会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明专利
    • MULTI-CONNECTION LINE CONTROL SYSTEM
    • JPH04150634A
    • 1992-05-25
    • JP27333090
    • 1990-10-15
    • HITACHI LTDHITACHI MICROCUMPUTER ENG
    • MOTOKI YOSHIKOMORITA TAKASHIWADA KOJISUKEGAWA FUMIOSUGAWARA TAKASHI
    • H04L12/28
    • PURPOSE:To allow the system to cope with revision or movement of each terminal equipment with modification of inside of an intermediate connection function only by using the intermediate connection function accommodating one each of lines at a center equipment and a terminal equipment and managing connection centralizingly so as to attain multi-connection. CONSTITUTION:The system consists of a host CPU 1, a host CPU use line controller 2, transmission lines 21,22,90-93, line accommodation equipments 30,31,50-53, connector 4, 60-63, terminal equipments 70-73 and a connection controller 8. A center equipment sends a same data in a broadcast way to each of terminal equipments in multi-connection, while the communication from each of the terminal equipments to the center equipment is implemented by allowing a terminal equipment sending a transmission request to occupy a transmission line from the terminal equipment to the center equipment based on the intermediate connection function or a detection function for a transmission request provided around the intermediate connection function. Thus, any wiring work is not required for the movement or replacement of a terminal equipment.
    • 10. 发明专利
    • Manufacture of solid-state image pickup device
    • 固态图像拾取器件的制造
    • JPS58218166A
    • 1983-12-19
    • JP10071282
    • 1982-06-14
    • Hitachi Ltd
    • TSUJITA YOSHIYUKISUGAWARA TAKASHIEZAWA MASAYOSHIIZUMI AKIYAKADOWAKI MASAHIKO
    • H01L21/50H01L23/02H01L27/14H01L31/02H04N5/335
    • H01L21/50H01L2224/48091H01L2224/48227H01L2924/00014
    • PURPOSE:To obtain a seal by fusing the solder located on a seal part by a method wherein an annular lead wire is arranged on the outer side of the seal part, and a high frequency current is applied to said level wire, thereby enabling to locally heat up the sealed part alone. CONSTITUTION:After the entire solid-state image pickup device has been heated up to 150 deg.C before a sealing is performed in a heating furnace in a nitrogen atmosphere, an annular copper tube 22 of 3mm. in outside diameter and 2mm. in inside diameter is attached in such a manner that it makes two rounds of the part which is 3mm. distance from the sealed part. Subsequently, 3kV high frequency wave of 400kHz in frequency is applied to both terminals of the annular copper tube 22 for 90sec. The temperature of the solder (tin 63% and lead 37%) on the sealed part comes up to 230 deg.C in 60sec after application of high frequency waves, then the temperature is maintained constant, and the solder 17 is fused. After the application of high frequency waves has been finished, the solder is hardened in the cooling process, thereby enabling to obtain a complete airtight sealing by the solder 17.
    • 目的:通过在密封部分的外侧设置环形引线并将高频电流施加到所述电平线的方法,通过将位于密封部分上的焊料熔化来获得密封,从而能够局部地 单独加热密封件。 构成:在氮气气氛中的加热炉中进行密封之前,将整个固态摄像装置加热至150℃,将环形铜管22设置为3mm。 外径2mm。 内径以这样的方式安装,使得它的两轮的部分为3mm。 距密封件的距离。 随后,对环形铜管22的两端施加频率为400kHz的3kV高频90秒。 施加高频后,密封部分的焊料温度(锡63%,导线37%)在60秒内达到230℃,保持恒定,焊料17熔融。 在施加高频波后,焊料在冷却过程中硬化,从而能够通过焊料17获得完整的气密密封。