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1. 发明专利

JPH06316463A POWDERY RAW MATERIAL FOR CERAMIC MULTILAYERED CIRCUIT BOARD AND CRYSTALLITE CERAMIC MULTILAYERED CIRCUIT BOARD 失效
公开(公告)号：JPH06316463A
公开(公告)日：1994-11-15
申请号：JP6454294
申请日：1994-03-07
申请人： HITACHI LTD , CHICHIBU CEMENT KK
发明人： USHIFUSA NOBUYUKI , ISHIHARA SHOSAKU , AMI NORIHIRO , FUNAKOSHI RIE , OGIWARA SATORU , OHASHI MASABUMI , NAGAYAMA KOUSEI , KOBAYASHI FUMIYUKI , SEKIHASHI MASAO , FUJITA TAKESHI , TAGAMI BUNICHI , SENGOKU NORIO , YASUNAGA TAKUMI , EMU JII EMU YUU ISUMAIRU , NAKAI ZENJIRO
IPC分类号： C04B35/18 , H05K1/03 , H05K3/46
摘要： PURPOSE:To make shrinkage in firing isotropic and improve dimensional accuracy by incorporating an aluminum component, a silicon component and an alkaline earth metal component. CONSTITUTION:The powdery ceramic raw material containing 50-60wt.% aluminum component, 50-40wt.% silicon component (expressed in terms of silica) and 0.3-1.5wt.% mullite crystal (expressed in terms of alkaline earth metal oxide) is obtained by mixing a mullite sol mixture obtained by mixing at least an alumina sol with a silica sol with the alkaline earth metal, spraying them into an atmosphere of 1300-1500 deg.C and drying them, A green sheet is obtained by molding a slurry obtained by mixing the powdery raw material with the ceramic powder containing alumina and an additive containing a binder. After a conductive wiring is formed on the green sheet, a ceramic sintered compact is obtained by sintering the green sheet at 1500-1700 deg.C.

2. 发明专利

JP2002134885A CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MOUNTING BODY, AND GREEN SHEET 审中-公开
公开(公告)号：JP2002134885A
公开(公告)日：2002-05-10
申请号：JP2001208444
申请日：2001-07-09
申请人： HITACHI LTD
发明人： OKAMOTO MASAHIDE , ISHIHARA SHOSAKU , IWANAGA SHOICHI , AMI NORIHIRO , NAKAMURA MASATO , KOBAYASHI FUMIYUKI , SENGOKU NORIO
IPC分类号： H05K1/09 , C04B35/622 , C04B41/52 , C04B41/90 , H05K3/24 , H05K3/34 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To provide a glass ceramics multilayer circuit board where junction characteristics are good between a glass ceramics and a surface conductor layer as well as between the surface conductor layer and a pin. SOLUTION: In a surface conductor layer whose main component is copper, at least a pad part has a 2-layer structure. A layer (first layer) on the glass ceramics side is formed by printing a paste whose main component is copper with inorganics (for example alumina, mullita, and titanium) for raising junction characteristics to the glass ceramics being added on a green sheet. A layer over it is formed by printing, over the first layer, a paste whose main component is copper with no inorganics contained. The green sheet comprising the surface conductor layers are laminated with another green sheet, for sintering, with the former arranged on the outermost side.

3. 发明专利

JP2002047029A AMORPHOUS GLASS 失效
公开(公告)号：JP2002047029A
公开(公告)日：2002-02-12
申请号：JP2001185768
申请日：2001-06-20
申请人： HITACHI LTD
发明人： ISHIHARA SHOSAKU , KODAMA HIRONORI , OKAMOTO MASAHIDE , TANEI HEIKICHI , IWANAGA SHOICHI , SHOJI FUSAJI , KATSUMURA NOBUHITO , SATO RYOHEI , KOBAYASHI FUMIYUKI , TAGAMI BUNICHI , SENGOKU NORIO , YAGI KUNIHIRO , NAKAMURA MASATO , MORITA KOSAKU , FUJITA TAKESHI
IPC分类号： C04B35/14 , C03C3/089 , C03C3/091 , C03C3/093 , C04B35/622 , H05K1/03
摘要： PROBLEM TO BE SOLVED: To provide a ceramic wiring board sintered at 900-1050 deg.C which has a small dielectric constant, small coefficient of thermal expansion matching with silicon and large bending strength. SOLUTION: Glass with softening temperature 850-1100 deg.C i.e., in the Fig. 1 (SiO2-B2O3-R2O triangle composition chart. Positions of small circlets express each composition and the figures in the small circlets express composition numbers), the glass having compositions expressed by points in the territory (including an on-line) enclosed by lines connecting each point which express the first, the third, the tenth, the eleventh and the fourth compositions, are raw materials of the glass. Aqueous dispersion type grain is used as a binder, and in the firing process a green sheet is compressed in the direction of thickness.

