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1. 发明专利

JP2000235829A MANUFACTURE OF FUSE, MANUFACTURE OF CHIP TYPE FUSE AND CHIP TYPE FUSE 失效
公开(公告)号：JP2000235829A
公开(公告)日：2000-08-29
申请号：JP36163099
申请日：1999-12-20
申请人： HOKURIKU ELECT IND
发明人： YAMAZAKI MORIKATSU , MOTOKI MIKIZO , ISHIYAMA ICHIRO , OBARA YOZO
IPC分类号： H01H37/76 , H01H85/00 , H01H85/02
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip type fuse which can form a fuse element easily. SOLUTION: A predetermined patterned overcoat C is formed on a chip-like substrate 1. Cream solder is applied so as to cover exposed part of the overcoat C to form a cream solder layer 27'. A space forming member B is arranged on the layer 27' so as to form space where the cream solder melted by surface tension spreads between the member 3 and the substrate 1. In this condition, the whole is put into a furnaces to melt the solder. After the molten cream solder is hardened, the member B is removed to form a fuse element.

2. 发明专利

JP2000200539A FUSE ELEMENT AND ITS MANUFACTURE 失效
公开(公告)号：JP2000200539A
公开(公告)日：2000-07-18
申请号：JP134199
申请日：1999-01-06
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , MOTOKI MIKIZO , YAMAZAKI MORIKATSU , NOMURA YUTAKA
IPC分类号： H01H69/02 , H01H85/00 , H01H85/045 , H01H85/06 , H01H85/10 , H01H85/11 , H01H85/147 , H01H85/165
摘要： PROBLEM TO BE SOLVED: To provide a highly reliable fuse element in which breaking caused by an excessive current occurs surely on a fuse part, and its manufacturing method. SOLUTION: This fuse element has a fuse part 14 formed on an insulating substrate 12 and composed of a low melting-point metal film or the like melting at a prescribed temperature, and conductor parts 16, 18 connected to the fuse part 14. The fuse element is equipped with electrodes 22 connected to the conductor parts 16, 18 and formed on the end face of the substrate 12, and auxiliary conductor films 24 laminated on the corner part contacting with the electrodes 22 on the substrate 12 end edge parts of the conductor parts 16, 18. The auxiliary conductor films 24 are laminated on the lower layer of the conductor parts 16, 18 on the periphery of the corner parts contacting with the electrodes 22.

3. 发明专利

JPH11191677A MULTILAYERED CIRCUIT BOARD EQUIPPED WITH ROM MEMORY 失效
公开(公告)号：JPH11191677A
公开(公告)日：1999-07-13
申请号：JP35895797
申请日：1997-12-26
申请人： HOKURIKU ELECT IND
发明人： WAKABAYASHI MORIMITSU , AZUMA KOJI , ISHIYAMA ICHIRO
IPC分类号： H05K1/16 , H01L27/10 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To enable a ROM memory to be formed in a process in which a multilayered circuit board is manufactured. SOLUTION: X-row wirings and Y-column wirings intersect each other via an insulating layer 2 to form intersections, and printed resistors r22 to r33 are formed on the surface of the insulating layer 2, so as to be located among row wirings X3 and X4 and column wirings Y2 and Y3 which form the intersections. Windows 3 are each selectively provided to the parts of the insulating layer 2, corresponding to the one ends of the printed resistors. The one ends of the resistors r22 to r33 are each electrically connected to the corresponding row wirings X3 and X4 through the windows 3, if the windows 3 are provided to the resistors. All the other ends of the printed resistors r22 to r33 are connected electrically to the corresponding column wirings Y2 and Y3. A ROM memory is constituted of a resistance matrix, composed of X-row wirings, Y-column wirings, and printed resistors.

