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1. 发明专利

JPH08279670A SURFACE MOUNT STRUCTURE OF ELECTRONIC COMPONENT 失效
公开(公告)号：JPH08279670A
公开(公告)日：1996-10-22
申请号：JP8228895
申请日：1995-04-07
申请人： HITACHI LTD
发明人： WATANABE HIDEKI , IMAI TSUTOMU , YAMAGUCHI TAKESHI , NEZU TOSHITADA , KASAI KENICHI , IMAHASHI FUMIO , EZAKI SATORU , SHIRAI MITSUGI
IPC分类号： H05K1/18 , H05K1/11 , H05K3/34 , H05K3/40
摘要： PURPOSE: To provide a surface mount structure wherein a package, a component, etc., which can be obtained in a general market at a low cost can be used, and the connection reliability is excellent. CONSTITUTION: Connection holes 14 having bottoms are arranged at positions facing connection pins 12 of the upper part of a wiring board 15 and filled with solder 13. Tip parts of the connection pins 12 are engaged with the connection holes 14, the tip parts of the connection pins 12 are connected with the connection holes 14 with solder 13, and an electronic component 11 is surface- mounted on the wiring board 15 in the state that the main body parts of the connection pins 12 are exposed.

2. 发明专利

JPH08274224A SEALED COOLING STRUCTURE OF MULTICHIP MODULE 失效
公开(公告)号：JPH08274224A
公开(公告)日：1996-10-18
申请号：JP7858495
申请日：1995-04-04
申请人： HITACHI LTD
发明人： WATANABE HIDEKI , KASAI KENICHI , NEZU TOSHITADA , HIDAKA HIROYUKI , YAMADA OSAMU , TAMURA MITSUNORI
IPC分类号： H01L23/36 , H01L23/433 , H01L23/473
摘要： PURPOSE: To provide a sealed cooling structure of a multichip module excellent in high density mounting, high sealed connection reliability, low manufacturing cost and high cooling performance. CONSTITUTION: One side surface of a frame 15 which is matched with the thermal expansion coefficient of a wiring board 11 is connected with a surface of the wiring board 11 with solder on which surface a semiconductor device 12 is mounted. The other side surface is fixed on a lid member 17 which serves as a heat sink above the wiring board 11, through a packing 19, by using bolt fastening 10 or a means wherein total heating is not used.

3. 发明专利

JPH07160571A MEMORY CYCLE SWITCHING CONTROL METHOD AND INFORMATION PROCESSOR WITH MEMORY CYCLE SWITCHING FUNCTION 失效
公开(公告)号：JPH07160571A
公开(公告)日：1995-06-23
申请号：JP30254593
申请日：1993-12-02
申请人： HITACHI LTD , HITACHI ASAHI ELECTRON KK , HITACHI CHUBU SOFTWARE KK
发明人： FUKUDA YUICHI , TOMA TAKASHI , HAYASHI SHUICHI , MIZUTANI KOJI , NITTA JIRO , WATANABE HIDEKI , SASAKI MASATOMI
IPC分类号： G06F12/00
摘要： PURPOSE:To supply a memory cycle optimum for each operating frequency by deciding the switching of insertion and deletion for the certain stage of a sequencer circuit which controls the memory cycle from the preset value of a register. CONSTITUTION:When the power source of this processor is applied, software 17 sets a memory cycle switching register 21 in an ordinary mode, and starts an operation at the memory cycle optimum for the ordinary mode. At this time, the software 17 always monitors the presence/absence of an input signal 18 from an input device 15 such as a keyboard and a mouse, etc. When no input signal 18 is inputted for continuous fixed time, the software 17 sets the memory cycle switching register 21 in a low frequency mode, and switches the operating frequency to the low frequency mode. Furthermore, when the software 17 detects the input signal 18, the software 17 sets the memory cycle switching register 21 in the ordinary mode from the low frequency mode, and switches an operating frequency mode to the ordinary mode.

4. 发明专利

JPH06266480A POWER SUPPLY CONTROL METHOD 失效
公开(公告)号：JPH06266480A
公开(公告)日：1994-09-22
申请号：JP5552193
申请日：1993-03-16
申请人： HITACHI LTD , HITACHI CHUBU SOFTWARE KK , HITACHI ASAHI ELECTRON KK
发明人： SHIN YOSHIFUMI , MATSUI ISAMU , TOMA TAKASHI , YOSHITOMI TAKASHI , ONISHI KENJI , HAYASHI SHUICHI , FUKUDA YUICHI , MIURA YUICHI , WATANABE HIDEKI , MIYAKE HIDEAKI
IPC分类号： G06F1/32 , G06F1/04
摘要： PURPOSE:To provide the power control method which reduces the power consumption of an electronic apparatus to which a peripheral device is connected through a peripheral device control circuit and a connector. CONSTITUTION:It is detected whether a connector 10 of a peripheral device 12 is connected to a connector 9 of an information processor 1 or not; and when it is not connected, power supply to a peripheral device control circuit 3 which controls the peripheral device 12 is stopped by a switch 7, thus preventing unnecessary power consumption.

