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1. 发明专利

JPH07326506A PRODUCTION OF CHIP RESISTOR 失效
公开(公告)号：JPH07326506A
公开(公告)日：1995-12-12
申请号：JP13938394
申请日：1994-05-30
申请人： HOKURIKU ELECT IND
发明人： TAMURA MASAHIDE , NISHIDA TATSUYA , AZUMA KOJI
IPC分类号： H01C17/06 , H01C7/00
摘要： PURPOSE:To provide a production method of a chip resistor wherein the production man-hour can be reduced and accurate resistance value can be easily set. CONSTITUTION:Individual resistors 16 are formed by printing or similar means with specified spacings on large-size insulative substrates to form individual chip substrates. Electrodes 14 are formed on these substrates such that the electrodes 14 are once formed by specified mask on both ends of each resistor 16, and the resistance between the electrodes 14 is measured. If the measured value is greater than a reference value, a mask having shorter spacings between the electrodes 14 is selected according to the deviation of the measured value. If smaller, on the contrary, a mask having longer spacings between the electrodes 14 is selected according to the deviation. Then, the electrodes 14 are printed at both ends of each resistor 16 formed on other insulative substrates, using this selected mask.

2. 发明专利

JPH0763585A ENVIRONMENT SENSOR 失效
公开(公告)号：JPH0763585A
公开(公告)日：1995-03-10
申请号：JP23417293
申请日：1993-08-26
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , NISHIDA TATSUYA , KATO MASAKI , MATSUDA MINORU
IPC分类号： G01D21/00 , G01J5/00 , G01J5/02
摘要： PURPOSE:To provide an environment sensor small in outline, simple in constitution and high in detecting sensitivity at low cost with desirable yield at the manufacturing time. CONSTITUTION:An environment sensor has a sensor chip substrate 12 with a sensor part 10 formed to measure the environmental information on an air current, radiant heat, and the like, and a circuit board 14 with the sensor chip substrate 12 fitted thereto and with a sensor circuit formed to input a signal outputted from the sensor chip substrate 12. A through-hole part 16 is formed at the circuit board 14, and the sensor chip substrate 12 is fixed to the circuit board 14 so that the sensor part 10 of the sensor chip substrate 12 is positioned in this through hole 16.

3. 发明专利

JPH07211633A THIN FILM SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH07211633A
公开(公告)日：1995-08-11
申请号：JP2363694
申请日：1994-01-25
申请人： HOKURIKU ELECT IND
发明人： NISHIDA TATSUYA , KATO MASAKI , NAKAMIZO YOSHIYUKI , MATSUDA MINORU
IPC分类号： H01L21/20 , H01L21/268 , H01L21/336 , H01L29/78 , H01L29/786
摘要： PURPOSE:To provide a recrystallized thin film semiconductor element having simple structure and high quality. CONSTITUTION:A lower electrode 34 of Ta, for example, is formed on an insulating substrate 30 and a dielectric layer 36 of SiO2, for example, is formed thereon through a tantalum nitride layer 35. A thin film 38 of recrystallized amorphous silicon or polysilicon is then formed on the dielectric layer 36.

4. 发明专利

JPH06120646A MOUNTING METHOD FOR THIN FILM SENSOR 失效
公开(公告)号：JPH06120646A
公开(公告)日：1994-04-28
申请号：JP27061992
申请日：1992-10-08
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： NAKAI MASAYOSHI , KATO MASAKI , NISHIDA TATSUYA , HAYASHI FUMIO
IPC分类号： G01F15/18 , H05K3/28
摘要： PURPOSE:To provide a method for mounting a thin film sensor by bonding in which the wire connecting between the sensor and a circuit on a board is protected against short circuit or open circuit due to contact with an external foreign matter. CONSTITUTION:A thin film sensor 3 bonded 2 through an adhesive 2 onto a board 1 is connected by bonding wires 4a-4d with a circuit formed on the board 1 for processing signals received from the sensor 3 wherein the periphery of the sensor 3, including the wires 4a-4d, is covered with a molding material 5.

5. 发明专利

JPH11191505A SENSOR HAVING HEATING-TYPE THIN-FILM ELEMENT AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH11191505A
公开(公告)日：1999-07-13
申请号：JP35940497
申请日：1997-12-26
申请人： HOKURIKU ELECT IND
发明人： KATO MASAKI , NISHIDA TATSUYA
IPC分类号： G01F1/68 , G01F1/692 , G01N27/18 , H01C7/00 , H01C17/06
摘要： PROBLEM TO BE SOLVED: To provide a sensor having a heating-type thin-film element that does not require a loukr side insulating film, and a method of manufacturing the sensor. SOLUTION: In a silicon dioxide single-crystal substrate 6, a cavity member 4 is formed, in which the bottom side is open and a thin supporting member 6a remains on the top side. On the surface 6b of the single-crystal substrate 6, a conductive film 3 consisting of a thin film is formed so that a heating member 3a is positioned on the supporting member 6a. A heating-type thin-film element 5 is formed with the supporting member 6a and the conductive film 3 containing the heating member 3a.

