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1. 发明专利

JPH02271641A MANUFACTURE OF SEMICONDUCTOR DEVICE AND MOLD DIE AS WELL AS LEAD FRAME 失效
公开(公告)号：JPH02271641A
公开(公告)日：1990-11-06
申请号：JP9420489
申请日：1989-04-13
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU , TABATA KATSUHIRO , MASUDA MASACHIKA , SAEKI JUNICHI
IPC分类号： H01L21/56
摘要： PURPOSE:To enable a package with less voids to be formed and to improve moisture resistance and crack resistance by taking a fluid tip part which includes a large amount of air bubbles into a trap cavity and by filling resin with less air bubbles into the cavity. CONSTITUTION:In the case of transfer mold, a tip part 13 of a fluid resin 10 passes through a cavity 9 and is guided to a trap cavity 12 by a resin lead-in channel 11. In general, air is easily wound around the fluid tip part 13 of the resin 10 and a large amount of voids 14 are included. Thus, the resin part 10 including the void 14 passes without stagnating within a cavity 9 and is ejected from the cavity 9, thus enabling a package without void to be manufactured and improving product quality.

2. 发明专利

JP2002057244A SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR 失效
公开(公告)号：JP2002057244A
公开(公告)日：2002-02-22
申请号：JP2000242237
申请日：2000-08-10
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU , OGASAWARA KAZUTO , AZUMA JUNYA , SHINTANI TOSHIYUKI , ASARI TADASHI
IPC分类号： H01L23/12 , H01L23/50
摘要： PROBLEM TO BE SOLVED: To improve a mounting quality in a peripheral type semiconductor device and to prevent its leads from dropping out of it. SOLUTION: The peripheral type semiconductor device comprises a sealing portion 3 formed to seal therein a semiconductor chip 2 with resin; a tab 1b for supporting thereon the semiconductor chip 2; a plurality of leads 1a; and wires 4 by each of which each pad of the semiconductor chip 2 and each correspondent lead 1a thereto are connected, with each lead 1a having each connected portion 1g arranged in line with other connected portions 1g on the peripheral edge portion of a rear surface 3a of the sealing portion 3 and exposed to the external and having each bent portion 1h bent from each connected portion 1g, to provide it extendedly from on the end portion of the rear surface 3a of the sealing portion 3 to on each side surface 3b of the sealing portion 3. Further, each solder fillet 11 is formed high, when mounting a QFN as to improve the mounting quality of the QFN and as to prevent each lead 1a from dropping out of the sealing portion 3, by providing in each lead 1a respective bent portion 1h bent from each connected portion 1g toward the upper side of the sealing portion 3, and by extendedly providing each bent portion 1h from on the end portion of the rear surface 3a of the sealing portion 3 to on its side surface 3b.

3. 发明专利

JPH0864726A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0864726A
公开(公告)日：1996-03-08
申请号：JP19511994
申请日：1994-08-19
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： HAYASE YUKIHIRO , SAKANO MASAKAZU
IPC分类号： H01L23/29 , H01L23/31
摘要： PURPOSE: To provide a semiconductor device with which a light outside a package is effectively cut off while the small thickness of the package and the mechanical strength of a chip are maintained. CONSTITUTION: A semiconductor chip 2 of a semiconductor memory device, for instance a static random access memory (SRAM), is mounted on a semiconductor device 1. The electrode pads of the semiconductor chip are electrically connected to inner leads 8 with wires 6. For instance gold wires are used as the wires 6. In order to meet the requirements of TSOP which is a thin package, the wires are formed into low loop forms. On the top surface of the package 4 of the semiconductor device 1, a light shielding layer 5 is formed by coating. For instance paint containing carbon is applied to form the light shielding layer 5.

