专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JPS61241955A LEAD MEMBER AND SEMICONDUCTOR DEVICE USING SAID LEAD MEMBER 失效
公开(公告)号：JPS61241955A
公开(公告)日：1986-10-28
申请号：JP8249985
申请日：1985-04-19
申请人： HITACHI VLSI ENG , HITACHI LTD , HITACHI TOKYO ELECTRON KK
发明人： SUGIMOTO SHUICHI , HONDA ATSUSHI , OOTA TADAAKI , TSUBOI TOSHIHIRO , YAMAMOTO KUNIO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To obtain lead members, which can implement a fine lead pitch, by forming the lead members having a structure, wherein conductors as thin plate leads and insulators are alternately laminated. CONSTITUTION:A silicon pallet 2 is attached to a specified position at the center of the surface of a pellet supporting substrate 4 with a coupling material 5. Lead members 6 in an L shape are attached in the four directions at the peripheral parts of the pellet 2 by a bonding agent 7 before and after the attachment of the pellet. Then, bonding pads 8, which are provided on the pallet 2 in a large quantity, are bonded to lead parts 6a of the lead members 6 with wires 9. Thus the pellet 2 and the leads 6a are electrically conducted. Thereafter, a dam 10 in a square frame shape is attached to the surrounding part of the pellet 2 with the bonding agent 7. Thus a cavity 11 is formed. Thereafter, silicon gel 3 is potted in the cavity 11. Finally, a cap 12 comprising a metal plate is attached to the dam 10 with the bonding agent 7. Thus, the lead members having a fine lead pitch can be provided.

2. 发明专利

JPH1084011A SEMICONDUCTOR DEVICE, MANUFACTURE THEREOF AND SEMICONDUCTOR DEVICE MOUNTING METHOD 失效
公开(公告)号：JPH1084011A
公开(公告)日：1998-03-31
申请号：JP23601496
申请日：1996-09-06
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MATSUGAMI SHOJI , TSUBOI TOSHIHIRO , OZAKI HIROSHI , OGUMA HIROSHI , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI
IPC分类号： H01L21/60 , H05K1/02 , H05K1/18 , H05K3/30 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a technique with which the reliability of connection can be improved by suppressing the deformation of a ball-like conductor. SOLUTION: The height of a package 10 is constantly maintained on the mounting surface of the package 10, where a semiconductor chip 1 is mounted, abutting on a wiring board. A plurality of spacers 11, constituted by a chip component consisting of a by-pass capacitor, etc., are attached. The application of the weight of the package itself to ball-like conductors 9 can be suppressed by the presence of the spacers 11.

3. 发明专利

JPH09199526A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09199526A
公开(公告)日：1997-07-31
申请号：JP656696
申请日：1996-01-18
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： SHIRAISHI TOMOHIRO , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI , HIDA AKIHIRO , TSUBOI TOSHIHIRO , MATSUGAMI SHOJI
IPC分类号： H01L21/60 , H01L23/12 , H01L25/065 , H01L25/07 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/18 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To deal with the packages of both cavity up type and cavity down type by providing base conductive layers conducted with one another at desired positions of the surface of a circuit board at the cavity side and the reverse surface thereto, and constituting to make it possible to connect mounting electrodes to the layers. SOLUTION: Base conducting layers 10 made, for example, of solder ball lands are formed at the ends of through hole wirings 9 exposed with the surface 1A of the cavity side and reverse surface 1B to the cavity side of an insulating board 1, and the layers 10 corresponding via the wirings 9 are conducted with one another. Either the surface 1A or 1B of the board 1 is selected as a mounting surface, and a mounting electrode 11 made of a ball-like solder electrode as indicated by a broken line can be connected to the layer 10 of the surface. Thus, the one type of package can deal with the packages of both the cavity up type and cavity down type.

4. 发明专利

JPH09134978A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH09134978A
公开(公告)日：1997-05-20
申请号：JP29288195
申请日：1995-11-10
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： HORIUCHI HITOSHI , TATE HIROSHI , MATSUGAMI SHOJI , TSUBOI TOSHIHIRO , MIWA TAKASHI
IPC分类号： H05K1/11 , H01L21/56 , H01L23/12 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To prevent the warp of a wiring board due to the curing shrinkage of a resin. SOLUTION: This device has a semiconductor pellet 2 on the main surface side of a wiring board 1 and bump electrodes 6 on the rear side of the wiring board 1. The resin 4A of a resin-sealed body 4 is provided on the main surface side and on the rear surface side, respectively, and further, lead pins 5 for electrically interconnecting the electrode pads 1B of the rear surface of the wiring board 1 and the bump electrodes 6 are provided therebetween. The thickness T2 of the resin 4A provided on the rear surface side of the wiring board 1 is set nearly equal to the thickness T1 of the resin 4A provided on the main surface side of the wiring board 1.

