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1. 发明专利

JPH06117887A COMPOSITE THIN FILM SENSOR MODULE 失效
公开(公告)号：JPH06117887A
公开(公告)日：1994-04-28
申请号：JP27061892
申请日：1992-10-08
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： FUJITA KATSUHISA , ENAMI KOJI , MURAKAWA SHINICHI , EGASHIRA YOSHIO , MATSUDA MINORU , ISHIYAMA ICHIRO
IPC分类号： G01D21/00 , G01D21/02 , G01K7/16
摘要： PURPOSE:To to perform accurate measurement and, at the same time, to minimize the power consumption of the module by intermittently driving a signal processing circuit. CONSTITUTION:In an intermittent drive control circuit 23, the (+) and (-) output terminals of a DC power source are connected to the (+) and (-) input terminals of a signal processing circuit 22 through wires 23a and 23b and a timer relay 25 is connected between the wires 23a and 23b. When a voltage is applied across the circuit 23 from an external power source connected to a power supply terminal 13, the relay 25 in the circuit 23 performs opening and closing operations on a contact 25a in a certain cycle. The power supply to the circuit 22 is intermittently performed following the cycle set by means of the circuit 23. Therefore, the circuit 22 drives a composite thin film sensor 21, processes the information detected by the sensor 21, and outputs the processed results through a terminal 14 only when the power supply is made to the circuit 22. Since the sensor 21 is intermittently operated in such a way, the temperature rise of the whole sensor 21 becomes smaller even when the sensor 21 generates heat at the measuring time. Therefore, mutual interference between thin film sensors can be prevented and accurate measurement can be performed. In addition, since the sensor is intermittently operated, the power consumption of this module can be minimized.

2. 发明专利

JPH06160131A COMPOSITE THIN FILM SENSOR 失效
公开(公告)号：JPH06160131A
公开(公告)日：1994-06-07
申请号：JP27062092
申请日：1992-10-08
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： FUJITA KATSUHISA , MURAKAWA SHINICHI , NAKAI MASAYOSHI , EGASHIRA YOSHIO , ISHIYAMA ICHIRO , KATO MASAKI , NISHIDA TATSUYA
IPC分类号： G01D3/028 , G01D21/00 , G01D21/02 , G01D3/04
摘要： PURPOSE:To correct an air current sensor and a radiation sensor against the air temperature on a substrate and detect the air temperature, humidity, air current, and radiation with low power. CONSTITUTION:An air temperature sensor 3, an air current sensor 4 constituted of an air current detection section 4a and an air current/air temperature correction section 4b, a radiation sensor 5 constituted of a radiation detection section 5a and a radiation/air temperature correction section 5b, and a humidity sensor 6 are formed on a substrate 1 formed with an insulating film 2. Portions of the substrate 1 corresponding to the lower sections of the air current detection section 4a, air current/air temperature correction section 4b, radiation detection section 5a, and radiation/air temperature correction section 5b are all removed to form voids. The air current/air temperature correction section 4b is covered with a windshield 7.

3. 发明专利

JPH06117679A COMPOSITE THIN FILM SENSOR MODULE 失效
公开(公告)号：JPH06117679A
公开(公告)日：1994-04-28
申请号：JP29372392
申请日：1992-10-06
申请人： MITSUBISHI HEAVY IND LTD , HOKURIKU ELECT IND
发明人： FUJITA KATSUHISA , MURAKAWA SHINICHI , EGASHIRA YOSHIO , YOKOYAMA MITSURU , MATSUDA MINORU , ISHIYAMA ICHIRO , KATO MASAKI , NISHIDA TATSUYA
IPC分类号： F24F11/02 , G01D21/02 , G01K7/16 , G01N25/64
摘要： PURPOSE:To accurately detect the object to be measured even when an atmospheric temperature sensor, a humidity sensor, an air flow sensor, a radiation sensor, etc., are integrally formed. CONSTITUTION:At least a radiation sensor 22, an atmospheric temperature sensor 20 and a humidity sensor 30 are provided on a board 10. A cover plate 32 is so mounted at a specified interval from the board 10 as to cover the board 10, and an opening 34 is formed only above the sensors of the plate 32. A side between the plate 32 and the board 10 is formed with an opening 35 in which an air flow can pass.

