专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明专利

JP2002213356A REFRIGERANT COMPRESSOR, AIR CONDITIONER AND REFRIGERATOR USING THE SAME, AND ITS BEARING 审中-公开
公开(公告)号：JP2002213356A
公开(公告)日：2002-07-31
申请号：JP2001328864
申请日：2001-10-26
申请人： HITACHI LTD , TOYO TANSO CO
发明人： TAKAYASU HIROSHI , BABA NOBORU , NAKAJIMA SHOICHI , TAGUCHI MASAMITSU , IIZUKA TADASHI , YAMANAKA TOSHIAKI , OHASHI MASABUMI , OGURA HIROAKI , FUKUDA TOSHIOMI , OZAKI SHINICHI
IPC分类号： F04B39/00 , F04C18/356 , F04C29/00 , F04C29/02 , F16C9/02
摘要： PROBLEM TO BE SOLVED: To provide a refrigerant compressor of long life using a bearing material having high abrasion resistance and seizure-resistance, and to provide an air conditioner and a refrigerator using the same, and its bearing. SOLUTION: In this compressor compressing the refrigerant by a pump driven by a crank of a rotating shaft, and repeating the liquefaction and evaporation for refrigerating, the air conditioner and the refrigerator using the same, and the bearing, at least one of bearings to the rotating shaft and the crank is made of a material prepared by impregnating pores of a carbonaceous base including graphite of 20-50 wt.%, with one kind of metal selected from the IB, VIII excluding Fe, and Sn, or an alloy mainly composed of the metal, the carbonaceous base includes graphite of 20-50 wt.%, Shore hardness of the member is 65-120, a porosity of the member is 0.05-2 vol.%, and the metal or the alloy of the member includes at least one of V and Ti by 2.0 wt.% or less.

2. 发明专利

JPH04171604A CONDUCTIVE PASTE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04171604A
公开(公告)日：1992-06-18
申请号：JP29731290
申请日：1990-11-05
申请人： HITACHI LTD
发明人： OKAMOTO MASAHIDE , ARAKAWA HIDEO , OHASHI MASABUMI , OGIWARA SATORU , SAKAMOTO KOZO , KODAMA HIRONORI , YAMADA KAZUJI
IPC分类号： H05K1/09 , C09D5/24 , H01B1/16 , H01C7/00
摘要： PURPOSE:To enable application to a large ceramic substrate to thereby attain high integration of wiring pitches as well as high speed performance by composing a conductive paste of tungsten as its main gradient, and making the specific resistance after firing 10muOMEGA.cm or below. CONSTITUTION:At least one kind of compounds of IIa or IIIa group is added to tungsten metal powder and mixed. Then organic vehicle and the like is further added thereto and mixed to prepare a conductive paste. In this case as the tungsten metal powder, ones with high purity are desirable and as the element of IIa or IIIa group, Ca or Y is preferable. While the compound of IIa or IIIa group starts to be softened, sintering of the tungsten is facilitated, the density of tungsten conductor rises, specific resistance becomes small, and the compound of IIa or IIIa group works as the sintering assisting agent for tungsten powder. Application to a large ceramic substrate is made possible and attain high integration and high speed performance.

3. 发明专利

JPS63110754A GLASS-GLAZING METHOD FOR CERAMIC PACKAGE SUBSTRATE 失效
公开(公告)号：JPS63110754A
公开(公告)日：1988-05-16
申请号：JP25570286
申请日：1986-10-29
申请人： HITACHI LTD
发明人： NAKAGAWA MOROO , OHASHI MASABUMI , SUZUKI HIDEO , TAKAHASHI SHIGERU , OGIWARA SATORU
IPC分类号： H01L23/02
摘要： PURPOSE:To reduce the amount of air bubbles confined in glass being formed by a method wherein the side where the glass comes into contact with a ceramic is first softened and melted by means of a temperature gradient and the surface of the glass is melted at the final stage. CONSTITUTION:Paste-like glass which is formed by mixing an organic binder, its solvent and a filler is printed, by a screen-printing process, on a glass layer 5 formed on a ceramic substrate and a glass layer 7 formed on a ceramic cap. By raising the temperature slowly, the binder and the solvent are burned and the glass is formed. Because the surface of the glass is melted earlier than its inside during the glass forming process, the discharge of air bubbles is hindered. The glass is first melted on the ceramic side by means of a temperature gradient so that the air bubbles cannot be confined in the glass layer. As a result, the air bubbles can be easily discharged from the surface.