5. 发明专利

JPH09129765A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09129765A
公开(公告)日：1997-05-16
申请号：JP27877095
申请日：1995-10-26
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： OZAKI HIROSHI , TSUBOI TOSHIHIRO , OGUMA HIROSHI , MATSUGAMI SHOJI , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO , TSUTSUMI YASUKI , HIDA AKIHIRO
IPC分类号： H01L23/02 , H01L23/04
摘要： PROBLEM TO BE SOLVED: To securely bond the bonding area of a base member and the peripheral area of a sealing cap in a semiconductor device sealing a semiconductor pellet with a sealing body provided with the base member and the sealing cap where the peripheral area is bonded to the bonding area of the base member by interposing adhesive. SOLUTION: A pool area 9 pooling adhesive 6 is provided between the bonding area 1A3 of the base member 1A and the peripheral area 1B1 of the sealing cap 1B in the semiconductor device sealing the semiconductor pellet 2 in the sealing body 1 provided with the base member 1A and the sealing cap 1B where the peripheral area 1B1 is bonded to the bonding area 1A3 of the base member 1A by interposing adhesive 6.

6. 发明专利

JPH0738034A LEAD FRAME 失效
公开(公告)号：JPH0738034A
公开(公告)日：1995-02-07
申请号：JP17776793
申请日：1993-07-19
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： OZAKI HIROSHI , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , MIWA TAKASHI , MATSUNAGA TOSHIHIRO , KOSAKU HIROSHI , AKASAKI HIROSHI
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To dispense with a process of cutting a dam part by a press tool or etching after resin molding, by providing a gap between leads of the dam part and by insulating each dam part. CONSTITUTION:A dam part 2 is provided with a gap 5 in the middle thereof, between leads 3. The end part of the dam part 2 divided in this way has a triangular projecting part 6 and each dam part 2 is independent of an adjacent lead part 3. Since cutting of a dam after molding is dispensed with, accordingly, a product of a narrow pitch can be produced. Besides, a package being small in size and made to have many pins can be realized.

7. 发明专利

JPH06232193A MOLDING EQUIPMENT AND MOLDING METHOD USING SAME 失效
公开(公告)号：JPH06232193A
公开(公告)日：1994-08-19
申请号：JP1524593
申请日：1993-02-02
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , KUBOSONO MINORU , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , KOSAKU HIROSHI
IPC分类号： B29C45/02 , B29C45/26 , B29L31/34 , H01L21/56 , H01L23/50
摘要： PURPOSE:To surely eliminate flowing-out resin which leaks out at the time of resin molding process of a resin molded type semiconductor integrated circuit device, at the time of resin molding. CONSTITUTION:At the position clamping the lead part of a lead frame 1, through holes 5, 6 are formed between leads of an upper mold 3 and a lower mold 4. At the time of resin molding, pressure fluid is applied to the through holes 5, 6 of the both molds 3, 4, and flowing-out resin which leaks out from a gap between the leads of the lead frame 1 is blown away and eliminated.

8. 发明专利

JPH04284655A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH04284655A
公开(公告)日：1992-10-09
申请号：JP4845591
申请日：1991-03-13
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , KOSAKU HIROSHI
IPC分类号： H01L23/40
摘要： PURPOSE:To make heat dissipating fins replaceable meeting the requirements for actual mounting step. CONSTITUTION:The heat dissipating films 12 are free-removably fixed by bolts 13 and nuts 14 on the rear surface side of a thermal diffusion plate 3 comprising the package main body 2 of the title semiconductor integrated circuit device 1 e.g. in a pin grid array type, etc.

9. 发明专利

JPH04245462A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH04245462A
公开(公告)日：1992-09-02
申请号：JP990091
申请日：1991-01-30
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , OZAKI HIROSHI
IPC分类号： H01L21/60 , H01L23/29
摘要： PURPOSE:To improve the heat radiating property of a semiconductor integrated circuit device of a TAB system. CONSTITUTION:In this semiconductor integrated circuit device of a TAB system in which a semiconductor chip 4 is electrically connected to the leading end sections of leads 3 formed on tape carriers 2 through bumps 5, the semiconductor chip 4 is sealed with a sealing section 6 made of a potting resin, etc., in a state where a radiating fins 7 are stuck to the rear surface of the chip 4 with a bonding agent.

10. 发明专利

JPH04123442A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH04123442A
公开(公告)日：1992-04-23
申请号：JP24444990
申请日：1990-09-14
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： TSUBOI TOSHIHIRO , SHIRAI MASAYUKI , MATSUNAGA TOSHIHIRO , KOSAKU HIROSHI , OTSUKA KANJI
IPC分类号： H01L23/36 , H01L21/52
摘要： PURPOSE:To make improved heat radiation and relieved thermal stress compatible with each other by providing a high heat conductive synthetic resin adhesive at the central part of a semiconductor chip and providing the peripheral part with a low Young's modulus synthetic resin adhesive. CONSTITUTION:A heat diffusion plate 5 is adhered to an insulated substrate 2 with an adhesive 6, and a heat radiation plate 7 is adhered to the heat diffusion plate 5 by the adhesive 6. On the other hand, a semiconductor chip 8 is connected to the undersurface central part of the heat diffusion plate 5. The semiconductor chip 8 is adhered to the undersurface central of the heat diffusion plate 5 with two kinds of adhesives 6a, 6b having different characteristics. Of two kinds of adhesives 6a, 6b, the adhesive 6a is arranged at the central part of the chip 8, and the adhesive 6b is arranged at the peripheral part of the chip 8. The adhesive 6a is an adhesive having high heat conductivity thus contribute to improving heat radiation and the adhesive 6b arranged at the peripheral part of the chip 8 where stress is liable to be especially concentrated, is an adhesive having a low Young's modulus thus contributing to relieve stress.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式