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1. 发明专利

JPS61241955A LEAD MEMBER AND SEMICONDUCTOR DEVICE USING SAID LEAD MEMBER 失效
公开(公告)号：JPS61241955A
公开(公告)日：1986-10-28
申请号：JP8249985
申请日：1985-04-19
申请人： HITACHI VLSI ENG , HITACHI LTD , HITACHI TOKYO ELECTRON KK
发明人： SUGIMOTO SHUICHI , HONDA ATSUSHI , OOTA TADAAKI , TSUBOI TOSHIHIRO , YAMAMOTO KUNIO
IPC分类号： H01L23/50 , H01L23/495
摘要： PURPOSE:To obtain lead members, which can implement a fine lead pitch, by forming the lead members having a structure, wherein conductors as thin plate leads and insulators are alternately laminated. CONSTITUTION:A silicon pallet 2 is attached to a specified position at the center of the surface of a pellet supporting substrate 4 with a coupling material 5. Lead members 6 in an L shape are attached in the four directions at the peripheral parts of the pellet 2 by a bonding agent 7 before and after the attachment of the pellet. Then, bonding pads 8, which are provided on the pallet 2 in a large quantity, are bonded to lead parts 6a of the lead members 6 with wires 9. Thus the pellet 2 and the leads 6a are electrically conducted. Thereafter, a dam 10 in a square frame shape is attached to the surrounding part of the pellet 2 with the bonding agent 7. Thus a cavity 11 is formed. Thereafter, silicon gel 3 is potted in the cavity 11. Finally, a cap 12 comprising a metal plate is attached to the dam 10 with the bonding agent 7. Thus, the lead members having a fine lead pitch can be provided.

2. 发明专利

JPS61241947A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61241947A
公开(公告)日：1986-10-28
申请号：JP8250085
申请日：1985-04-19
申请人： HITACHI VLSI ENG , HITACHI LTD , HITACHI TOKYO ELECTRON KK
发明人： OOTA TADAAKI , HONDA ATSUSHI , YAMAMOTO KUNIO
IPC分类号： H01L23/06 , H01L23/10 , H01L23/28 , H01L23/373
摘要： PURPOSE:To reduce thermal resistance and to improve heat radiating characteristic, by constituting a dam by shape memorizing alloy, and bringing a cap into contact with gel. CONSTITUTION:A dam 9 is fixed to both end parts of a base 1 of a pin-grid- array type semiconductor package by using silicon bonding agent 8. The dam 9 is constituted by a shape memorizing alloy and has a U-shaped cross section. Silicon gel 10 is potted in an area divided by the dam 9. Various kinds of alloys can be used for the shape memorizing alloy constituting the dam 9. For examples, Fe/Ni alloy, NiTi alloy, AuCd alloy and CuZn alloy are listed. Thus, the semiconductor device having excellent heat-radiating characteristic can be obtained.

3. 发明专利

JPH08288437A HEAT RADIATING FIN, SEMICONDUCTOR DEVICE USING IT, AND SEMICONDUCTOR DEVICE MOUNTING STRUCTURE 失效
公开(公告)号：JPH08288437A
公开(公告)日：1996-11-01
申请号：JP11516595
申请日：1995-04-17
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： KOMATA MAKOTO , EMATA KOJI , OKINAGA TAKAYUKI , TATE HIROSHI , HORIUCHI HITOSHI , SASAKI MASAKO , HONDA ATSUSHI
IPC分类号： H01L23/40
摘要： PURPOSE: To surely prevent a heat radiating fin from coming off a semiconductor device by mechanically fixing the fin to the device with a plurality of retaining claws protruded from the outer periphery of the fin. CONSTITUTION: The main body 11 of a heat radiating fin 10 is brought into contact with the upper surface of a resin body 3 sealing a QFP and IC1 with the fin section 12 of the fin 10 upward. When the main body 11 is brought into contact with the upper surface of the body 3, the tour retaining claws 16 of the fin 10 are pressed down while the claws 16 are respectively aligned with the four corners of the body 3. Therefore, the claws 16 are respectively locked to the edge of the body 3 at the four corners on the rear surface side. Since the fin 10 is mechanically fixed to the QFP and IC1 with the tour claws 16 in such a way, the fin 10 is surely fixed to the QFP and IC1 without receiving any influence from the mold release agent of the body 3. Therefore, the QFP and IC1 can surely maintain their heat radiating abilities.