4. 发明专利

JPH11185580A PROTECTIVE ELEMENT 失效
公开(公告)号：JPH11185580A
公开(公告)日：1999-07-09
申请号：JP36449797
申请日：1997-12-17
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , MOTOKI MIKIZO , NAKAYAMA TAKAYUKI , SHIMADA MASATO
IPC分类号： H01H37/76
摘要： PROBLEM TO BE SOLVED: To provide a protective function due to over-current and heating, and make it function speedily and certainly by connecting a heating element between a pair of electrodes, and providing a heat shrinkable resin layer between a conductor layer and the heating element provided via an insulation layer at both external parts of the electrode. SOLUTION: A pair of electrodes 12 is formed on a substrate 11, a heating element 14 connecting to the electrodes 12 is provided, and a detecting part 16 is formed. An electrode 18 connecting to a main circuit of electronic equipment is provided outside of the detecting part 16, and a heat shrinkable resin layer 20 is provided on top and bottom faces between this pair of electrodes 18. When the heating element 14 is heated to a desired temperature or more, the heat shrinkable resin layer 20 in contact with the heating element 14 shrinks, and further, a conductor layer 22 is cut together with shrinkage of the heat shrinkable resin layer 20. The conductor layer 22 is sandwiched at the heat shrinkable resin layer 20, and therefore, the conductor layer 22 is cut certainly and speedily by shrinkage of the heat shrinking resin layer 20. Power supply between the electrodes 18 is interrupted by cutting of the conductor layer 22, and a main circuit connecting to the electrode 18 is protected because a current is cut off.

5. 发明专利

JPH08279669A MANUFACTURE OF CIRCUIT BOARD WITH CAPACITOR 失效
公开(公告)号：JPH08279669A
公开(公告)日：1996-10-22
申请号：JP8233095
申请日：1995-04-07
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16 , H01G4/33
摘要： PURPOSE: To obtain a circuit board with a capacitor wherein short-circuiting between electrode layers position in the vertical direction of a multilayered capacitor can be prevented. CONSTITUTION: A first dielectric layer 3a constituted of a deposited film of dielectric material of ultrafine particles is formed on a first electrode layer 2a constituted of a copper foil. The surface of the first dielectric layer 3a is flattened by pressing. A second electrode layer 4a is formed on the first dielectric layer 3a by using silver coating material. The surface of the second electrode layer 4a is flattened by pressing. A second dielectric layer 5a constituted of a deposited film of dielectric material of ultrafine particles is formed on the second electrode layer 4a. The surface of the second dielectric layer 5a is flattened by pressing. A third electrode layer 6a to be electrically connected with the first electrode layer 2a is formed on the second dielectric layer 5a by using silver coating material.

6. 发明专利

JPH08255962A CIRCUIT BOARD PROVIDED WITH CAPACITOR 失效
公开(公告)号：JPH08255962A
公开(公告)日：1996-10-01
申请号：JP5740195
申请日：1995-03-16
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16
摘要： PURPOSE: To obtain a circuit board, provided with a capacitor, in which the surface of a dielectric layer is smooth even when the dielectric layer is formed of ultrafine particles having a large mean particle size and in which a short circuit is not generated between a lower and an upper electrodes. CONSTITUTION: A lower divided dielectric layer 3a composed of a decomposition film by a dielectric material 31 composed of ultrafine particles is formed on a lower electrode 2a by a gas deposition method. Then, an upper divided dielectric layer 3b is formed on the lower divided dielectric layer 3a by a gas deposition method by a dielectric material 32 composed of ultrafine particles whose mean particle size is smaller than that of the dielectric material 31 for the lower divided dielectric layer 3a, and a dielectric layer 3 is formed. An upper part electrode 4a is formed on the upper divided dielectric layer 3b by using a conductive paint which contains scale-shaped conductive particles 42.

