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1. 发明专利

JPH01270254A RESIN SEALED TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01270254A
公开(公告)日：1989-10-27
申请号：JP9813288
申请日：1988-04-22
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： YASUHARA TOSHIHIRO , MASUDA MASACHIKA , MURAKAMI HAJIME , NISHI KUNIHIKO , SAKIMOTO MASAKAZU , SHIMIZU KAZUO , NAGAMINE TORU , OKADA SUMIO , HOSHI AKIRO
IPC分类号： H01L23/28 , H01L23/50
摘要： PURPOSE:To reduce separation of resin sealing part from a tab part rear face and prevent generation of cracks in the resin sealing part by providing an opening in the central part of the tab part. CONSTITUTION:At the central part of a tab part 11 of a resin sealed type semiconductor device is provided an opening 11a to check cutting of resin and separation of resin from the rear face of a tab part 11, and at the surface of the tab part 11 where the opening 11A is provided is provided a groove part 11C to check flow-out of adhesive 1 from the surface of the tab part 11. Also, at the central part of the long side of the tab part 11 are provided tab suspending leads 14A-14F to check cutting of the resin and separation of the resin from the rear face of the tab part 11. Hereby, separation of a resin sealing part 4 from the rear face of the tab part 11 is reduced and generation of cracks is prevented.

2. 发明专利

JPH06325109A SYSTEM AND METHOD FOR EVALUATING PRODUCT DESIGN SPECIFICATION 失效
公开(公告)号：JPH06325109A
公开(公告)日：1994-11-25
申请号：JP22905493
申请日：1993-09-14
申请人： HITACHI LTD
发明人： SUGINO KAZUHIRO , NISHIKAWA HIROKO , CHISAKI TAKAO , NISHI KUNIHIKO , YASUHARA TOSHIHIRO
IPC分类号： G06F17/50 , G06F19/00 , H01L21/02 , G06F15/60 , G06F15/20
摘要： PURPOSE:To generate relation among defective phenomena of past trial products, evaluation items at the time of an analysis of a product, and various elements of respective designs of the product and to evaluate and optimize a design specification plan for a new product on the basis of the relation. CONSTITUTION:A trial product data management part 24 has data including design specification defect information on existent trial products and a design knowledge management part 25 has respective analytic programs for the evaluation items. Feature quantities of a product shape and material are extracted from the design specification plan for the new product, data having feature quantities similar to the extracted feature quantities are take out of the trial product data management part 24, and a defect causal relation generation part 26 generates the relation (causal relation) among three elements, i.e., the defect phenomena, evaluation items, and various design elements. On the basis of the defect causal relation, an evaluation order generation part 28 generates the order of the evaluation items to be evaluated. In this order, the evaluation items are analyzed by a simulation program stored in the design knowledge management part 25 and a design plan evaluation part 42 decides whether or not the values of various design elements of the inputted product design specification plan need to be corrected on the basis of the analysis results.

3. 发明专利

JPH0236542A SEMICONDUCTOR DEVICE AND ITS MANUFACTURE 失效
公开(公告)号：JPH0236542A
公开(公告)日：1990-02-06
申请号：JP18717988
申请日：1988-07-26
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： TSUBOSAKI KUNIHIRO , ICHITANI MASAHIRO , YASUHARA TOSHIHIRO , SUZUMURA TAKASHI , ONDA MAMORU , MORINAGA TAKASHI , NOMURA YOSHIHIRO
IPC分类号： B29C65/52 , B29L31/00 , C09J5/00 , H01L21/52 , H01L23/29 , H01L23/31 , H01L23/50
摘要： PURPOSE:To improve the electrical reliability of a semiconductor device by a method wherein a polyether amide or polyether amide-imide layer, whose glass-transition temperature is of a range of 170-260 [ deg.C], is provided on the surface of a side, where is adhered to inner leads, of an insulative resin film layer as an adhesion layer. CONSTITUTION:A polyether amide or polyether amide-imide layer, whose glass- transition temperature is of a range of 170-260 [ deg.C], is provided between an insulative resin film layer 3B and inner leads 2A as an adhesion layer 3A (An insulating film of a two-layer structure, which is formed of the layers 3B and 3A, is adhered on the surface of the leads 2A.). Thereby, the adhesive strength of each of the leads 2A and a resin sealing material 6 with the polyether amide of polyether amide-imide layer is improved, tie peeling of the adhesive interface between the leads 2A and the layer or the material 6 and the layer can be prevented and water can be prevented from being bedewing on its peeled part. As a result, the leak of a current between the leads 2A can be reduced.