4. 发明专利

JPH03242975A SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE SAME 失效
公开(公告)号：JPH03242975A
公开(公告)日：1991-10-29
申请号：JP3824190
申请日：1990-02-21
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU , KASUGA TAKAHIRO
IPC分类号： H01L21/822 , H01L27/04 , H01L27/15
摘要： PURPOSE:To perform elimination of a delay of information to be transmitted by a wiring resistance by storing an outer signal such as an electric signal or an optical signal, etc., in a semiconductor chip, or calculating and arbitrarily outputting the information as the optical signal. CONSTITUTION:An internal circuit 2 and an electrode pad 3 are formed on a semiconductor chip 1, a memory is provided in the circuit 2, and formed of a writable/readable volatile memory 4A and a nonvolatile memory 4B. An outer signal is transmitted from a lead 15 to the pad 3, once stocked in the memory 4B, processed by a calculating processor 5, a drive unit 6 transmits a drive signal 19 to a light emitting unit 7 based on an instruction signal, and the unit 7 feeds a forward current in response to the signal 19. The light emitted from an active region 12 is grown to a laser having a wavelength determined by the reflecting surface while it is reciprocated between the two reflecting surfaces of a P-type layer 13 and an N-type layer 14, and output as an optical signal out of a package. Thus, a delay of signal transmission to the exterior is eliminated, and the number of output pins can be reduced.

5. 发明专利

JPH01170034A LEAD FRAME AND SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01170034A
公开(公告)日：1989-07-05
申请号：JP32708987
申请日：1987-12-25
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR , HITACHI VLSI ENG
发明人： SAKANO MASAKAZU , WADA TAMAKI , MASUDA MASACHIKA
IPC分类号： H01L21/56 , H01L23/50
摘要： PURPOSE:To prevent bonding wires from deforming by a method wherein the loop direction of the bonding wires abuts against the resin flow interface making an orthogonal or almost orthogonal angle with said interface in case of pouring resin. CONSTITUTION:The end parts of inner leads 21a-21h are bent in the reverse direction to the gate side while the second bonding point is located on a position more antigate side than a pad 19 as the first bonding point so that the loop direction of the bonding wires 22a-22h may abut against the resin flow interface Re making an orthogonal or almost orthogonal angle with the interface Re. Through these procedures, the bonding wires 22 abut against the resin flow interface Re in case of pouring resin (b) making an orthogonal angle with the interface Re so that the stress in case the resin flow interface Re abuts against the bonding wires 22 may be decreased to prevent the bonding wires from deforming.

6. 发明专利

JPH0837275A SEMICONDUCTOR DEVICE, TRANSFER METHOD, CHECK METHOD, AND MOUNTING METHOD THEREOF 失效
公开(公告)号：JPH0837275A
公开(公告)日：1996-02-06
申请号：JP17384694
申请日：1994-07-26
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： MAEDA TAKESHI , SAKANO MASAKAZU
IPC分类号： H05K13/04 , H01L23/50 , H05K3/30 , H05K3/34
摘要： PURPOSE:To provide a semiconductor device and a manufacturing and mounting technique thereof, wherein leads can be easily protected against bend caused by a mechanical stress which acts directly on them in a transfer process or a selection process. CONSTITUTION:An insulating tape 3 of organic material such as polyimide resin is fitted to the underside of a semiconductor device 1. Cutouts 4 are provided to the periphery of the insulating tape 3 corresponding to external lead-out leads 2. The insulating tape 3 is provided to the underside of a semiconductor device making the external lead-out leads 2 fitted in the cutouts 4. As mentioned above, an insulating tape provided with cutouts corresponding to the tips of outer lead-out leads is provided to the underside of a sealed body, whereby the outer lead-out leads are fixed in a lateral direction as the leads are fitted in the cutouts provided to the tape. Therefore, leads are protected against bend caused by an external force.

