substrate by applying a method of heating the metal nano particle dispersion liquid coating film from the substrate surface side by using a hot plate like substrate heating means. SOLUTION: The substrate with a coating film being plotted on its surface is arranged on a hot plate like substrate heating means which is heated at the temperature T plate , and heated from a substrate back side in contact with the substrate heating means. The temperature : T bottom (t) on the substrate surface side of the coating film is set to be in a range of 150-250°C, and set to the temperature selected to be lower than the boiling point T b-solvent of the dispersive solvent contained in the coating film. The surface temperature : T top (t) of the coating film is maintained in a range of the temperature difference ΔT(t)=äT bottom (t)-T top (t)}≥10°C, the coating film is heated to cause the low-temperature sintering of metal nano particles contained therein. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种通过应用加热金属纳米颗粒的方法形成具有优异的基底粘附性和基底上的高导电性的金属纳米颗粒烧结体的厚膜层的方法通过使用热板如基板加热装置从基板表面侧分散液体涂膜。＆lt; P＆gt;解决方案：将具有涂膜的基板在其表面上绘制在热板上，如在基板加热装置上加热，在温度T 板加热，并从基板背面加热与基板加热装置接触。将涂膜的基材表面侧的温度T 底部（t）设定在150〜250℃的范围内，将其设定为低于沸点涂布膜中所含的分散溶剂的T b-溶剂。涂膜的表面温度T 顶部（t）保持在温差ΔT（t）=äT底部（t）-T top （t）}≥10℃，加热涂膜，使其内含有金属纳米粒子的低温烧结。版权所有（C）2010，JPO＆INPIT

6. 发明专利

JP2009070727A Forming method of metal nanoparticle sintered body layer having fine pattern form 有权
标题翻译：具有精细图案的金属纳米材料烧结体层的形成方法
公开(公告)号：JP2009070727A
公开(公告)日：2009-04-02
申请号：JP2007239237
申请日：2007-09-14
申请人： Harima Chem Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H01B13/00 , B22F1/02 , B22F7/04 , H01B1/00 , H05K1/09
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal nanoparticle sintered body capable of attaining a high adhesion property in an interface of a base layer and a sintered body layer, by restraining degradation of bulk density, mechanical strength, and conductivity of the sintered body layer as a whole formed, and further, by heightening density of the sintered body layer as a whole obtained, in manufacturing a metal nanoparticle sintered body on a substrate by sintering metal nanoparticles at low temperature. SOLUTION: Dispersion liquid with metal nanoparticles with a mean particle size of 1 to 100 nm having the surface coated with alkylamine dispersed in a hydrocarbon solvent with a boiling point of 150°C or more is coated on a substrate, and then is put under heat treatment at a temperature of 150 to 300°C under a non-pressurized reduction atmosphere to efficiently take off the alkylamine coating the surface and have the sintered body formed with excellent adhesiveness with the substrate through dense fusion among the metal nanoparticles themselves. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：解决的问题：提供一种金属纳米颗粒烧结体的制造方法，其能够通过抑制堆积密度，机械强度和低密度聚乙烯的降解，从而在基层和烧结体层的界面上获得高附着性另外，通过提高烧结体层的密度，通过在低温下烧结金属纳米粒子而在基板上制造金属纳米粒子烧结体，整体上形成了烧结体层的导电性。解决方案：将具有分散在沸点为150℃或更高的烃溶剂中的烷基胺表面涂覆的平均粒度为1至100nm的金属纳米颗粒的分散液涂覆在基材上，然后是在非加压还原气氛下，在150〜300℃的温度下进行热处理，以有效地脱除表面的烷基胺，并且通过金属纳米颗粒本身之间的致密融合，使与烧结体形成与基板的粘合性良好的烧结体。版权所有（C）2009，JPO＆INPIT