4. 发明专利

JPH07161902A SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR ITS MANUFACTURE 失效
公开(公告)号：JPH07161902A
公开(公告)日：1995-06-23
申请号：JP30255193
申请日：1993-12-02
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIURA KAORU , OKINAGA TAKAYUKI , EMATA KOJI , HORIUCHI HITOSHI , KOMATA MAKOTO , HONDA ATSUSHI , SUZUKI HIROMICHI
IPC分类号： H01L23/50
摘要： PURPOSE:To increase the number of pins and narrow a lead pitch in a semiconductor device. CONSTITUTION:A semiconductor device 1 comprises a package 2 made of a resin, a lead 3 extending over inside and outside the package 2, a semiconductor chip located inside the package 2. An inner lead 6 extending over inside the package is alternately sectioned up and down with one sheet of insulating film 12, and also the inner end of respective inner leads and the electrode of a semiconductor chip 9 are interconnected with a conductive wire 13. The tip of the inner lead 6 is alternately made long and short. The tip of short lead 11 extends on the insulating film 12, and the tip of a long lead 10 projects beyond the lower surface side of the insulating film 12, and the wire 13 is connected with the projection part. As a result, a wire-bonding position becomes zigzag-like arrangement, and since there is a a difference in level, it can be achieved that the inner lead 6 is made narrow. that is, an outer lead 7 is made narrow (the increase of the number of pins).

5. 发明专利

JPH01254587A TRANSFER JIG FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01254587A
公开(公告)日：1989-10-11
申请号：JP6953188
申请日：1988-03-25
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , HONDA ATSUSHI , TSUBOI TOSHIHIRO
IPC分类号： B65D85/86 , B65D85/38
摘要： PURPOSE:To facilitate positioning and taking out of an article, by providing a stopper, formed for the article to be attachable by a spring elasticity, with a back stop faculty and fixing it at the stopper. CONSTITUTION:A stopper 3 is fixed along the side wall 2 of a stick 1 at the center of a receiver 5 to insert a semiconductor device board in the lower part of a state 4. At the end of the stick 1 an auxiliary stopper 6 is installed. The semiconductor device 7 is inserted from the other end of the stick 1, confronting the auxiliary stopper 6. Since the stopper 3 has a spring elasticity, when the semiconductor device 7 is inserted into the stopper 3 within the stick 1, the device 7 is transferred to the due to expansion by itself. The stopper 3 has a wave-shaped structure and a backstop faculty and hence the article does not return backwards after its insertion because it is blocked at the waving part 8 of the stopper 3. On taking out the article 7, the auxiliary stopper 8 is removed.

6. 发明专利

JPS63132465A PIN GRID ARRAY PACKAGE 失效
公开(公告)号：JPS63132465A
公开(公告)日：1988-06-04
申请号：JP27863386
申请日：1986-11-25
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： NAKAMURA KOJI , HONDA ATSUSHI , MIWA TAKASHI , TSUBOI TOSHIHIRO
IPC分类号： H01L23/12 , H01L23/50 , H05K3/30 , H05K3/34
摘要： PURPOSE:To reduce the stress applied to a package caused by bending of a substrate for mounting, by providing the lead pin of a PGA with a bend part of a U-shape and the like or a spring type part. CONSTITUTION:In a pin grid array package (PGA), wherein the lead pin 5 of a package base 1 mounting a semiconductor element is connected to a substrate for mounting 14, the above mentioned pin 5 is provided with a bend part 7 or a spring type part 13. Therefore the bend part 7 or the spring type part 13 eases the stress caused by bending of the substrate 14, and so it can be prevented from extending to the PGA 8 on which elements are mounted. Further the lead pin 5 itself operates as a spacer for the substrate 14, so that the spacer member of exclusive use can be made unnecessary.

