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1. 发明专利

JP2009283783A Formation method of high adhesiveness metal nanoparticle sintered compact film 有权
标题翻译：高粘度金属纳米材料烧结薄膜的形成方法
公开(公告)号：JP2009283783A
公开(公告)日：2009-12-03
申请号：JP2008135884
申请日：2008-05-23
申请人： Harima Chem Inc , Katsuhiro Maekawa , Mamoru Onda , ハリマ化成株式会社 , 克廣前川 , 護御田
发明人： MAEKAWA KATSUHIRO , YAMAZAKI KAZUHIKO , NIIZEKI TOMOTAKE , ONDA MAMORU , SAITO HIROSHI , TERADA NOBUHITO , MATSUBA YORISHIGE
IPC分类号： H05K3/10 , C09D1/00 , C23C24/08 , H05K1/05
摘要： PROBLEM TO BE SOLVED: To provide a formation method of a metal nanoparticle sintered compact film having high adhesiveness on a substrate whose surface is coated with a liquid excluding agent coating layer. SOLUTION: Onto the substrate whose surface is coated with the liquid excluding agent coating layer, metal nanoparticle dispersion solution is applied with a predetermined applying liquid thickness, and the surface of the applying liquid layer is vertically irradiated with a laser beam of predetermined wavelength, and a laser exposed region of the liquid excluding agent coating layer contact to the metal nanoparticle dispersion solution is selectively removed. Continuously, the applying liquid layer is irradiated with the laser beam of predetermined wavelength, the temperature of the interface between the substrate and the applying liquid layer is raised, and the metal nanoparticle sintered compact film having high adhesiveness on the substrate surface is formed. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种在其表面涂布有不包括药剂涂层的液体的基材上具有高粘合性的金属纳米颗粒烧结致密膜的形成方法。解决方案：在表面用不含药液的涂层的基材上涂敷金属纳米颗粒分散液，其预定的涂敷液体厚度，并用预定的激光束垂直照射涂布液层的表面选择性地除去与液体排除剂涂层接触的金属纳米颗粒分散溶液的激光曝光区域。连续地对预定波长的激光束照射涂布液层，使衬底和涂布液层之间的界面的温度升高，并且形成在衬底表面上具有高粘合性的金属纳米颗粒烧结致密膜。版权所有（C）2010，JPO＆INPIT