7. 发明专利

JP2005150462A Conductive paste and method for manufacturing substrate using the same 审中-公开
标题翻译：导电胶浆及其制造方法
公开(公告)号：JP2005150462A
公开(公告)日：2005-06-09
申请号：JP2003386919
申请日：2003-11-17
申请人： Harima Chem Inc , Matsushita Electric Ind Co Ltd , ハリマ化成株式会社 , 松下電器産業株式会社
发明人： KAWAGUCHI ISAO , FUJISHIMA YOSHIKAZU , TAKENAKA AKIRA , GOTO HIDEYUKI , SAITO HIROSHI , OSAKO TAKEHISA
IPC分类号： H05K1/09 , H01B1/22 , H01B13/00 , H05K3/20
摘要： PROBLEM TO BE SOLVED: To solve the problem that a conductive paste filling a trench loses its volume in a drying step.
SOLUTION: The conductive paste 56 comprises a powder of metal particles and a binder and, therein, the metal powder content is increased and a lubricating layer is formed around a metal particle. The lubricating layer formed around the metal particle enables the paste 56 even in a case of high metal powder content, to roll easily and fill up a trench 54 densely, whereby reduction in the volume of the conductive paste 56 in a drying step 35 is decelerated and the number of repetitions from a printing step 32 to the drying step 35 is lessened.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了解决在干燥步骤中填充沟槽的导电浆料失去其体积的问题。解决方案：导电浆料56包括金属颗粒和粘合剂的粉末，其中金属粉末含量增加，并且在金属颗粒周围形成润滑层。在金属颗粒周围形成的润滑层使得即使在金属粉末含量高的情况下，浆料56也可以容易地滚动并且密集地填充沟槽54，从而减少干燥步骤35中的导电浆料56的体积减少并且从打印步骤32到干燥步骤35的重复次数减少。版权所有（C）2005，JPO＆NCIPI

8. 发明专利

JP2011117021A Method for producing metal powder and metal powder produced by the method 有权
标题翻译：生产金属粉末和金属粉末的方法
公开(公告)号：JP2011117021A
公开(公告)日：2011-06-16
申请号：JP2009273651
申请日：2009-12-01
申请人： Harima Chemicals Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , HAMADA TAKESHI , UEDA MASAYUKI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： B22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a method for reproducibly producing a spherical metal powder having a mean diameter in a region of a submicron order and a micron order, so as to have such a narrow particle size distribution that σ W /W which is a ratio of the standard deviation σ W to a target weight W (metal quantity) of the metal powder is in the range satisfying σ W /W≤1/2. SOLUTION: In a process of dripping and dropping down a dispersion liquid in which metal nanoparticles are dispersed in an organic solvent, in a form of droplets with a predetermined liquid amount, the method for producing the metal powder with a uniform size includes: making the organic solvent contained in the fine droplets of the dispersion liquid of the metal nanoparticles, which are dripped, evaporate to form particles made of an aggregate of the metal nanoparticles; bumping the particles made of the aggregate of the metal nanoparticles; and further heat-treating the particles made of the aggregate of the metal nanoparticles to progress a sintering reaction among the metal nanoparticles. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：提供一种可重复地制造平均直径为亚微米级和微米级的球状金属粉末的方法，以具有如此窄的粒度分布，σ W / SB / W与标准偏差σ W 的比值与金属粉末的目标重量W（金属量）的比值在满足σ W /W≤1/ 2。解决方案：在将金属纳米颗粒分散在有机溶剂中的分散液滴下并以一定液体的液滴的形式滴下的过程中，具有均匀尺寸的金属粉末的制造方法包括：使滴入的金属纳米粒子的分散液的细小液滴中含有的有机溶剂蒸发，形成由金属纳米粒子的聚集体构成的颗粒; 撞击由金属纳米颗粒的聚集体制成的颗粒; 并且进一步热处理由金属纳米颗粒的聚集体制成的颗粒以在金属纳米颗粒之间进行烧结反应。版权所有（C）2011，JPO＆INPIT