4. 发明专利

JPH09231881A VACUUM BREAKER, VACUUM VALVE AND ELECTRIC CONTACT FOR USE IN THE BREAKER, AND MANUFACTURE OF THEM 失效
公开(公告)号：JPH09231881A
公开(公告)日：1997-09-05
申请号：JP6024396
申请日：1996-02-23
申请人： HITACHI LTD
发明人： MURAKAMI HAJIME , OHASHI MASABUMI , KOMURO KATSUHIRO , KIKUCHI SHIGERU , BABA NOBORU
IPC分类号： H01H33/66
摘要： PROBLEM TO BE SOLVED: To suppress roughening of the electrode surface and enhance the breakdown voltage characteristics even in the initial operating performance by forming an arc electrode from a certain high-conductivity metal and a fire-resistant metal having a higher melting point than the high-conductivity metal. SOLUTION: An arc electrode is formed from a sintered alloy of such a structure that fire-resistant metal particles are dispersed in a high-conductivity metal, wherein the fire-resistant metal has a higher melting point than the high-conductivity metal. The particle sizes of the fire-resistant metal in a rod shape should be below 1μm in diameter, while the particle sizes of the high-conductivity metal be below 5μm. That is, the particle sizes of the fire-resistant metal such as Cr, W, Mo, Ta are made smaller than the powder of high-conductivity metal such as Cu, and the mixture powder is turned into alloy by mechanical process so that fine crystals are obtained whose grain sizes range between 10 and 1000nm. Accordingly both Cu and heat-resistant metal have fine crystal grains, and a high performance electrode material particularly in the initial operating period can be obtained. The arc electrode and a supporting member for electrode are made in a single piece structure in metallographical terms by means of sintering or frictional pressure joining, and thereby the reliability and safety are enhanced.

5. 发明专利

JPH0648822A PRODUCTION OF GREEN SHEET FOR CERAMIC CIRCUIT BOARD AND PRODUCTION OF CERAMIC MULTILAYER CIRCUIT BOARD 失效
公开(公告)号：JPH0648822A
公开(公告)日：1994-02-22
申请号：JP20488592
申请日：1992-07-31
申请人： HITACHI LTD
发明人： USHIFUSA NOBUYUKI , NAGAYAMA KOUSEI , OHASHI MASABUMI , FUNAKOSHI RIE , OGIWARA SATORU , YASUNAGA TAKUMI
IPC分类号： B28B1/30 , B28B11/02 , B28C1/04 , C04B35/00 , C04B35/18 , C04B35/632 , H05K1/03
摘要： PURPOSE:To obtain a ceramic green sheet low in moisture absorption and excellent in adhesion property of laminated layers, and to provide a ceramic multilayer circuit board high in accuracy and high in reliability by using this sheet. CONSTITUTION:The green sheet for a ceramic circuit board is produced by mixing a ceramic powder, org. binder, org. tackifier, and solvent essentially consisting of water to prepare a slurry, and then molding this slurry. The org. binder essentially consists of a nonwater-soluble acryl emulsion having substantially no COOH group or OH group. The org. tackifier essentially consists of an acryl emulsion having COOH group and/or OH group. The slurry is prepared by compounding 5-20 pts.wt. of the org. binder and 1-10 pts.wt. of the tackifier to 100 pts.wt. of the ceramic powder.