2. 发明专利

JP2007142092A Manufacturing method of high density wiring substrate, high density wiring substrate manufactured by using the method, electronic device and electronic apparatus 审中-公开
标题翻译：高密度接线基板的制造方法，使用该方法制造的高密度接线基板，电子设备和电子设备
公开(公告)号：JP2007142092A
公开(公告)日：2007-06-07
申请号：JP2005332827
申请日：2005-11-17
申请人： Haipekku:Kk , Ibaraki Univ , Mamoru Onda , Toyohashi Univ Of Technology , Yamamoto Rika Kogyo Kk , 国立大学法人茨城大学 , 国立大学法人豊橋技術科学大学 , 山本理化工業株式会社 , 護御田 , 株式会社ハイペック
发明人： KUBOTA TOSHIO , SHIBATA TAKAYUKI , YAMAMOTO HITOSHI , KISO YUJI , ONDA MAMORU
IPC分类号： H05K3/06 , H05K3/00 , H05K3/18
摘要： PROBLEM TO BE SOLVED: To provide a high density wiring substrate, an electronic device using the substrate, and an electronic apparatus.
SOLUTION: An imprint method by a printing plate wherein a micron, submicron or nanometer size pattern is formed in a quartz substrate, a sapphire substrate, a metal substrate or the like for the formation of a resist pattern for the chemical etching of metallic foil such as copper foil or conductive additive plating such as copper is employed in a manufacturing method of a high density wiring substrate such as a rigid wiring substrate, an FPC, a wiring tape for TAB or the like. The manufacturing method of the high density wiring substrate comprises an imprint process for resist pattern formation in all processes of resist film formation on a metallic foil, chemical etching or additive plating and resist pattern peeling processes, or in a part of the processes as an in-line. A wiring substrate manufactured by using the method, an electronic device using the substrate, and an electronic apparatus are also provided.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供高密度布线基板，使用该基板的电子设备和电子设备。解决方案：通过印版的印版方法，其中在用于形成用于化学蚀刻的抗蚀剂图案的石英基板，蓝宝石基板，金属基板等中形成微米，亚微米或纳米尺寸图案在诸如刚性布线基板，FPC，TAB布线带等的高密度布线基板的制造方法中采用诸如铜箔的金属箔或诸如铜的导电添加剂镀层。高密度布线基板的制造方法包括在金属箔上的抗蚀剂膜形成的所有工艺中的抗蚀剂图案形成的压印工艺，化学蚀刻或添加电镀和抗蚀剂图案剥离工艺，或者作为其中的一部分 -线。还提供了使用该方法制造的布线基板，使用该基板的电子设备和电子设备。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2006093575A Semiconductor device and its manufacturing method 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006093575A
公开(公告)日：2006-04-06
申请号：JP2004279644
申请日：2004-09-27
申请人： Hitachi Cable Ltd , Mamoru Onda , 護御田 , 日立電線株式会社
发明人： CHINDA SATOSHI , ONDA MAMORU
IPC分类号： H01L23/28 , H01L21/56 , H01L23/12 , H01L23/50
CPC分类号： H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/85001 , H01L2224/92247 , H01L2924/01046 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device using a core-less substrate with a cheap manufacturing cost by improving solder connection reliability, and also to provide a method of manufacturing it.
SOLUTION: The semiconductor device is provided by: providing a recess 12 formed with the embedding solder plating external connection terminal 21 of a semiconductor package on a metal temporary substrate 11 with the weak solder plating adhesion force of a stainless alloy, etc.; forming a die pad 2b; wiring patterns 8, 9 and 10b for carrying a semiconductor element 2 on the metal temporary substrate 11 by a photoresist 13 and plating 14; forming the embedding solder plating external connection terminal 21 connected to the wiring patterns 8, 9 and 10b in the recess 12; then mounting the semiconductor element 2 in the die pad 2b; connecting the semiconductor element 2 to the wiring patterns 8, 9 and 10b; further forming the semiconductor package on the metal temporary substrate 11 by sealing the semiconductor element 2 on the metal temporary substrate 11 with a resin 5; and exfoliating the metal temporary substrate 11 from a semiconductor package.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种通过提高焊接连接可靠性而使用具有廉价制造成本的无芯基板的半导体器件，并且还提供其制造方法。解决方案：半导体器件通过以下方式提供：在金属临时基板11上形成具有半导体封装的嵌入焊料镀覆外部连接端子21的凹陷12，其具有不锈钢合金等的弱焊料电镀粘附力。 ; 形成管芯焊盘2b; 用于通过光致抗蚀剂13和电镀层14在金属临时基板11上承载半导体元件2的布线图案8,9和10b; 形成连接到凹部12中的布线图案8,9和10b的嵌入焊料镀覆外部连接端子21; 然后将半导体元件2安装在管芯焊盘2b中; 将半导体元件2连接到布线图案8,9和10b; 通过用树脂5将半导体元件2密封在金属临时基板11上，进一步在金属临时基板11上形成半导体封装; 并且将金属临时基板11从半导体封装件剥离。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2006059942A Wiring board, manufacturing method thereof electronic equipment and electronic device using the same 审中-公开
标题翻译：接线板及其电子设备及使用该电子设备的电子设备的制造方法
公开(公告)号：JP2006059942A
公开(公告)日：2006-03-02
申请号：JP2004239041
申请日：2004-08-19
申请人： Mamoru Onda , 護御田
发明人： ONDA MAMORU