7. 发明专利

JPH08242056A CIRCUIT BOARD FITTED WITH CAPACITOR, AND ITS MANUFACTURE 失效
公开(公告)号：JPH08242056A
公开(公告)日：1996-09-17
申请号：JP4378995
申请日：1995-03-03
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KUROKAWA HIROYUKI , NAGARE ICHIRO
IPC分类号： H05K1/16
摘要： PURPOSE: To provide a circuit board fitted with a capacitor equipped with a corner cover having an enough thickness. CONSTITUTION: On a circuit board 1 lie a printed capacitor PC and a gas deposition type capacitor GC. A part 2b1 of the corner of the lower electrode 2b positioned under the connection 8b of the printed capacitor PC is covered with a stacked film of superfine particles so as to make a corner cover 6. In the case of forming a gas deposition type capacitor GC on the same substrate, the corner cover 6 is made together when forming an induced layer 3a on the lower electrode 2c of the gas deposition type capacitor GC by gas deposition method.

8. 发明专利

JPH08222405A CHIP-TYPE ELECTRONIC COMPONENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH08222405A
公开(公告)日：1996-08-30
申请号：JP4640495
申请日：1995-02-10
申请人： HOKURIKU ELECT IND
发明人： AZUMA KOJI , ISHIYAMA ICHIRO , KUROKAWA HIROYUKI , NAGARE ICHIRO , OBARA YOZO
IPC分类号： H01G4/12 , H01C1/14 , H01C7/00 , H01C17/06 , H01C17/28
摘要： PURPOSE: To easily thin a surface mounting type electronic component and to realize stable quality and easy manufacturing. CONSTITUTION: At least one pair of electrodes 16 consisting of a metallic thin film are formed in an end part on an insulating resin film 12. A metallic thin film which is a resistor 18 and a dielectric such as barium titanate are formed as an electronic element between the electrodes 16. The electrode 16 is formed in a surface of the resin film 12 through a ceramic thin film 14.

9. 发明专利

JPH08125302A CIRCUIT SUBSTRATE WITH CAPACITOR AND MULTILAYER CIRCUIT SUBSTRATE WHEREIN THE CIRCUIT SUBSTRATE IS USED 失效
公开(公告)号：JPH08125302A
公开(公告)日：1996-05-17
申请号：JP25525294
申请日：1994-10-20
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , NAGARE ICHIRO , KUROKAWA HIROYUKI , KATO MASAKI , AZUMA KOJI , NOMURA KAZUO , NAKANUMA NOBUTSUGU
IPC分类号： H05K1/16 , H05K3/46
摘要： PURPOSE: To provide a circuit substrate with a print capacitor which enables an increase in capacity of a print capacitor formed on a printed substrate. CONSTITUTION: A copper clad lamination board 1 is used as an insulation substrate. A first electrode 2a of a print capacitor 3 is formed of cooper foil on a surface of a copper clad lamination board. A dielectric layer 4a is formed on the first electrode 2a by using dielectric paste and a second electrode 5a is formed on the dielectric layer 4a by using conductive paint.

10. 发明专利

JPH0856064A BOARD WITH CAPACITOR AND MANUFACTURING METHOD THEREOF 失效
公开(公告)号：JPH0856064A
公开(公告)日：1996-02-27
申请号：JP21210494
申请日：1994-08-13
申请人： HOKURIKU ELECT IND
发明人： ISHIYAMA ICHIRO , AZUMA KOJI , KATO MASAKI , NAGARE ICHIRO , KUROKAWA HIROYUKI , OBARA YOZO
IPC分类号： H05K1/16 , H05K1/18 , H05K3/32
摘要： PURPOSE:To enable circuit boards to be easily laminated without protruding from the board surface thereby enabling the capacitance to be set up precisely. CONSTITUTION:Within this board with a capacitor, one wiring pattern 3 is formed on the surface of an insulating board while a dielectric 6 is formed on an electrode 5 on one end of this wiring pattern 3, on the other hand, a capacitor formed of an electrode 9 of the other wiring pattern 8 on the surface of this dielectric 6 is provided. Furthermore, a shallow recession 12 is formed in the board while a sheetlike capacitor 14 is buried in this recession 12. In such a constitution, one wiring pattern 3 is connected to one electrode of the sheetlike capacitor 14 while the other wiring pattern 8 is connected to the other electrode of said capacitor 14.

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