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1. 发明专利

JPH0983145A CIRCUIT BOARD AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JPH0983145A
公开(公告)日：1997-03-28
申请号：JP18039696
申请日：1996-07-10
申请人： HITACHI LTD
发明人： TOGAWA HIDEO , YABUSHITA AKIRA , INOUE TAKASHI , NARIZUKA YASUNORI , SHIGI HIDETAKA , OGIWARA MAMORU , MATSUYAMA HARUHIKO , TANAKA MINORU
IPC分类号： H05K1/11 , H05K1/03 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To improve connection between a conductor on the side of a ceramic substrate and a thin film circuit by making the area of an exposed first thick film conductor pattern larger than the area of a first thin film conductor pattern where it makes contact with the first thick film conductor pattern. SOLUTION: A first conductor 2 on the surface of a first ceramic substrate 1 has a wide area such that it does not make contact with a surrounding conductor. The shape of the first conductor pattern 2 is advantageously substantially a square. Then, an insulating material 5 is formed forming a via hole, and the first conductor 2 on the ceramic substrate 1 and a thin film circuit 8 are electrically connected via the via hole. Since the first conductor pattern 2 on the side of the ceramic substrate 1 has a wide area and the size of the via hole can be made small to the limit, displacement of the first conductor pattern 2 of the ceramic substrate 1 and variations of the displacement can be allowed up to the area of the first conductor pattern 2. Then, a conductor material 11 is deposited over the entire area and is patterned into a desired shape.

2. 发明专利

JPH07321467A THICK FILM/THIN FILM MULTILAYER WIRING BOARD 失效
公开(公告)号：JPH07321467A
公开(公告)日：1995-12-08
申请号：JP11621894
申请日：1994-05-30
申请人： HITACHI LTD
发明人： SUGANO KENICHI , MATSUYAMA HARUHIKO , TANAKA MINORU
IPC分类号： H05K3/46
摘要： PURPOSE:To obtain a high density and economical thick film/thin film multilayer wiring board excellent in mass productivity in which insufficient connection due to fluctuation in the shrinkage percentage at a thick film wiring board part is prevented. CONSTITUTION:The multilayer wiring board for a module mounting an LSI comprises a thin film wiring part 10 and a thick film wiring board part 20, wherein a thick film wiring layer is connected through a thick film via 22 exposed to the surface of the board with a thin film pad 13 of a thin film wiring 11. Thick film vias 30 for alignment, used at the time of forming the thin film pads 13, are exposed while being recessed on the surface of the thick film wiring board part 20. Since the thick film and thin film patterns can be aligned relatively conveniently and economically using the thick film vias for alignment, insufficient connection of thick and thin films due to fluctuation in the shrinkage percentage of the thick film board can be prevented.

3. 发明专利

JPH0777808A ALIGNING METHOD, ALIGNER AND ALIGNING SYSTEM 失效
公开(公告)号：JPH0777808A
公开(公告)日：1995-03-20
申请号：JP22541093
申请日：1993-09-10
申请人： HITACHI LTD
发明人： YOSHIMOTO MITSUO , MIURA SHINYA , SUGANO KENICHI , MATSUYAMA HARUHIKO , YAMAZAKI TETSUYA , INOUE TAKASHI
IPC分类号： G03F7/20
摘要： PURPOSE:To form a highly accurate thin film pattern on a ceramic substrate by calculating the quantity of correcting an aligning focal point based on 1st and 2nd measured values and aligning after setting an aligning focus on a position including the correction quantity. CONSTITUTION:The system is constituted of a flatness measuring machine 1 for measuring a three-dimensional coordinate from a reference point on an optional point of the ceramic and transferring data to an arithmetic processing and storing device 2, an arithmetic processing and storing device 2 for storing the data transmitted from the flatness measuring machine 1 and an aligner 3, executing a calculation processing and transferring the data to the aligner 3 and the aligner 3. By such a constitution, the flatness of a desired point on the substrate is measured, and the 1st measured value is stored, the flatness on a part of the desired point on the substrate in the aligning position is measured so as to obtain the 2nd measured value, then, the quantity of correcting the aligning focal position is calculated based on the 1st and 2nd measured values, the aligning focus is set on the position including the correction quantity, thereafter, the alignment is executed.

4. 发明专利

JPH05190413A FORMATION METHOD OF PHOTOSENSITIVE RESIN FILM AND THIN-FILM MULTILAYER WIRING BOARD 失效
公开(公告)号：JPH05190413A
公开(公告)日：1993-07-30
申请号：JP425492
申请日：1992-01-14
申请人： HITACHI LTD
发明人： NISHIKAME MASASHI , MATSUYAMA HARUHIKO , YOSHIMOTO MITSUO , SHIGI HIDETAKA , YUUKI YOSHIFUMI , SUGANO KENICHI
IPC分类号： H01L21/027 , G03F1/54 , H01L23/12 , H05K3/00 , H05K3/46
摘要： PURPOSE:To provide the formation method, of a photosensitive resin, wherein the pattern working accuracy of the photosensitive resin and the residual rate of a film can be made good by one exposure operation and to provide a thin- film multilayer wiring board wherein the formation method of the photosensitive resin is used and the connecting reliability of a through hole part is high. CONSTITUTION:A device which is composed of a substratum substrate 1, an Al interconnection 2 and a negative-type photosensitive polyimide film 3 is exposed to light. At the same time, the device is exposed to light by using a photomask 4 in which a filter 6 having a light-transmitting quantity adjustment function has been installed at the boundary between a light-shielding part pattern 5 and a light-transmitting part 7. Thereby, a prescribed pattern is formed.