4. 发明专利

JP2000235829A MANUFACTURE OF FUSE, MANUFACTURE OF CHIP TYPE FUSE AND CHIP TYPE FUSE 失效
公开(公告)号：JP2000235829A
公开(公告)日：2000-08-29
申请号：JP36163099
申请日：1999-12-20
申请人： HOKURIKU ELECT IND
发明人： YAMAZAKI MORIKATSU , MOTOKI MIKIZO , ISHIYAMA ICHIRO , OBARA YOZO
IPC分类号： H01H37/76 , H01H85/00 , H01H85/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip type fuse which can form a fuse element easily. SOLUTION: A predetermined patterned overcoat C is formed on a chip-like substrate 1. Cream solder is applied so as to cover exposed part of the overcoat C to form a cream solder layer 27'. A space forming member B is arranged on the layer 27' so as to form space where the cream solder melted by surface tension spreads between the member 3 and the substrate 1. In this condition, the whole is put into a furnaces to melt the solder. After the molten cream solder is hardened, the member B is removed to form a fuse element.

5. 发明专利

JP2000200539A FUSE ELEMENT AND ITS MANUFACTURE 失效
公开(公告)号：JP2000200539A
公开(公告)日：2000-07-18
申请号：JP134199
申请日：1999-01-06
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , MOTOKI MIKIZO , YAMAZAKI MORIKATSU , NOMURA YUTAKA
IPC分类号： H01H69/02 , H01H85/00 , H01H85/045 , H01H85/06 , H01H85/10 , H01H85/11 , H01H85/147 , H01H85/165
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable fuse element in which breaking caused by an excessive current occurs surely on a fuse part, and its manufacturing method. SOLUTION: This fuse element has a fuse part 14 formed on an insulating substrate 12 and composed of a low melting-point metal film or the like melting at a prescribed temperature, and conductor parts 16, 18 connected to the fuse part 14. The fuse element is equipped with electrodes 22 connected to the conductor parts 16, 18 and formed on the end face of the substrate 12, and auxiliary conductor films 24 laminated on the corner part contacting with the electrodes 22 on the substrate 12 end edge parts of the conductor parts 16, 18. The auxiliary conductor films 24 are laminated on the lower layer of the conductor parts 16, 18 on the periphery of the corner parts contacting with the electrodes 22.

6. 发明专利

JPH11191677A MULTILAYERED CIRCUIT BOARD EQUIPPED WITH ROM MEMORY 失效
公开(公告)号：JPH11191677A
公开(公告)日：1999-07-13
申请号：JP35895797
申请日：1997-12-26
申请人： HOKURIKU ELECT IND
发明人： WAKABAYASHI MORIMITSU , AZUMA KOJI , ISHIYAMA ICHIRO
IPC分类号： H05K1/16 , H01L27/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To enable a ROM memory to be formed in a process in which a multilayered circuit board is manufactured. SOLUTION: X-row wirings and Y-column wirings intersect each other via an insulating layer 2 to form intersections, and printed resistors r22 to r33 are formed on the surface of the insulating layer 2, so as to be located among row wirings X3 and X4 and column wirings Y2 and Y3 which form the intersections. Windows 3 are each selectively provided to the parts of the insulating layer 2, corresponding to the one ends of the printed resistors. The one ends of the resistors r22 to r33 are each electrically connected to the corresponding row wirings X3 and X4 through the windows 3, if the windows 3 are provided to the resistors. All the other ends of the printed resistors r22 to r33 are connected electrically to the corresponding column wirings Y2 and Y3. A ROM memory is constituted of a resistance matrix, composed of X-row wirings, Y-column wirings, and printed resistors.