4. 发明专利

JPS6480053A RESIN SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6480053A
公开(公告)日：1989-03-24
申请号：JP23590587
申请日：1987-09-19
申请人： HITACHI LTD
发明人： YASUHARA TOSHIHIRO , MURAKAMI HAJIME
IPC分类号： H01L23/50 , H01L23/28
摘要： PURPOSE:To mount a tab so as not to rotate when resin flows in, by arranging leads for suspending the tab which slip from center positions of respective shorter sides on the shorter sides which are facing in the rectangular tab. CONSTITUTION:A 4M bit DRAM semiconductor chip 20 is equipped on the surface of a tab 11 through adhesives. External terminals 24 of the semiconductor chip 20 are connected to inner leads 12 through bonding wires 3. The tab 11 allows the leads l4C-F for suspending its tab to be arranged in the vicinity of center of its longer sides and also the leads 14A and B for suspending the tab to be arranged at positions which slip from the center of its shorter sides. The leads 14A and B for suspending the tab are formed each other at the positions of point symmetry with respect to the center of the tab 11. Resin for sealing 4 is injected from an inflow port 4A which is prepared on one shorter side. Since the tab 11 does not rotate when resin flows in, this system prevents the shortcircuit and disconnection of bonding wires.

5. 发明专利

JPH05190733A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH05190733A
公开(公告)日：1993-07-30
申请号：JP13466692
申请日：1992-05-27
申请人： HITACHI LTD
发明人： YOSHIDA ISAMU , SAEKI JUNICHI , TSUNODA SHIGEHARU , NISHI KUNIHIKO , ANJO ICHIRO , IMURA KENICHI , YASUHARA TOSHIHIRO , ARITA JUNICHI , SUGINO KAZUHIRO
IPC分类号： B29C45/02 , B29C45/26 , B29L31/34 , H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To provide a technique which can encapsulate a semiconductor device particularly when the thickness of resin above and below an insert cannot be made substantially equal. CONSTITUTION:An encapsulation technique is achieved by disposing a raised matter 7 with its width wider than or equal to a gate on a gate side of a semiconductor device so that the filling of a molding resin can be controlled and substantially rendered even when the thickness of the molding resin above and below an insert (such as a semiconductor device 1 and a lead 2) cannot be made equal. Therefore, this technique is advantageous in that when the upper and lower thickness of the molding resin above and below the insert in the device cannot be made substantially equal, the filling conditions of the molding resin can be made substantially equal, and the movement of the insert and also molding failures such as through voids can be prevented.

6. 发明专利

JPH05152495A SEMICONDUCTOR DEVICES 失效
公开(公告)号：JPH05152495A
公开(公告)日：1993-06-18
申请号：JP31078391
申请日：1991-11-26
申请人： HITACHI LTD
发明人： YASUHARA TOSHIHIRO , NISHI KUNIHIKO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent disconnection during packaging or package failure in a surface mount type semiconductor device. CONSTITUTION:In a resin sealed type semiconductor device 1 where a plurality of outer leads 3B electrically connected to an outer terminal 2a of a semiconductor pellet 2 are laid out at least in a part of area around the outside of a resin sealing body 6 which seals the semiconductor pellet 2, the height dimension h1 of the lead is adapted to be larger than the thickness dimension h2 which meets the height direction of the resin sealing body 6 where the height dimension h1 covers the distance between the lead mount bottom which mounts the lead when mounting the outer lead 3B on one end and the boarder to the resin sealing body 6 on the other end.

