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    • 3. 发明专利
    • Semiconductor integrated circuit device
    • 半导体集成电路设备
    • JP2007288204A
    • 2007-11-01
    • JP2007122227
    • 2007-05-07
    • Hitachi Ltd株式会社日立製作所
    • NAKAYAMA MICHIAKIHAMAMOTO MASATOMORI KAZUTAKAISOMURA SATORU
    • H01L21/822G01R31/26G01R31/28H01L21/8238H01L21/8244H01L27/04H01L27/092H01L27/11
    • PROBLEM TO BE SOLVED: To improve layout efficiency of a semiconductor integrated circuit device since an occupation area of a transistor for a first switch and a transistor for a second switch can be reduced. SOLUTION: An n-type well 2, in which one transistor Tp constituting a CMOS circuit is set is electrically connected with a supply voltage line Vdd through a switching transistor Tps, and a p-type well 3, in which the other transistor Tn constituting the CMOS circuit is set is electrically connected with a supply voltage line Vss through a switching transistor Tns. Thermal runaway due to leakage current can be controlled by turning off the switching transistors Tps and Tns and supplying potentials suitable for a test to the n-type well 2 and the p-type well 3 from an external unit when the semiconductor integrated circuit device is being tested. Meanwhile, the latch-up phenomenon is prevented by turning on the switching transistors Tps and Tns and setting the n-type well 2 and the p-type well 3 to the supply voltages Vdd and Vss, respectively. COPYRIGHT: (C)2008,JPO&INPIT
    • 要解决的问题:为了提高半导体集成电路器件的布局效率,因为可以减少用于第一开关的晶体管和第二开关晶体管的占用面积。 解决方案:其中设置了构成CMOS电路的一个晶体管Tp的n型阱2通过开关晶体管Tps和p型阱3与电源电压线Vdd电连接,其中另一个 构成CMOS电路的晶体管Tn通过开关晶体管Tns与电源电压线Vss电连接。 当半导体集成电路器件为半导体集成电路器件时,通过从外部单元断开开关晶体管Tps和Tns并将适合于测试的电位供给n型阱2和p型阱3,可以控制由漏电流引起的热失控 被测试。 同时,通过接通开关晶体管Tps和Tns并将n型阱2和p型阱3分别设置为电源电压Vdd和Vss来防止闩锁现象。 版权所有(C)2008,JPO&INPIT
    • 6. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH03116867A
    • 1991-05-17
    • JP25189489
    • 1989-09-29
    • HITACHI LTD
    • NAKAYAMA MICHIAKIMIYAOKA SHUICHIOGATA TAKASHIKUSUNOKI MITSUGIODAKA MASANORI
    • H01L29/73H01L21/331H01L21/82H01L21/8249H01L27/06H01L27/118
    • PURPOSE:To improve an integrated circuit device of this design in degree of integration by a method wherein a P channel MISFET is provided between the base and the emitter of a bipolar transistor of a changing path which constitutes an output stage circuit, and an N channel MISFET is provided between the base and the emitter of a bipolar transistor of a discharge path. CONSTITUTION:In a semiconductor integrated circuit device 1, where a totem pole type output stage circuit is arranged between an operating potential and a reference potential, a P channel MISFET QP, whose base, emitter, and gate are connected to the source, the drain of a bipolar transistor Tr, and a reference potential respectively, is provided between the base and the emitter of the bipolar transistor Tr which constitutes the charging path of an output stage circuit, and an N channel MISFET Qn, whose base, emitter, and gate are connected to the source, the drain of a bipolar transistor Tr, and an operating potential respectively, is provided between the base and the emitter of the bipolar transistor Tr which constitutes the discharge path of an output stage circuit. By this setup, a P channel MISFET and an N channel MISFET can be made to serve as high resistive elements respectively, so that a semiconductor integrated circuit device can be improved in degree of integration by lessening these high resistive elements in occupied area.
    • 9. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPH04130764A
    • 1992-05-01
    • JP25020690
    • 1990-09-21
    • HITACHI LTD
    • NAKAYAMA MICHIAKIMIYAOKA SHUICHIMIYAMOTO KAZUHISAODAKA MASANORIIKEDA TAKAHIDE
    • H01L21/822G11C11/401G11C11/408H01L21/76H01L21/8249H01L27/04H01L27/06H01L27/10
    • PURPOSE:To cut down the leakage current of memory array, etc., by a method wherein the semiconductor substrate of the title semiconductor integrated circuit device shall be an SOI substrate wherein an element substrate is junctioned with a structural substrate through the intermediary of an insulating layer, furthermore, the element substrate is divided into multiple islands by isolation regions. CONSTITUTION:The semiconductor substrate in the title semiconductor integrated circuit device shall be an SOI substrate wherein the P type element substrate PSUB (the second substrate) forming a circuit element is joined to a structural substrate through the intermediary of an insulating substrate comprising e.g. silicon oxide. On the other hand, the element substrate PSUB is divided into multiple islands IL1, IL2 by the isolation regions such as the U-shape isolation trenches U2, 4, etc. In such a constitution, the power supply voltage VEE1 (the first power supply voltage) in relatively high absolute value is fed to the island IL1 as the operational power supply while the other power supply voltage VEE2 (the second power supply voltage) in relatively low absolute value is fed to the island IL2 also as the operational power supply. Through these procedures, the leakage current at the memory array, etc., of Bi.CMOS type RAM can be cut down so as to stabilize the operation thereof.