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    • 3. 发明专利
    • CASSETTE JIG FOR ACCOMMODATING BOARDS
    • JPH07307320A
    • 1995-11-21
    • JP9717594
    • 1994-05-11
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • UESAWA KOUZOU
    • B65D85/86B65G49/07H01L21/304H01L21/673H01L21/68H05K3/26
    • PURPOSE:To prevent re-adhesion of cleaning fluid to a substrate surface, by installing an introduction part member which comes into contact with the lowermost part at the time of accommodating a substrate, and has inclination facing downward further than the lowermost part of the substrate, between ''the lowermost part and the region led out to the outside of the substrate arrangement. CONSTITUTION:In a frame body 2, an introduction part member 3 is installed which comes into contact with a region 4A which turns to the lowermost part of a wafer when a semiconductor wafer 4 is accommodated in each accommodation trench 2B. The introduction part member 3 has a contact region 3A coming into contact with the lowermost region 4A, and an inclination on the rear 3B facing the contact region 3A. The inclination on the rear 3B faces from the arrangement region of semiconductor wafers 4 (arrangement region of the accommodation trenches 2B) toward a vacant region 2A constituted on the initial stage side or the final stage side of the arrangement region of the semiconductor wafers 4, and is constituted in a region facing downward further than the lowermost region 4A of each of the semiconductor wafers 4.