5. 发明专利

JPH0669075B2 失效
公开(公告)号：JPH0669075B2
公开(公告)日：1994-08-31
申请号：JP26854686
申请日：1986-11-13
申请人： HITACHI LTD
发明人： HIROTA KAZUO , WATANABE HIDEKI
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/28

6. 发明专利

JPH0556862B2 失效
公开(公告)号：JPH0556862B2
公开(公告)日：1993-08-20
申请号：JP26854586
申请日：1986-11-13
申请人： HITACHI LTD
发明人： HIROTA KAZUO , WATANABE HIDEKI
IPC分类号： H01L23/52 , H01L21/60 , H01L23/538 , H01L25/04 , H01L25/18

7. 发明专利

JPH01184558A DATA STORING SYSTEM 失效
公开(公告)号：JPH01184558A
公开(公告)日：1989-07-24
申请号：JP834588
申请日：1988-01-20
申请人： HITACHI LTD , HITACHI ENG CO LTD
发明人： WATANABE HIDEKI
IPC分类号： G06F12/06 , G06F12/04
摘要： PURPOSE:To effectively use a storage area and to simplify the structure of the storage area with hierarchical storage content by performing hierarchical addressing by dividing the storage area into blocks with constant length and allocating the storage content to required blocks. CONSTITUTION:A managing block 1 is related to each other by the leading block and the final block of a component block 2 and an address, and the component blocks 2 are related to each other by a front and a rear component blocks 2 and the address. And the component block 2 is related to each other by the leading block and the final block of an element block 3 storing element data which constitutes the said component and the address, and the element blocks 3 are related to each other by a front and a rear element blocks 3 and the address.

8. 发明专利

JPS63124425A SEMIOONDUCTOR DEVICE 失效
公开(公告)号：JPS63124425A
公开(公告)日：1988-05-27
申请号：JP26854686
申请日：1986-11-13
申请人： HITACHI LTD
发明人： HIROTA KAZUO , WATANABE HIDEKI
IPC分类号： H01L21/52 , H01L21/56 , H01L21/60 , H01L23/28
摘要： PURPOSE:To prevent the exfoliation of resin containing powdered particle substance from a base substrate, by removing a thin-film multilayer part on the outermost edge part and by bonding the resin containing the powdered particle substance directly on the base substrate. CONSTITUTION:A part (outermost edge part) of a thin-film multilayer part 5 provided on a base substrate 2 and connected to LSI 1 by a solder 4 is removed, an area 2a on the substrate 2 wherefrom the part is removed is exposed, and then resin 3 containing powdered particle substance for enveloping LSI 1 is bonded directly on the exposed area on the substrate 2. By this constitution, the bonding strength of the resin against a stress generated from a difference in thermal expansion between the resin 3 and the substrate 2 is made to be larger than that of the multilayer part 5. As the result, the exfoliation of the resin 3 from the substrate 2 can be prevented.

9. 发明专利

JPS63107056A MULTILAYER INTERCONNECTION SUBSTRATE 失效
公开(公告)号：JPS63107056A
公开(公告)日：1988-05-12
申请号：JP25665387
申请日：1987-10-12
申请人： HITACHI LTD , HITACHI MICROCUMPUTER ENG
发明人： WATANABE HIDEKI , TAKENAKA TAKATSUGU , IMADA HARUHIKO
IPC分类号： H01L23/538 , H01L23/52 , H01L23/522 , H05K3/46
摘要： PURPOSE:To make technical change such as all kinds of wiring change possible in a manner in which interchangeability with the wiring medium of higher rank is kept, by providing a first main surface on which electric parts are mounted with an EC pad for electric parts and a floating pad, and providing a second main surface on which input-output pins are arranged with the EC pad for the input-output pins and the floating pad. CONSTITUTION:On a first main surface 12 of an multilayer interconnection substrate 100, a plurality of electric parts are mounted, and a second main surface 12' is provided with a plurality of input-output pins 8. A technical change EC pad 3 for electric parts and a floating pad 5 are arranged on the first main surface 12 of the substrate 100, and the EC pad 3 and the floating pad 5' for the input-output pins are arranged on the second main surface 12'. A means 6 connect electrically the flooting pad 5 on the first main surface 12 and the flooting pad 5' on the second main surface 12' is provided. For example, when a wiring net work on the substrate 100 is broken at a part 11, the pattern of the pad 3 is cut in pieces at a part 11, and the tip part 13 of a piece and the floating pad 5 are connected with a discrete wire 4. A terminal 8 is cut off from a pad 9 at a part 7', and this separated pad 3' and a floating pad 5' are connected with a discrete wire 4'.

10. 发明专利

JPS60143653A SEALING AND COOLING MECHANISM OF PACKAGE 失效
公开(公告)号：JPS60143653A
公开(公告)日：1985-07-29
申请号：JP24765383
申请日：1983-12-30
申请人： HITACHI LTD
发明人： WATANABE HIDEKI , KOBAYASHI FUMIYUKI , OOGURO TAKAHIRO
IPC分类号： H01L23/473 , H01L23/02 , H01L23/04 , H01L23/34 , H01L23/433
摘要： PURPOSE:To miniatuarize a part for sealing and impart a high cooling performance by sticking a cap comprising a thermal expansion coefficient which is equal to that of a substrate on which semiconductor devices are mounted or is almost accordant with that and consisting of a material of high heat conductivity to said substrate. CONSTITUTION:Plural semiconductor devices 13 are connected by solder to a surface of a substrate 11 consisting of a sintered multilayer mullite ceramic material by flip chips. A cap 12 made of silicon carbide is stuck to a substrate 11 in order to seal the semiconductor devices 13. The cap 12 is provided with a heat conduction means 14 for conducting the generated heat by the semiconductors 13 to the cap which exists between an internal surface of the cap 12 and the semiconductor devices 13 and a cooling jacket 15 as a cooling means for removing the heat collected in the cap 12. Thermal expansion coefficients of mullite ceramic and silicon carbide are 40X10 / deg.C and 35X10 / deg.C respectively and are almost equal so that there is no warpage produced in both of the substrate 11 and the cap 12 even when these are stuck.

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