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1. 发明专利

JPH09134978A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH09134978A
公开(公告)日：1997-05-20
申请号：JP29288195
申请日：1995-11-10
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： HORIUCHI HITOSHI , TATE HIROSHI , MATSUGAMI SHOJI , TSUBOI TOSHIHIRO , MIWA TAKASHI
IPC分类号： H05K1/11 , H01L21/56 , H01L23/12 , H05K1/18
摘要： PROBLEM TO BE SOLVED: To prevent the warp of a wiring board due to the curing shrinkage of a resin. SOLUTION: This device has a semiconductor pellet 2 on the main surface side of a wiring board 1 and bump electrodes 6 on the rear side of the wiring board 1. The resin 4A of a resin-sealed body 4 is provided on the main surface side and on the rear surface side, respectively, and further, lead pins 5 for electrically interconnecting the electrode pads 1B of the rear surface of the wiring board 1 and the bump electrodes 6 are provided therebetween. The thickness T2 of the resin 4A provided on the rear surface side of the wiring board 1 is set nearly equal to the thickness T1 of the resin 4A provided on the main surface side of the wiring board 1.

2. 发明专利

JPH07263490A FLIP CHIP AND MICROBONDING METHOD 失效
公开(公告)号：JPH07263490A
公开(公告)日：1995-10-13
申请号：JP5051394
申请日：1994-03-22
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： AKASAKI HIROSHI , MIWA TAKASHI
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent fatigue damage by providing an elastic protrusion between an outer electrode of a side having a dummy electrode and the dummy electrode, and providing a conductive wire for connecting the outer electrode to the dummy electrode in a loop to cross over the protrusion. CONSTITUTION:A dummy electrode 18 and an elastic protrusion 15 made of silicone rubber between chip electrodes 16 and the electrode 18 are provided, in addition to the electrodes 16, on an element forming surface of a semiconductor chip 11, and one end of a conductive wire 17 is connected to the electrode 18 by wedge bonding in a loop on the protrusion 15. The chip 11 is so aligned in a face-down bonding manner that board electrodes 19 on a circuit board 12 are touched to the wire 17, and the chip 11 is fixed to the board 12 with optically curable resin as adhesive. Thus, fatigue damage of a connecting part of the chip to the board can be prevented.

3. 发明专利

JPH0738034A LEAD FRAME 失效
公开(公告)号：JPH0738034A
公开(公告)日：1995-02-07
申请号：JP17776793
申请日：1993-07-19
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： OZAKI HIROSHI , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , MIWA TAKASHI , MATSUNAGA TOSHIHIRO , KOSAKU HIROSHI , AKASAKI HIROSHI
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To dispense with a process of cutting a dam part by a press tool or etching after resin molding, by providing a gap between leads of the dam part and by insulating each dam part. CONSTITUTION:A dam part 2 is provided with a gap 5 in the middle thereof, between leads 3. The end part of the dam part 2 divided in this way has a triangular projecting part 6 and each dam part 2 is independent of an adjacent lead part 3. Since cutting of a dam after molding is dispensed with, accordingly, a product of a narrow pitch can be produced. Besides, a package being small in size and made to have many pins can be realized.

4. 发明专利

JPH06232193A MOLDING EQUIPMENT AND MOLDING METHOD USING SAME 失效
公开(公告)号：JPH06232193A
公开(公告)日：1994-08-19
申请号：JP1524593
申请日：1993-02-02
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , KUBOSONO MINORU , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , KOSAKU HIROSHI
IPC分类号： B29C45/02 , B29C45/26 , B29L31/34 , H01L21/56 , H01L23/50
摘要： PURPOSE:To surely eliminate flowing-out resin which leaks out at the time of resin molding process of a resin molded type semiconductor integrated circuit device, at the time of resin molding. CONSTITUTION:At the position clamping the lead part of a lead frame 1, through holes 5, 6 are formed between leads of an upper mold 3 and a lower mold 4. At the time of resin molding, pressure fluid is applied to the through holes 5, 6 of the both molds 3, 4, and flowing-out resin which leaks out from a gap between the leads of the lead frame 1 is blown away and eliminated.

5. 发明专利

JPH04284655A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPH04284655A
公开(公告)日：1992-10-09
申请号：JP4845591
申请日：1991-03-13
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , KOSAKU HIROSHI
IPC分类号： H01L23/40
摘要： PURPOSE:To make heat dissipating fins replaceable meeting the requirements for actual mounting step. CONSTITUTION:The heat dissipating films 12 are free-removably fixed by bolts 13 and nuts 14 on the rear surface side of a thermal diffusion plate 3 comprising the package main body 2 of the title semiconductor integrated circuit device 1 e.g. in a pin grid array type, etc.