7. 发明专利

JPS63127540A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS63127540A
公开(公告)日：1988-05-31
申请号：JP27186486
申请日：1986-11-17
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： MIWA TAKASHI , HONDA ATSUSHI , OTA TADAAKI
IPC分类号： H01L21/52 , H01L23/02
摘要： PURPOSE:To enable attaching a pellet by using a resin such as silicone rubber and to contrive preventing the crack of the pellet by attaching the pellet with a cement supplied in a hole for supplying the cement made in a package substrate. CONSTITUTION:A pellet 2 is mounted on a hole 1a for supplying a cement on a package substrate 1 and the bottom surface of the pellet 2 is vacuum- sucked via the hole 1a for supplying the cement and a through hole 7a for supplying the cement and adsorbed on the package substrate 1. In this state, wire bonding and the seal with a cap 4 are carried out by using a comparatively high deposition temperature sealing material 6 such as low melting point glass. After the sealing, a resin such as silicone rubber is supplied by means of such as pouring in the hole 1a for supplying the cement on the back surface of the pellet via the through hole 7a for supplying the cement or spraying and the pellet 2 is attached to the package substrate 1 with the cement 3. For this reason, the pellet can be attached by using the cement which is the resin which causes no crack of the pellet.

8. 发明专利

JPS6352451A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6352451A
公开(公告)日：1988-03-05
申请号：JP19548086
申请日：1986-08-22
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： OOTA TADAAKI , HONDA ATSUSHI , MIWA TAKASHI
IPC分类号： H01L23/50 , H01L23/28
摘要： PURPOSE:To prevent a boundary between a lead frame and a resin from being separated, to prevent a pellet from cracking and to improve the moisture reliability of a semiconductor device by securing a dummy pellet to the rear surface of a tab for securing the pellet. CONSTITUTION:A normal pellet 7 is secured to one side surface of a tab 2, while a dummy pellet 8 is secured to the opposite side surface. When the pellets (normal and dummy pellets 7, 8) of the same thermal expansion coefficient are bonded to both side surfaces of the tab 2 in this manner, the degrees of the thermal expansion and contraction of the upper and lower parts of the tab 2 become similar, the upward warpage of the tab 2 is suppressed, and the thermal distortion is alleviated. Thus, it can prevent a boundary between a lead frame 1 and a resin-sealed part 10 from being separated to prevent the pellet 7 from cracking.

9. 发明专利

JPS62150870A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS62150870A
公开(公告)日：1987-07-04
申请号：JP29067585
申请日：1985-12-25
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： OOTA TADAAKI , HONDA ATSUSHI
IPC分类号： H01L23/538 , H01L23/498
摘要： PURPOSE:To accurately bond a semiconductor pellet by connecting through hole wirings with a projection formed on a pellet mount. CONSTITUTION:The planar shape of a pellet mount 2 is formed of a square shape having a projection 2a. Through hole wirings 11 which are electrically connected at its end with a tungsten layer 13 are formed under the projection 2a, and electrically connected at its other end with inner layer wirings 10a. The wirings 10a are connected with a plating electrode to be electrically plated. Since the wirings 11a are connected with the projection 2a, the bonding surface of a pellet 3 can be formed flatly. Wirings 5 disposed at the side of the projection 2a are moved backward to obtain an interval between the projection 2a and wirings 5a. The end 7a of a frame 7 is formed in a circular-arc shape moved backward in the projecting direction of the projection 2a. Thus, effective length is obtained for the wirings 5a moved backward to effectively perform a wire bonding.

10. 发明专利

JPS61190473A SPRING STOPPER FOR MAGAZINE 失效
公开(公告)号：JPS61190473A
公开(公告)日：1986-08-25
申请号：JP2175885
申请日：1985-02-08
申请人： HITACHI VLSI ENG , HITACHI LTD
发明人： TSUBOI TOSHIHIRO , HONDA ATSUSHI , NAKAMURA KOJI , MIYASHITA MASANORI , SUDA YASUHIRO
IPC分类号： B65D85/38

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