7. 发明专利

JPH06260589A RESIN SEALED SEMICONDUCTOR DEVICE AND ITS MANUFACTURE AND ITS PACKAGING METHOD 失效
公开(公告)号：JPH06260589A
公开(公告)日：1994-09-16
申请号：JP4773693
申请日：1993-03-09
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU
IPC分类号： B65D85/86 , B65D85/38 , H01L23/50
摘要： PURPOSE:To prevent the reduction of interval between inner leads and the position deviation of leads in the lateral direction, and improve reliability, by forming a part for relieving the stress caused by thermal contraction, on a tape member for fixing inner lead. CONSTITUTION:On the single surfaces of a plurality of inner leads 4 of a plastic molded type semiconductor device, an insulative tape member 8 in which a plurality of slits are formed is stuck in the directions nearly perpendicular to the stretching directions of the inner leads 4. Since the slits are formed in the tape member, the stress caused by thermal contraction is relaxed and the stress applied to the inner leads on which the tape member is stuck is decreased. Hence the reduction of interval between the inner leads and the position deviation of leads in the lateral direction can be prevented. Since the tape member engages with sealing resin in the slit parts, the adhesion is improved, and exfoliation and package crack can be prevented.

8. 发明专利

JPH0236557A LEAD FRAME AND SEMICONDUCTOR DEVICE USING SAME 失效
公开(公告)号：JPH0236557A
公开(公告)日：1990-02-06
申请号：JP18564388
申请日：1988-07-27
申请人： HITACHI LTD , HITACHI HOKKAI SEMICONDUCTOR
发明人： SAKANO MASAKAZU , YASUHARA TOSHIHIRO
IPC分类号： H01L23/50
摘要： PURPOSE:To prevent the deformation of a tab and the local variability of a plate thickness, to improve the adhesive force of the tab with a resin and to make possible the improvement of the reflow crack resistance of a resin-sealed semiconductor device by a method wherein a step is provided along the peripheral edge part of a through-hole, which is formed in part of the tab to mount a semiconductor chip on it, and notch grooves are formed in part of the step. CONSTITUTION:A lead frame 1 is constituted of a rectangular tab 3, on which a chip 2 is mounted, a rectangular dam 4 surrounding the tab 3, tab suspension leads 5 to couple the tab 3 with the dam 4 at both end parts of the tab 3, a plurality of leads 6 arranged radially on the periphery of the tab 3 and a rectangular frame consisting of outer and inner frame parts 7 and 8 surrounding these leads 6. A nearly rectangular through-hole 11 is formed in the central part of the tab 3 and notch grooves 12 are each formed at the 4 corners of the hole 11. Moreover, such a step 13 as the opening area of the surface (die pad) of the tab 3 becomes wider than that of the rear of the tab 3 is provided along the peripheral edge part of the hole 11 in the hole 11.

9. 发明专利

JP2003133502A SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE 审中-公开
公开(公告)号：JP2003133502A
公开(公告)日：2003-05-09
申请号：JP2001329545
申请日：2001-10-26
申请人： HITACHI LTD , NORTHERN JAPAN SEMICONDUCTOR T
发明人： SAKANO MASAKAZU , KENJO SHIGERU
IPC分类号： H01L23/50
摘要： PROBLEM TO BE SOLVED: To attain a thin semiconductor device suppressing costs. SOLUTION: The semiconductor device comprises a semiconductor chip 2 formed with a plurality of pads on a principal plane 2b, a plurality of leads 1a disposed around the chip 2 each corresponding to four sides thereof, a tab 1b which is bonded to the principal plane 2b through a double-sided adhesive tape 6 with the pads of the chip 2 being exposed, wires 4 which are disposed at the outer periphery of the tab 1b and connect the pads on the chip 2 with the leads 1a, respectively, and a sealing body 3 for sealing the chip 2, the plurality of wires 4 and the tab 1b. Loops of the wires 4 are formed on the circumferential side of the tab 1b. Thus, with the arrangement of the tab 1b on the chip 2 and with the formation of the loops of wires 4 at the side of the tab 1b, the thickness of the tab 1b and the height of the wires 4 are made offset with each other, to obtain the thin and non-lead type semiconductor device.

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