6. 发明专利

JPH04245462A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH04245462A
公开(公告)日：1992-09-02
申请号：JP990091
申请日：1991-01-30
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , MATSUNAGA TOSHIHIRO , SHIRAI MASAYUKI , TSUBOI TOSHIHIRO , OZAKI HIROSHI
IPC分类号： H01L21/60 , H01L23/29
摘要： PURPOSE:To improve the heat radiating property of a semiconductor integrated circuit device of a TAB system. CONSTITUTION:In this semiconductor integrated circuit device of a TAB system in which a semiconductor chip 4 is electrically connected to the leading end sections of leads 3 formed on tape carriers 2 through bumps 5, the semiconductor chip 4 is sealed with a sealing section 6 made of a potting resin, etc., in a state where a radiating fins 7 are stuck to the rear surface of the chip 4 with a bonding agent.

7. 发明专利

JPH01254587A TRANSFER JIG FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01254587A
公开(公告)日：1989-10-11
申请号：JP6953188
申请日：1988-03-25
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , HONDA ATSUSHI , TSUBOI TOSHIHIRO
IPC分类号： B65D85/86 , B65D85/38
摘要： PURPOSE:To facilitate positioning and taking out of an article, by providing a stopper, formed for the article to be attachable by a spring elasticity, with a back stop faculty and fixing it at the stopper. CONSTITUTION:A stopper 3 is fixed along the side wall 2 of a stick 1 at the center of a receiver 5 to insert a semiconductor device board in the lower part of a state 4. At the end of the stick 1 an auxiliary stopper 6 is installed. The semiconductor device 7 is inserted from the other end of the stick 1, confronting the auxiliary stopper 6. Since the stopper 3 has a spring elasticity, when the semiconductor device 7 is inserted into the stopper 3 within the stick 1, the device 7 is transferred to the due to expansion by itself. The stopper 3 has a wave-shaped structure and a backstop faculty and hence the article does not return backwards after its insertion because it is blocked at the waving part 8 of the stopper 3. On taking out the article 7, the auxiliary stopper 8 is removed.

8. 发明专利

JPS63132465A PIN GRID ARRAY PACKAGE 失效
公开(公告)号：JPS63132465A
公开(公告)日：1988-06-04
申请号：JP27863386
申请日：1986-11-25
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NAKAMURA KOJI , HONDA ATSUSHI , MIWA TAKASHI , TSUBOI TOSHIHIRO
IPC分类号： H01L23/12 , H01L23/50 , H05K3/30 , H05K3/34
摘要： PURPOSE:To reduce the stress applied to a package caused by bending of a substrate for mounting, by providing the lead pin of a PGA with a bend part of a U-shape and the like or a spring type part. CONSTITUTION:In a pin grid array package (PGA), wherein the lead pin 5 of a package base 1 mounting a semiconductor element is connected to a substrate for mounting 14, the above mentioned pin 5 is provided with a bend part 7 or a spring type part 13. Therefore the bend part 7 or the spring type part 13 eases the stress caused by bending of the substrate 14, and so it can be prevented from extending to the PGA 8 on which elements are mounted. Further the lead pin 5 itself operates as a spacer for the substrate 14, so that the spacer member of exclusive use can be made unnecessary.

9. 发明专利

JPS63127540A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63127540A
公开(公告)日：1988-05-31
申请号：JP27186486
申请日：1986-11-17
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , HONDA ATSUSHI , OTA TADAAKI
IPC分类号： H01L21/52 , H01L23/02
摘要： PURPOSE:To enable attaching a pellet by using a resin such as silicone rubber and to contrive preventing the crack of the pellet by attaching the pellet with a cement supplied in a hole for supplying the cement made in a package substrate. CONSTITUTION:A pellet 2 is mounted on a hole 1a for supplying a cement on a package substrate 1 and the bottom surface of the pellet 2 is vacuum- sucked via the hole 1a for supplying the cement and a through hole 7a for supplying the cement and adsorbed on the package substrate 1. In this state, wire bonding and the seal with a cap 4 are carried out by using a comparatively high deposition temperature sealing material 6 such as low melting point glass. After the sealing, a resin such as silicone rubber is supplied by means of such as pouring in the hole 1a for supplying the cement on the back surface of the pellet via the through hole 7a for supplying the cement or spraying and the pellet 2 is attached to the package substrate 1 with the cement 3. For this reason, the pellet can be attached by using the cement which is the resin which causes no crack of the pellet.

10. 发明专利

JPS6352451A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6352451A
公开(公告)日：1988-03-05
申请号：JP19548086
申请日：1986-08-22
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： OOTA TADAAKI , HONDA ATSUSHI , MIWA TAKASHI
IPC分类号： H01L23/50 , H01L23/28
摘要： PURPOSE:To prevent a boundary between a lead frame and a resin from being separated, to prevent a pellet from cracking and to improve the moisture reliability of a semiconductor device by securing a dummy pellet to the rear surface of a tab for securing the pellet. CONSTITUTION:A normal pellet 7 is secured to one side surface of a tab 2, while a dummy pellet 8 is secured to the opposite side surface. When the pellets (normal and dummy pellets 7, 8) of the same thermal expansion coefficient are bonded to both side surfaces of the tab 2 in this manner, the degrees of the thermal expansion and contraction of the upper and lower parts of the tab 2 become similar, the upward warpage of the tab 2 is suppressed, and the thermal distortion is alleviated. Thus, it can prevent a boundary between a lead frame 1 and a resin-sealed part 10 from being separated to prevent the pellet 7 from cracking.

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