4. 发明专利

JPH10242644A GREEN SHEET PRINTED WITH CONDUCTOR CIRCUIT, AND ITS MANUFACTURE, AND MULTILAYER WIRING CERAMIC BOARD USING THIS 失效
公开(公告)号：JPH10242644A
公开(公告)日：1998-09-11
申请号：JP4187297
申请日：1997-02-26
申请人： HITACHI LTD
发明人： SHOJI FUSAJI , KATSUMURA NOBUHITO , TOGAWA HIDEO , OKAMOTO MASAHIDE , ABE YOICHI , TANAKA HIDEAKI , SENGOKU NORIO , YAGI KUNIHIRO , KOBAYASHI FUMIYUKI
IPC分类号： H05K3/46
摘要： PROBLEM TO BE SOLVED: To make it possible to peel a conductor circuit pattern off a base material and to bond this pattern accurately to a ceramic green sheet at the same time, by using a thermoexfoliative adhesive sheet for base material for transfer where a conductor circuit pattern is manufactured. SOLUTION: A thermoexfoliative adhesive layer is made on a base material, and a metallic conductor circuit pattern is made on the side of the thermoexfoliative adhesive layer. A ceramic green sheet is welded by heating to the metallic conductor circuit pattern, with its tip of the projection positioned to connect with the circuit pattern, and the conductor pattern is transferred, and then, the green sheet printed with the conductor circuit is peeled off the thermoexfoliative adhesive layer on the base material. Wired green sheets units fitted obtained this way are laid on top of one another in such a way as to match one another, and are pressure-welded by heating and are sintered. Hereby, a multilayer ceramic board which is of high strength and excellent in electric property can be manufactured.

5. 发明专利

JPH08333157A WIRING SUBSTRATE, ITS PRODUCTION, AMORPHOUS GLASS, CERAMIC COMPOSITION FOR WIRING SUBSTRATE, ELECTRONIC CIRCUIT DEVICE, MODULE FOR ELECTRONIC COMPUTER AND ELECTRONIC COMPUTER 失效
公开(公告)号：JPH08333157A
公开(公告)日：1996-12-17
申请号：JP21085095
申请日：1995-08-18
申请人： HITACHI LTD
发明人： ISHIHARA SHOSAKU , KODAMA HIRONORI , OKAMOTO MASAHIDE , TANEI HEIKICHI , IWANAGA SHOICHI , SHOJI FUSAJI , KATSUMURA NOBUHITO , SATO RYOHEI , KOBAYASHI FUMIYUKI , TAGAMI BUNICHI , SENGOKU NORIO , YAGI KUNIHIRO , NAKAMURA MASATO , MORITA KOSAKU , FUJITA TAKESHI
IPC分类号： C04B35/16 , C03C8/14 , G03F7/004 , H01B3/02 , H01B13/00 , H05K1/03 , H05K3/46
摘要： PURPOSE: To obtain a ceramic wiring substrate having small dielectric constant, a thermal expansion coefficient matching with silicon and high in flexural strength and its production by sintering at 900-1050 deg.C. CONSTITUTION: A glass having 850-1100 deg.C softening temperature, that is, a glass having a composition expressed by points inside the region surrounded by the lines respectively binding the points respectively exhibiting a first, third, 10th, 11th and fourth compositions (containing the regions on the lines) in figure 1 (an SiO2 -B2 O3 -R2 O system triangular composition). Each position of the small circle exhibits its composition and the number in the small circle exhibits the composition number) is used as a raw material. Water-based dispersing particles are used as the binder and a green sheet is pressed in the thickness direction in a baking process.