6. 发明专利

JPH0448757A PACKAGE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0448757A
公开(公告)日：1992-02-18
申请号：JP15520890
申请日：1990-06-15
申请人： HITACHI LTD
发明人： ARAKAWA HIDEO , OKAMOTO MASAHIDE , TANAKA AKIRA , OHASHI MASABUMI
IPC分类号： H05K1/11 , H01L23/12 , H01L23/50
摘要： PURPOSE:To obtain a ceramic package for semiconductor having high sealability and low thermal resistance by composing it of a through hole conductor formed of a metal wire having a melting point equal to or higher than the baking temperature of ceramics, and a board in which input/output pins are connected to the conductor. CONSTITUTION:Multilayer interconnection conductors 8 are interposed in a ceramic 2, and a metal wire through hole conductors 10 to be conducted therewith is interposed therein. Input/output pins 3 are directly brazed to the conductor 10 by a brazing layer 11 without Ni plating. As the baking temperature is 1700 deg. or higher, a metal wire made of W, Mo higher in melting point is applied to a board containing AlN as a main ingredient. Particularly, the wire of W substantially coincident with the AlN having 4.5X10 / deg.C of thermal expansion coefficient is selected. Thus, reliability for sintering the board and thermal stress in the case of a cold cycle is obtained. Further, if heat dissipation from a printed board is considered, heat can be dissipated to the board through the high thermal conductivity input/output pins, and it is possible to make the thermal resistance of a package lower by taking the material of the input/ output pins into account.

7. 发明专利

JPH06316463A POWDERY RAW MATERIAL FOR CERAMIC MULTILAYERED CIRCUIT BOARD AND CRYSTALLITE CERAMIC MULTILAYERED CIRCUIT BOARD 失效
公开(公告)号：JPH06316463A
公开(公告)日：1994-11-15
申请号：JP6454294
申请日：1994-03-07
申请人： HITACHI LTD , CHICHIBU CEMENT KK
发明人： USHIFUSA NOBUYUKI , ISHIHARA SHOSAKU , AMI NORIHIRO , FUNAKOSHI RIE , OGIWARA SATORU , OHASHI MASABUMI , NAGAYAMA KOUSEI , KOBAYASHI FUMIYUKI , SEKIHASHI MASAO , FUJITA TAKESHI , TAGAMI BUNICHI , SENGOKU NORIO , YASUNAGA TAKUMI , EMU JII EMU YUU ISUMAIRU , NAKAI ZENJIRO
IPC分类号： C04B35/18 , H05K1/03 , H05K3/46
摘要： PURPOSE:To make shrinkage in firing isotropic and improve dimensional accuracy by incorporating an aluminum component, a silicon component and an alkaline earth metal component. CONSTITUTION:The powdery ceramic raw material containing 50-60wt.% aluminum component, 50-40wt.% silicon component (expressed in terms of silica) and 0.3-1.5wt.% mullite crystal (expressed in terms of alkaline earth metal oxide) is obtained by mixing a mullite sol mixture obtained by mixing at least an alumina sol with a silica sol with the alkaline earth metal, spraying them into an atmosphere of 1300-1500 deg.C and drying them, A green sheet is obtained by molding a slurry obtained by mixing the powdery raw material with the ceramic powder containing alumina and an additive containing a binder. After a conductive wiring is formed on the green sheet, a ceramic sintered compact is obtained by sintering the green sheet at 1500-1700 deg.C.