9. 发明专利

JP2011038134A Method for producing metal powder, and metal powder produced by the method 有权
标题翻译：生产金属粉末的方法和由该方法生产的金属粉末
公开(公告)号：JP2011038134A
公开(公告)日：2011-02-24
申请号：JP2009184781
申请日：2009-08-07
申请人： Harima Chemicals Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , HATA NORIAKI , MATSUBA YORISHIGE
IPC分类号： B22F1/00
摘要： PROBLEM TO BE SOLVED: To provide a method for reproducibly producing a spherical metal powder having a mean diameter in a region of a submicron order and a micron order, so as to have such a narrow particle size distribution that σ
W /W which is a ratio of the standard deviation σ
W to the target weight W (metal quantity) of the metal powder is in the range satisfying σ
W /W≤1/2.
SOLUTION: The method for producing the metal powder with a uniform size includes: preparing a dispersion liquid in which metal nanoparticles are dispersed in the first organic solvent; adding the dispersion liquid into the second organic solvent 3 dropwise in a form of droplets 2 of a predetermined amount; diffusing the first organic solvent in the droplet into the surrounding second organic solvent 3 and consequently agglomerating the metal nanoparticles coated with a covering agent to form fine particulate precipitates formed of the aggregate of the metal nanoparticles; collecting the fine particulate precipitates from the second organic solvent 3; drying the precipitates; and further heat-treating the precipitates to progress the sintering of the metal nanoparticles.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：待解决的问题：提供一种可重复地制造平均直径为亚微米级和微米级的球状金属粉末的方法，以具有如此窄的粒度分布，σ 作为标准偏差σ W 与金属粉末的目标重量W（金属量）的比率的W / W / W / W在满足σ W /W≤1/ 2。解决方案：具有均匀尺寸的金属粉末的制造方法包括：制备其中金属纳米颗粒分散在第一有机溶剂中的分散液; 将分散液以预定量的液滴2的形式逐滴加入到第二有机溶剂3中; 将液滴中的第一有机溶剂扩散到周围的第二有机溶剂3中，从而使涂覆有覆盖剂的金属纳米颗粒凝聚，以形成由金属纳米颗粒的聚集体形成的细微颗粒沉淀; 从第二有机溶剂3收集细颗粒沉淀物; 干燥沉淀物; 并进一步热处理沉淀物以进行金属纳米颗粒的烧结。版权所有（C）2011，JPO＆INPIT

10. 发明专利

JP2012119132A Conductive metal paste 有权
标题翻译：导电金属膏
公开(公告)号：JP2012119132A
公开(公告)日：2012-06-21
申请号：JP2010266991
申请日：2010-11-30
申请人： Harima Chemicals Inc , ハリマ化成株式会社
发明人： SAITO HIROSHI , UEDA MASAYUKI , MATSUBA YORISHIGE
IPC分类号： H01B1/22 , H01B1/00 , H01L21/288 , H01L21/3205 , H01L21/768 , H01L23/522 , H05K3/12
摘要： PROBLEM TO BE SOLVED: To provide a conductive metal paste which has a novel structure and contains no binder resin component, and is sufficiently fit for an application such as forming, with a high reproducibility, a thick conductor layer having a volume specific resistivity no more than three times the volume specific resistivity of metal used therein by performing a sintering process at a temperature selected within a range of 150-250°C.SOLUTION: The conductive metal paste comprises metal fine powder, metal nano particles each having a coating agent molecular layer, and a dispersion solvent. The volume ratio Vof the metal fine powder, the volume ratio Vof the metal nano particles, the volume ratio Vof coating agent molecules used to form the coating agent molecular layer, and the volume ratio Vof the dispersion solvent are selected so as to meet the following three conditions. The first is the ratio, V:(V+V+V) is within a range of 1:1-1:4.6. The second is the ratio (V+V):Vis within a range of 1:0.7-1:3. The third is the ratio (V:V) is within a range of 90:10-60:40.
摘要翻译：要解决的问题：为了提供具有新颖结构并且不含粘合剂树脂组分的导电金属糊，并且具有足够的适合性，可以以高再现性形成具有体积特异性的厚导体层通过在150-250℃的范围内进行烧结工艺，电阻率不超过金属体积比电阻率的三倍。导电性金属膏包含金属微粉末，各自具有涂层剂分子层的金属纳米粒子和分散溶剂。金属微细粉末的体积比V 金属颗粒，金属纳米颗粒的体积比V 纳米颗粒用于形成涂层剂分子层的涂层剂分子的体积比V 涂层分子，体积比V 溶剂的分散溶剂，以满足以下三个条件。第一个是比例，V 金属颗粒 :( V 纳米颗粒 + V 涂层分子 + V 溶剂）在1：1-1：4.6的范围内。第二个是比例（V 纳米颗粒 + V 涂层分子）：V 溶剂在1：0.7-1：3的范围内。第三个是在90:10-60的范围内的比例（V 金属颗粒：V 纳米颗粒）：40。版权所有（C）2012，JPO＆INPIT

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