IPC分类号： H05K3/12 , H05K3/40 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a more economical manufacturing process capable of coping with waste liquid treatment and the like and consumption of useless energy at the time of forming an electric conductive circuit by photochemical etching. SOLUTION: The manufacturing method of a wiring board is constituted such that: on a substrate consisting of an organic or inorganic electric insulating material, conductive metal particulates are applied partially or overall; and by irradiating a laser beam to the applied metal particulates for scanning, fusion sintering of the conductive metal particulates on the substrate is carried out directly so that an electric conductive circuit may be continuously formed on the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够处理废液处理等的更经济的制造工艺，以及通过光化学蚀刻形成导电电路时的无用能量的消耗。解决方案：布线板的制造方法构成为：在由有机或无机电绝缘材料构成的基板上，部分或全部施加导电金属微粒; 通过向施加的金属微粒照射激光，进行扫描，直接进行导电性金属微粒的熔融烧结，从而能够在基板上连续地形成导电电路。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2005354017A Optically-hardening reaction control imprint mold and imprint processing method using the same, and imprint processed product 审中-公开
标题翻译：光硬化反应控制印模和使用其的印刷加工方法和印刷加工产品
公开(公告)号：JP2005354017A
公开(公告)日：2005-12-22
申请号：JP2004199912
申请日：2004-06-10
申请人： Toshio Kubota , Mamoru Onda , 俊夫久保田 , 護御田
发明人： KUBOTA TOSHIO , ONDA MAMORU
IPC分类号： G03F7/20 , B81C99/00 , H01L21/027 , B81C5/00
摘要： PROBLEM TO BE SOLVED: To provide a small imprint device that does not generate an optically hardened resinous film after irradiating light.
SOLUTION: In an optically-hardening reaction control imprint mold 1, an optically-hardening imprint mold 1 uses a substrate of optically-transparent artificial quartz, sapphire, polycarbonate, etc., and has a convexo-concave pattern formed thereon. A resinous film, an inorganic film, and the like for controlling an optically-hardening reaction are formed onto the convexo-concave pattern. Also, an imprint processing method is disclosed using the same.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种在照射光后不产生光学硬化的树脂膜的小型压印装置。光解硬化反应控制印模1中，光硬化印模1使用透光性人造石英，蓝宝石，聚碳酸酯等的基板，在其上形成有凹凸图案。在凹凸图案上形成用于控制光硬化反应的树脂膜，无机膜等。此外，公开了使用其的压印处理方法。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2005305050A Bed for self-supporting living 审中-公开
标题翻译：自给自足的生活
公开(公告)号：JP2005305050A
公开(公告)日：2005-11-04
申请号：JP2004148392
申请日：2004-04-16
申请人： Mamoru Onda , 護御田
发明人： ONDA MAMORU
IPC分类号： A61G7/02 , A61G7/05 , A61G12/00 , A61H33/00
摘要： PROBLEM TO BE SOLVED: To enable patients or those who require nursing care to independently live without help from a doctor, a nurse, a care worker for a certain period. SOLUTION: A bed for self-supporting a living is equipped with a shower unit, a lavatory unit, a purifying appliance for excretory substance or shower water, a shower water treating appliance, a drinking water supplying appliance, a refrigerator, a bookrack, a television, a radio, an audio, a massager, and various kinds of medical care measures. Furthermore, the bed for self-supporting the living is equipped with wheels, an electrically-driven motor and a battery power source so as to move the bed. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：使患者或需要护理的患者在没有医生，护士，护理人员一段时间的帮助下独立生活。
解决方案：一种用于自给自足的床配有淋浴器，洗手间单元，排泄物或淋浴水的净化装置，淋浴水处理器具，饮用水供应器具，冰箱，书房，电视，收音机，音响，按摩器和各种医疗护理措施。此外，用于自支撑生活的床配备有轮子，电动马达和电池电源，以便移动床。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2006330080A Method for controlling cross-sectional shape of photosensitive resin pattern, electroforming die using the same, microchemical chip, dna chip, and mems product 审中-公开
标题翻译：用于控制光敏树脂图案的交叉形状的方法，使用其的电化学方法，微细化学芯片，DNA芯片和MEMS产品
公开(公告)号：JP2006330080A
公开(公告)日：2006-12-07
申请号：JP2005149660
申请日：2005-05-23
申请人： Yuji Kiso , Mamoru Onda , Hitoshi Yamamoto , 山本仁 , 護御田 , 裕次木曽
发明人： SHIBATA TAKAYUKI , KUBOTA TOSHIO , YAMAMOTO HITOSHI , KISO YUJI , ONDA MAMORU
IPC分类号： G03F7/20 , B81B1/00 , B81C1/00 , C25D1/10 , G01N33/53 , G01N37/00
摘要： PROBLEM TO BE SOLVED: To provide a method for obtaining a desired cross-sectional shape as a cross-sectional shape of a fine groove pattern composed of a photosensitive resin material. SOLUTION: In a method for forming a photosensitive resin pattern by using positive or negative photosensitive resins which are decomposed or hardened with light irradiation, and for forming the groove pattern composed of these photosensitive resins on a substrate with exposure and development, wherein the pattern is to be used for a flow channel of a microchemical chip, a chip for DNA analysis, a resist for chemical etching, and a resist for dry etching and so on, the cross-sectional shape of the photosensitive resin groove pattern is controlled to have a desired value by using proximity exposure as an exposing method, and exposure-developing by selecting a distance 7 between a photomask 3 and the substrate 9 with the photosensitive resin 8 applied thereto or by changing the distance 7 between the substrate and the photomask over time. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种获得期望的横截面形状作为由感光性树脂材料构成的细槽图案的截面形状的方法。解决方案：在通过使用通过光照射分解或硬化的正或负感光性树脂形成感光性树脂图案的方法中，并且在曝光和显影的基板上形成由这些感光性树脂构成的凹槽图案的方法中，其中该图案用于微化学芯片的流动通道，用于DNA分析的芯片，用于化学蚀刻的抗蚀剂和用于干蚀刻的抗蚀剂等，感光树脂凹槽图案的横截面形状被控制通过使用接近曝光作为曝光方法具有期望值，并且通过施加光敏树脂8或通过改变基板和光掩模之间的距离7来选择光掩模3和基板9之间的距离7进行曝光显影随着时间的推移。版权所有（C）2007，JPO＆INPIT