6. 发明专利

JPH04330771A MODULE SEALING/COOLING STRUCTURE 失效
公开(公告)号：JPH04330771A
公开(公告)日：1992-11-18
申请号：JP1522191
申请日：1991-02-06
申请人： HITACHI LTD
发明人： SAKATA SHOJI , HATSUDA TOSHIO , OGURO TAKAHIRO , ASHIWAKE NORIYUKI , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/36
摘要： PURPOSE:To provide a module sealing/cooling structure, which does not need encapsulation of special gas, such as He gas, and makes possible a high cooling performance and a high-density packaging without sealing with solder. CONSTITUTION:A module sealing/cooling structure consists of a module board 3, sidewalls 4 and a cap 5, with which LSIs 12 mounted on the substrate are covered, a cooling component (a water cooling jacket 6) which comes into contact to the cap, a clamping jig for pressing the cooling component and a module part and components (8, 9, 10 and 11) related to the jig, a soft sealent 7 for inserting in the joints between the substrate and the sidewalls and between the cap and the sidewalls, heat conduction contactors 13 for conducting heat generated in the LSIs to the cooling component and a heat transfer compound 16.

7. 发明专利

JPH03283451A ELECTRONIC CIRCUIT DEVICE 失效
公开(公告)号：JPH03283451A
公开(公告)日：1991-12-13
申请号：JP8071390
申请日：1990-03-30
申请人： HITACHI LTD
发明人： SATO RYOHEI , KOBAYASHI FUMIYUKI , WATANABE YUTAKA , NEZU TOSHITADA , SHIRAI MITSUGI , TAKEDA KENJI , HARADA MASAHIDE , MATSUI KIYOSHI , SASAKI HIDEAKI
IPC分类号： H01L23/02 , B23K35/30 , H01L21/60 , H01L23/10 , H01L23/16 , H01L23/538 , H01L25/065 , H05K3/34
摘要： PURPOSE:To enable an electronic circuit device which requires reliable multilayer connections to be safely and reliably assembled in succession by a method wherein brazing materials possessed of required characteristics and boards are properly combined for assembly. CONSTITUTION:A lead pin 5 is connected to a circuit board 3 with Au13Ge solder (melting point: 356 deg.C). This connecting process is carried out in such a manner that the lead pin 5 is connected to a connection terminal formed on the rear of the circuit board 3 with the Au13Ge solder molten in a belt oven heated at a temperature of 350 deg.C or so. On the other hand, a semiconductor component is CCB-connected 8 to the connection terminal of a circuit board 9 with the molten Pb2Sn solder (melting point; 320 deg.C) heated at a temperature of 350 deg.C or so, and a sealing 18 and a die bonding 10 are carried out at the same time using molten Pb10Sn solder heated at a temperature of 310 deg.C or so. Then, the connection terminal provided to the rear of the circuit board 9 is connected to the surface of the circuit board 3 by a collective CCB connecting method with Sn3Ag solder (melting point; 221 deg.C) molten in a belt oven heated at a temperature of 240 deg.C or so. A frame 11 heated at a temperature of 240 deg.C or so and molten is jointed to a sealing top 12 through a frame connection 13. In succession, a heat conduction relay member 20 is mounted and connected with molten 37Pb solder (melting point: 183 deg.C) heated at a temperature of 200 deg.C or so, and thus an electronic circuit is formed. The pin 5 of the printed wiring board 2 is inserted into the electronic circuit concerned and connected with molten Sn45Pb18Bi by heating.