6. 发明专利

JPH06160131A COMPOSITE THIN FILM SENSOR 失效
公开(公告)号：JPH06160131A
公开(公告)日：1994-06-07
申请号：JP27062092
申请日：1992-10-08
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： FUJITA KATSUHISA , MURAKAWA SHINICHI , NAKAI MASAYOSHI , EGASHIRA YOSHIO , ISHIYAMA ICHIRO , KATO MASAKI , NISHIDA TATSUYA
IPC分类号： G01D3/028 , G01D21/00 , G01D21/02 , G01D3/04
摘要： PURPOSE:To correct an air current sensor and a radiation sensor against the air temperature on a substrate and detect the air temperature, humidity, air current, and radiation with low power. CONSTITUTION:An air temperature sensor 3, an air current sensor 4 constituted of an air current detection section 4a and an air current/air temperature correction section 4b, a radiation sensor 5 constituted of a radiation detection section 5a and a radiation/air temperature correction section 5b, and a humidity sensor 6 are formed on a substrate 1 formed with an insulating film 2. Portions of the substrate 1 corresponding to the lower sections of the air current detection section 4a, air current/air temperature correction section 4b, radiation detection section 5a, and radiation/air temperature correction section 5b are all removed to form voids. The air current/air temperature correction section 4b is covered with a windshield 7.

7. 发明专利

JPH06117679A COMPOSITE THIN FILM SENSOR MODULE 失效
公开(公告)号：JPH06117679A
公开(公告)日：1994-04-28
申请号：JP29372392
申请日：1992-10-06
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： FUJITA KATSUHISA , MURAKAWA SHINICHI , EGASHIRA YOSHIO , YOKOYAMA MITSURU , MATSUDA MINORU , ISHIYAMA ICHIRO , KATO MASAKI , NISHIDA TATSUYA
IPC分类号： F24F11/02 , G01D21/02 , G01K7/16 , G01N25/64
摘要： PURPOSE:To accurately detect the object to be measured even when an atmospheric temperature sensor, a humidity sensor, an air flow sensor, a radiation sensor, etc., are integrally formed. CONSTITUTION:At least a radiation sensor 22, an atmospheric temperature sensor 20 and a humidity sensor 30 are provided on a board 10. A cover plate 32 is so mounted at a specified interval from the board 10 as to cover the board 10, and an opening 34 is formed only above the sensors of the plate 32. A side between the plate 32 and the board 10 is formed with an opening 35 in which an air flow can pass.

8. 发明专利

JPH1136086A ETCHING METHOD AND ETCHING DEVICE 失效
公开(公告)号：JPH1136086A
公开(公告)日：1999-02-09
申请号：JP20992797
申请日：1997-07-18
申请人： HOKURIKU ELECT IND
发明人： NISHIDA TATSUYA , NAKAGAWA TETSUO , TAMURA MASAHIDE
IPC分类号： C23F1/20 , C23F4/00 , H03H3/08
摘要： PROBLEM TO BE SOLVED: To utilize the advantages of wet etching and dry etching by using the both methods together. SOLUTION: At the time of forming the patterns of the comb-shaped electrodes 11 of a metallic thin film 14 consisting essentially of aluminum, etc., on a substrate 12 of a quartz crystal, lithium tantalate, etc., having the piezo-electirc property the dry etching is ceased where about 60 to 90% of the metallic thin film 14 consisting essentially of the aluminum, etc., is etched by a dry etching method good in accuracy. Net, the etching method is switched to a wet etching method which lessens the damage on the substrate 12. The etching of the metallic thin film 14 is completed by the wet etching.

9. 发明专利

JPH11308071A SURFACE ACOUSTIC WAVE DEVICE 失效
公开(公告)号：JPH11308071A
公开(公告)日：1999-11-05
申请号：JP12827998
申请日：1998-04-22
申请人： HOKURIKU ELECT IND
发明人： HANAGURUMA TAKAKI , NISHIDA TATSUYA
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To miniaturize with a simple structure and to obtain high reliability and performance. SOLUTION: This surface acoustic wave(SAW) device is provided with a piezoelectric 1st substrate 14 and a piezoelectric 2nd substrate 36 are provided and a 1st surface acoustic wave element 10 where a 1st comb-shaped electrode 16, a 1st reflector 20 and a 1st connection electrode 22 connected to the electrode 16 are formed on the substrate 14. The SAW device is also provided with a 2nd surface acoustic wave element 12 where a 2nd comb-shaped electrode 38, a 2nd connection electrode 44 and an input electrode 48 which are respectively connected to the electrode 38, a 2nd reflector 2, ground electrodes 50 and 56 which are connected to the reflector 20 and a 2nd reflector 42, and an output electrode 46 which is electrically independent on the substrate 36 are also formed on the substrate 36. The electrode formation planes of the elements 10 and 12 are separated slightly from each other and are faced to each other, and also the electrodes 22 and 44 are mutually connected.

10. 发明专利

JPH09186549A SURFACE ACOUSTIC WAVE FILTER 失效
公开(公告)号：JPH09186549A
公开(公告)日：1997-07-15
申请号：JP35368495
申请日：1995-12-29
申请人： HOKURIKU ELECT IND
发明人： TAMURA MASAHIDE , NISHIDA TATSUYA , NAKAGAWA TETSUO
IPC分类号： H03H9/25
摘要： PROBLEM TO BE SOLVED: To provide a filter with a simple structure, an excellent frequency characteristic and causing any secular change by providing a surface acoustic wave element and a case and adhering the both at a prescribed position. SOLUTION: Four sets of interdigital electrodes pair are provided to a surface of a piezoelectric substrate such as crystal or a lithium tantalate opposite to each other alternately in the surface acoustic wave filter 10. Furthermore, a surface acoustic wave element 11 with a reflector arranged thereto is provided to both sides of the interdigital electrode. The surface acoustic wave element 11 is fixed to a case 15 by an adhesives 12 such as Ag paste, epoxy resin or silicon resin. In this case, the element 11 and the case 15 are adhered by an adhesives 12 applied to positions of both ends on a rear side of the element 11. An Al wire 13 is bonded to each electrode of the element 11 and the other end of the Al wire 13 is connected to a terminal 16. The element 11 is sealed by seal processing by a cap 14 and the case 15.

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