8. 发明专利

JP2006093576A Semiconductor device and its manufacturing method 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：JP2006093576A
公开(公告)日：2006-04-06
申请号：JP2004279645
申请日：2004-09-27
申请人： Hitachi Cable Ltd , Mamoru Onda , 護御田 , 日立電線株式会社
发明人： CHINDA SATOSHI , MIYAMOTO NOBUAKI , ONDA MAMORU
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/15311 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device which makes easy transfer of a wiring conductor formed on a transfer film to a sealing resin, and also to provide a method of manufacturing it. SOLUTION: In the semiconductor device 1 formed by: forming the wiring conductor 3 on a electric insulation transfer film 92; mounting a semiconductor element 86 on the wiring conductor 3; providing a sealing resin 88 to seal the wiring conductor 3 and the upper part of the semiconductor element 86 on the transfer film 92; and exfoliating the electric insulation transfer film 92, the thickness, the roughness and the shape of the wiring conductor 3 formed on the transfer film 92 are made to the thickness, the roughness and the shape in which an adhesion force between the wiring conductor 3 and the sealing resin 88 to the exfoliating force of the transfer film 92 is strengthened. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够容易地将形成在转印膜上的布线导体转印到密封树脂上的半导体器件，并且还提供其制造方法。解决方案：在通过以下方式形成的半导体器件1中：在电绝缘转移膜92上形成布线导体3; 将半导体元件86安装在布线导体3上; 提供密封树脂88以密封布线导体3和转印膜92上的半导体元件86的上部; 使形成在转印膜92上的布线导体3的厚度，粗糙度和形状的厚度，粗糙度和布线导体3和密封树脂88与转印膜92的剥离力的增强。版权所有（C）2006，JPO＆NCIPI

9. 发明专利

JP2006093577A Transfer film substrate for semiconductor device and its manufacturing method, and semiconductor device using it 审中-公开
标题翻译：用于半导体器件的传输薄膜基板及其制造方法，以及使用其的半导体器件
公开(公告)号：JP2006093577A
公开(公告)日：2006-04-06
申请号：JP2004279646
申请日：2004-09-27
申请人： Hitachi Cable Ltd , Mamoru Onda , 護御田 , 日立電線株式会社
发明人： CHINDA SATOSHI , ONDA MAMORU
IPC分类号： H01L23/12
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To provide a transfer film substrate for a semiconductor device which makes easy transfer of a wiring conductor formed on a transfer film to a sealing resin. SOLUTION: In the transfer film substrate 1 for the semiconductor device in which the wiring conductor 5 is formed on the transfer film 2, the wiring conductor 5 is formed by press punching a conductive metal tape 5t, and the wiring conductor 5 is temporarily press bonded on the transfer film 2. COPYRIGHT: (C)2006,JPO&NCIPI

10. 发明专利

JP2011042772A Paste for repairing ripped shoji paper and method of repairing the shoji paper 审中-公开
标题翻译：修补ED皮纸及其修复方法
公开(公告)号：JP2011042772A
公开(公告)日：2011-03-03
申请号：JP2009207497
申请日：2009-08-19
申请人： Mamoru Onda , 護御田
发明人： ONDA MAMORU
IPC分类号： C09J201/00 , C09J5/00 , C09J11/04 , C09J11/08 , C09J103/02
摘要： PROBLEM TO BE SOLVED: To restore ripped Shoji paper without damaging aesthetic appearance.
SOLUTION: In repairing a ripped Shoji, a mixed paste for repairing ripped shoji paper obtained by mixing the major material as a repairing paste, a water diffusion inhibiting material, and a color tone adjusting material is used. A method of repairing ripped Shoji paper comprises applying a paste only to the edge face of a ripped portion 2 of the ripped Shoji paper to bond the ripped portion, placing press paper 6 on the surface of the ripped Shoji portion 2 to dry the paste, and then finally releasing the press paper 6.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：恢复撕裂的Shoji纸而不损害美学外观。
解决方案：在修复撕裂的Shoji时，使用用于修复通过混合作为修补膏的主要材料，防止水分扩散的材料和色调调节材料而获得的撕裂纸的混合糊料。修复破碎的Shoji纸的方法包括仅将糊状物施加到撕裂的Shoji纸的撕裂部分2的边缘面上，以将撕裂部分粘合，将压纸6放置在撕裂的Shoji部分2的表面上以干燥糊状物，然后最终发布新闻稿6.版权所有（C）2011，JPO＆INPIT

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