8. 发明专利

JPH06104572A GREEN SHEET AND GREEN BODY FOR MULTILAYER CERAMIC CIRCUIT BOARD 失效
公开(公告)号：JPH06104572A
公开(公告)日：1994-04-15
申请号：JP24994292
申请日：1992-09-18
申请人： HITACHI LTD
发明人： NAGAYAMA KOUSEI , USHIFUSA NOBUYUKI , OHASHI MASABUMI , FUNAKOSHI RIE , OGIWARA SATORU , YASUNAGA TAKUMI
IPC分类号： B28B1/30 , H05K3/46
摘要： PURPOSE:To provide a multilayer ceramic circuit board in which long term shelf life and handling performance are improved by lowering hygroscopicity of ceramic green sheet while enhancing the strength thereof. CONSTITUTION:A green sheet composed of a binder resin and a ceramic material powder is applied, on at least one side thereof, with an adhesive resin layer 1 having low or zero hygroscopicity to produce an inventive green sheet or green body for multilayer ceramic circuit board. This constitution provides a green sheet for multilayer ceramic circuit board in which the green sheet composed of binder and ceramic material powder exhibits excellencies in adhesion and stability of shelf life.

9. 发明专利

JPH0283954A MODULE STRUCTURE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0283954A
公开(公告)日：1990-03-26
申请号：JP23500788
申请日：1988-09-21
申请人： HITACHI LTD
发明人： ARAKAWA HIDEO , OKAMOTO MASAHIDE , OHASHI MASABUMI , OGIWARA SATORU , YOKOYAMA HIROSHI , OGURO TAKAHIRO , WAI SHINICHI
IPC分类号： H01L23/34 , H01L23/36
摘要： PURPOSE:To cool an LSI uniformly by adding a specified amount of Y2O3 to AlN and sintering at a specified temperature in a module structure body sealed by a case consisting of AlN by placing the LSI on a multi-layer substrate. CONSTITUTION:A plurality of LSIs 7 are placed on a multilayer substrate 5 with a circuit network, a thermal conduction element 6 and a gap 1 with a cylindrical surface and a plane are provided on it, and then sealing is performed through a frame 3 for forming a module. Then, the cap 1 and the element 6 are formed by a material obtained by making AlN as a main constituent, adding 1-3atomic% Y2O3 as a sintering supporting agent, and by sintering at a sintering temperature of 1850-1950 deg.C. Since AlN thus produced has a stable thermal conduction characteristics and less growth of crystal grains, thus achieving a highly accurate machining. With this as a cap and a thermal conduction element of module, an LSI can be cooled uniformly.

10. 发明专利

JPH09237555A VACUUM CIRCUIT BREAKER, VACUUM VALVE AND ELECTRIC CONTACT POINT USED FOR IT, AND MANUFACTURE 失效
公开(公告)号：JPH09237555A
公开(公告)日：1997-09-09
申请号：JP6521596
申请日：1996-02-28
申请人： HITACHI LTD
发明人： MURAKAMI HAJIME , OHASHI MASABUMI , KOMURO KATSUHIRO , KIKUCHI SHIGERU , BABA NOBORU
IPC分类号： C22C1/04 , H01H11/04 , H01H33/66
摘要： PROBLEM TO BE SOLVED: To eliminate brazing connection, reduce the process related to brazing connection, prevent the breakage or drop of an electrode material due to defective connection, and improve reliability and safety by integrally connecting the members of a vacuum circuit breaker by discharge sintering. SOLUTION: An arc electrode member 31 is formed with a sintered alloy containing one or more kinds in a group of W, Mo, Co, Fe of 20-70wt.% and one or more kinds in a group of Cu, Ag, Au of 20-70wt.%. An arc electrode support member 32, a coil electrode member 33, and an exciting electrode rod are formed with a sintered alloy constituted of one or more kinds in a group of Cr, V, Nb, Zr, Si, W, Be of 1.0wt.% or below and one or more kinds in a group of Cu, Ag, Au for the remainder. The arc electrode member 31, the arc electrode support member 32, and the coil electrode member 33 or the arc electrode member 31 and the exciting electrode rod are metallographically and integrally connected by discharge sintering. The occurrence of a defective electrode material due to defective brazing is prevented, strength is improved, a trouble caused by an electrode deformation is prevented, and reliability and safety can be increased.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式