8. 发明专利

JPH03149861A COOLING STRUCTURE OF MULTI-CHIP MODULE 失效
公开(公告)号：JPH03149861A
公开(公告)日：1991-06-26
申请号：JP28792689
申请日：1989-11-07
申请人： HITACHI LTD
发明人： MIYAMOTO MITSUO , ZUSHI SHIZUO , GO HIROSHI , KOBAYASHI FUMIYUKI , KOJIMA HIROYUKI
IPC分类号： H01L23/40 , H01L23/433 , H01L23/473
摘要： PURPOSE:To make a structure which can conserve packed heat conduction grease well and can absorb the unevenness of the thickness of the whole module caused by external force to a heat sink, the coolant pressure, and thermal expansion by clamping the heat sink, a cap, and a wiring board integratedly and pressing the heat sink on to the cap. CONSTITUTION:In a multi-chip module cooling structure to cool a multi-chip module with a heat sink 4, the heat sink 4 is piled on the module cap 3 of the multi-chip module through heat conduction grease 8 and pressed to the module cap 3 with a clamp 9 to clamp the wiring board 1 of the multi-chip module, the module cap 3, and the heat sink 4 integratedly and a pressing means to press the heat sink 4 to the module cap 3 at certain pressure. For example, the pressing means comprises a plate spring 10 fastened to the clamp 9 and a pressing spacer 12 and gives a press at approximately the center of the heat sink 4.

9. 发明专利

JPH02148862A CIRCUIT ELEMENT PACKAGE, AND CARRIER BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH02148862A
公开(公告)日：1990-06-07
申请号：JP30239688
申请日：1988-11-30
申请人： HITACHI LTD
发明人： SHIGI HIDETAKA , TAKENAKA TAKATSUGU , KOBAYASHI FUMIYUKI
IPC分类号： H01L23/12 , H01L23/498 , H01L25/00 , H05K1/16 , H05K3/46
摘要： PURPOSE:To form a thin film circuit element having required accuracy without necessitating trimming by providing an electrode layer for connection to the circuit element on the topmost layer of insulating films, providing an element layer having the thin film circuit on any of other insulating films, and providing conductor wirings for connecting the electrode layer and external connecting terminals through the element layer. CONSTITUTION:Insulating layers 9a, 9b and 9c are formed on an insulating board. A thin film circuit element such as a thin film resistor is formed thereon. Therefore, irregularities, warping and the like on the surface of the insulating board, e.g. a ceramic substrate 6 are absorbed with the insulating films. The thin film circuit element is formed without the effects of the roughness of the surface of the insulating board. Therefore, the circuit element having the desired constants can be formed accurately. As a result, correction such as trimming is not required. A wiring layer 14 for connecting an electrode layer for connecting the circuit element to be mounted and external connecting terminals 10-13 of the insulating board is provided in an aligned pattern. Even if the alignment of the terminals of the circuit element to be mounted does not agree with the alignment of the external connecting terminal of the insulating board, the connection can be achieved.

10. 发明专利

JPH02138762A PACKAGE COOLING METHOD 失效
公开(公告)号：JPH02138762A
公开(公告)日：1990-05-28
申请号：JP20117689
申请日：1989-08-04
申请人： HITACHI LTD
发明人： MORIHARA ATSUSHI , NAGANUMA YOSHIO , YOKOYAMA HIROSHI , KAWAMURA KEIZO , MIYAMOTO MITSUO , SATO YASUSHI , OUCHI KAZUNORI , MIYADERA HIROSHI , KOBAYASHI FUMIYUKI , ZUSHI SHIZUO , GO HIROSHI
IPC分类号： H05K7/20 , H01L23/40
摘要： PURPOSE:To enable the efficient cooling of a semiconductor element following an inclination of the element by a method wherein not only a heat conductive element is set slidable on the semiconductor element but also the angle of a contact plane between the heat conductive element and the semiconductor element is set to have a certain value within a specified range. CONSTITUTION:Two or more semiconductor elements 10 are connected to a substrate 12 through a soldering connection 11. A heat conductive element 4 is provided in contact with the element 10. The element 4 is connected to a block 3 through an elastic piece 8 as being in contact with the block 3. The block 3 is provided in thermal contact with a cooling water unit 1. A V-shaped groove whose shape is equal to the projected shape of the element 4 is provided to the block 3. One side of the groove is a plane and brought into contact with the upside of the element 4. An angle beta that the elastic piece 8 makes with the element 10 is so defined as to satisfy a formula, alpha/2

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