7. 发明专利

JPH0595014A FORMATION METHOD OF SEALING BODY 失效
公开(公告)号：JPH0595014A
公开(公告)日：1993-04-16
申请号：JP25532591
申请日：1991-10-02
申请人： HITACHI LTD
发明人： YASUHARA TOSHIHIRO , NISHI KUNIHIKO , KOIZUMI KOJI
IPC分类号： H01L21/56 , B29C33/12 , B29C45/02 , B29C45/14 , B29C45/26 , B29L31/34
摘要： PURPOSE:To enhance the yield of a semiconductor device which is sealed with a sealing body in the formation method of the sealing body. CONSTITUTION:In the formation method of a sealing body, a resin film 1 to which a semiconductor pellet 3 has been fixed and bonded by means of leads 2 is held by an upper mold 5 and a lower mold 6 which constitute a cavity 4, a resin 10 is injected into the cavity 4 and the sealing body which seals one part of the resin are sealed film 1 and the semiconductor pellet 3 are sealed. In the formation method, the rear surface of the semiconductor pellet 3 is supported by a support pin 8 which is movable so as to correspond to the pressure of the resin 10. Consequently, even when the pressure of the resin 10 is exerted on the semiconductor pellet 3 and the resin film 1, it is possible to prevent the resin film 1 form being deformed because the semiconductor pellet 3 is supported by the support pin 8.

8. 发明专利

JPH0236557A LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JPH0236557A
公开(公告)日：1990-02-06
申请号：JP18564388
申请日：1988-07-27
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU , YASUHARA TOSHIHIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent the deformation of a tab and the local variability of a plate thickness, to improve the adhesive force of the tab with a resin and to make possible the improvement of the reflow crack resistance of a resin-sealed semiconductor device by a method wherein a step is provided along the peripheral edge part of a through-hole, which is formed in part of the tab to mount a semiconductor chip on it, and notch grooves are formed in part of the step. CONSTITUTION:A lead frame 1 is constituted of a rectangular tab 3, on which a chip 2 is mounted, a rectangular dam 4 surrounding the tab 3, tab suspension leads 5 to couple the tab 3 with the dam 4 at both end parts of the tab 3, a plurality of leads 6 arranged radially on the periphery of the tab 3 and a rectangular frame consisting of outer and inner frame parts 7 and 8 surrounding these leads 6. A nearly rectangular through-hole 11 is formed in the central part of the tab 3 and notch grooves 12 are each formed at the 4 corners of the hole 11. Moreover, such a step 13 as the opening area of the surface (die pad) of the tab 3 becomes wider than that of the rear of the tab 3 is provided along the peripheral edge part of the hole 11 in the hole 11.

9. 发明专利

JP2533475B2 失效
公开(公告)号：JP2533475B2
公开(公告)日：1996-09-11
申请号：JP8245885
申请日：1985-04-19
申请人： HITACHI LTD
发明人： YASUHARA TOSHIHIRO , WAKASHIMA YOSHIAKI
IPC分类号： H01L23/50 , H01L21/56 , H01L21/66 , H01L23/48

10. 发明专利

JPH0254957A SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH0254957A
公开(公告)日：1990-02-23
申请号：JP20593088
申请日：1988-08-19
申请人： HITACHI LTD
发明人： YASUHARA TOSHIHIRO , MASUDA MASACHIKA
IPC分类号： H01L21/56 , H01L23/28 , H01L23/50
摘要： PURPOSE:To increase bonding strength between leads and a package by placing a semiconductor pellet having wire bonding parts at its both sides on an insulating sheet and disposing a plurality of leads at the below side of the above sheet and then, making slender through holes at inner lead parts communicating with the lead when the leads are bent. CONSTITUTION:A semiconductor pellet 14 on which wire bonding parts 9A and 9B are mounted at both end parts is placed on an insulating sheet 11 and pointed ends of a plurality of leads 6 and 7 which pass through below the sheet 14 are located on the bonding parts 9A and 9B and they are connected each other by using bonding wires 15. In this configuration, the leads 6 and 7 are bent at right angles at end parts of a resin package 16 which supports the leads and further, a slender, long through holes 10 are made at inner leads 8 of the leads communicating with respective bent parts. In this way, when the leads 6 and 7 are buried into the package 16, the through holes 10 which are made in the inner leads 8 having broad widths make bonding strength strong and no cracks develop in the package 16.

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