7. 发明专利

JPH11185580A PROTECTIVE ELEMENT 失效
公开(公告)号：JPH11185580A
公开(公告)日：1999-07-09
申请号：JP36449797
申请日：1997-12-17
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , MOTOKI MIKIZO , NAKAYAMA TAKAYUKI , SHIMADA MASATO
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To provide a protective function due to over-current and heating, and make it function speedily and certainly by connecting a heating element between a pair of electrodes, and providing a heat shrinkable resin layer between a conductor layer and the heating element provided via an insulation layer at both external parts of the electrode. SOLUTION: A pair of electrodes 12 is formed on a substrate 11, a heating element 14 connecting to the electrodes 12 is provided, and a detecting part 16 is formed. An electrode 18 connecting to a main circuit of electronic equipment is provided outside of the detecting part 16, and a heat shrinkable resin layer 20 is provided on top and bottom faces between this pair of electrodes 18. When the heating element 14 is heated to a desired temperature or more, the heat shrinkable resin layer 20 in contact with the heating element 14 shrinks, and further, a conductor layer 22 is cut together with shrinkage of the heat shrinkable resin layer 20. The conductor layer 22 is sandwiched at the heat shrinkable resin layer 20, and therefore, the conductor layer 22 is cut certainly and speedily by shrinkage of the heat shrinking resin layer 20. Power supply between the electrodes 18 is interrupted by cutting of the conductor layer 22, and a main circuit connecting to the electrode 18 is protected because a current is cut off.

8. 发明专利

JPH08279669A MANUFACTURE OF CIRCUIT BOARD WITH CAPACITOR 失效
公开(公告)号：JPH08279669A
公开(公告)日：1996-10-22
申请号：JP8233095
申请日：1995-04-07
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16 , H01G4/33
摘要： PURPOSE: To obtain a circuit board with a capacitor wherein short-circuiting between electrode layers position in the vertical direction of a multilayered capacitor can be prevented. CONSTITUTION: A first dielectric layer 3a constituted of a deposited film of dielectric material of ultrafine particles is formed on a first electrode layer 2a constituted of a copper foil. The surface of the first dielectric layer 3a is flattened by pressing. A second electrode layer 4a is formed on the first dielectric layer 3a by using silver coating material. The surface of the second electrode layer 4a is flattened by pressing. A second dielectric layer 5a constituted of a deposited film of dielectric material of ultrafine particles is formed on the second electrode layer 4a. The surface of the second dielectric layer 5a is flattened by pressing. A third electrode layer 6a to be electrically connected with the first electrode layer 2a is formed on the second dielectric layer 5a by using silver coating material.

9. 发明专利

JPH08255962A CIRCUIT BOARD PROVIDED WITH CAPACITOR 失效
公开(公告)号：JPH08255962A
公开(公告)日：1996-10-01
申请号：JP5740195
申请日：1995-03-16
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16
摘要： PURPOSE: To obtain a circuit board, provided with a capacitor, in which the surface of a dielectric layer is smooth even when the dielectric layer is formed of ultrafine particles having a large mean particle size and in which a short circuit is not generated between a lower and an upper electrodes. CONSTITUTION: A lower divided dielectric layer 3a composed of a decomposition film by a dielectric material 31 composed of ultrafine particles is formed on a lower electrode 2a by a gas deposition method. Then, an upper divided dielectric layer 3b is formed on the lower divided dielectric layer 3a by a gas deposition method by a dielectric material 32 composed of ultrafine particles whose mean particle size is smaller than that of the dielectric material 31 for the lower divided dielectric layer 3a, and a dielectric layer 3 is formed. An upper part electrode 4a is formed on the upper divided dielectric layer 3b by using a conductive paint which contains scale-shaped conductive particles 42.

10. 发明专利

JPH08242056A CIRCUIT BOARD FITTED WITH CAPACITOR, AND ITS MANUFACTURE 失效
公开(公告)号：JPH08242056A
公开(公告)日：1996-09-17
申请号：JP4378995
申请日：1995-03-03
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16
摘要： PURPOSE: To provide a circuit board fitted with a capacitor equipped with a corner cover having an enough thickness. CONSTITUTION: On a circuit board 1 lie a printed capacitor PC and a gas deposition type capacitor GC. A part 2b1 of the corner of the lower electrode 2b positioned under the connection 8b of the printed capacitor PC is covered with a stacked film of superfine particles so as to make a corner cover 6. In the case of forming a gas deposition type capacitor GC on the same substrate, the corner cover 6 is made together when forming an induced layer 3a on the lower electrode 2c of the gas deposition type capacitor GC by gas deposition method.

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