5. 发明专利

JPH03282403A COLOR SOLID-STATE IMAGE PICKUP ELEMENT AND ITS MANUFACTURE 失效
公开(公告)号：JPH03282403A
公开(公告)日：1991-12-12
申请号：JP32613689
申请日：1989-12-18
申请人： HITACHI LTD , HITACHI DEVICE ENG
发明人： SUGIYAMA HISASHI , TANAKA JUN , MATSUYAMA HARUHIKO , NATE KAZUO , SHOJI FUSAJI , NAKANO TOSHIO , IZUMI AKIYA , ISODA TAKASHI
IPC分类号： G02B5/20 , H01L27/14 , H04N5/335 , H04N5/365 , H04N5/369 , H04N9/07
摘要： PURPOSE:To obtain flattened color filters in the same plane on a substrate by providing a flattening layer made of a transparent material, providing partition wall layers made of organic silicon material layers in an area on a scanning part on the flattening layer, and arranging the color filters. CONSTITUTION:This element is provided with a photodetection part 101 which performs photoelectric conversion, the scanning part 102 which leads out an electric signal generated by the photodetection part, and the flattening layer 103 made of the transparent material on the semiconductor substrate where a passivation film for protecting the photodetector part and scanning part is formed. Then the color filter 107-110 are arranged on the same plane opposite the photodetection part on the flattening layer across the organic silicon material 104. Consequently, the color filters 107-110 can be formed on the same plane in the area partitioned by the partition wall made of the organic silicon material layer 104, and high sensitivity and high resolution are obtained without variance in spectral sensitivity nor color blurring.

6. 发明专利

JPH03276655A MULTILAYER-INTERCONNECTION BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH03276655A
公开(公告)日：1991-12-06
申请号：JP7349190
申请日：1990-03-26
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , YOSHIMOTO MITSUO , TANAKA JUN , SHOJI FUSAJI , YOKONO ATARU , INOUE TAKASHI , YAMAZAKI TETSUYA , TANAKA MINORU , SHIGI HIDETAKA
IPC分类号： H05K3/46 , H01L21/60 , H01L23/498
摘要： PURPOSE:To prevent the taper face at the lower part of a through hole in a polyimide film from being undercut by a method wherein metal interconnection layers whose surface is stabilization-treated and organic insulating films are laminated alternately at least on one face of a ceramic substrate and a thin-film circuit layer provided with terminals, for power supply or/and signal input/output use, which are connected to an LSI is formed on the surface layer of the laminated layers. CONSTITUTION:A thick-film mullite substrate 1 is formed; its surface is sputtered and cleaned. After that, an Al interconnection layer 2 is formed; in succession, Cr films to be used as passivity films are formed continuously to form a laminated film, i.e., a stabilization-treated layer 9. A metal interconnection layer 10a is formed; it is connected to circuits on the mullite substrate 1; then, a polyimide insulating film 3a is formed. Then, a metal interconnection layer 10b formed in the same manner as the metal interconnection layer 10a is formed in a contact through-hole 7; a polyimide insulating film 3b is formed on the metal interconnection layer 10b. In addition, this operation is repeated alternately; metal interconnection layers 10c, 10d and polyimide insulating films 3c, 3d are formed. In succession, an Ni-Cu alloy film is formed continuously on the surface of the polyimide insulating film 3d in which the contact through-hole 7 has been formed; it is patterned; after that, Au is plated chemically; a layer for surface terminals 11 is formed.

7. 发明专利

JPS645799A METHOD OF CUTTING PLASTIC SUBSTRATE 失效
公开(公告)号：JPS645799A
公开(公告)日：1989-01-10
申请号：JP15963187
申请日：1987-06-29
申请人： HITACHI LTD , HITACHI MAXELL
发明人： TAKASAKI MITSUHIRO , SUDO RYOICHI , MATSUYAMA HARUHIKO , KOYAMA EIJI , MURAKAMI HIROYA
IPC分类号： B26F3/08 , B26D3/00
摘要： PURPOSE: To heat only the cut portion of a plastic board and to cut the plastic board with small machining force without deteriorating the characteristics of the board by heating cutting blades to the softening point of a work or above. CONSTITUTION: Heaters 13, 14 are excited to heat cutting blades 11, 12 to the prescribed temperature, and a die plate 7 is depressed to press the cutting blades 11, 12 to the upper face of a plastic board (raw board) 16. The tips of the cutting blades 11, 12 are thrust to the cut portion of the plastic board 16 to heat only this portion, and the board 16 is cut without deteriorating its characteristics.

8. 发明专利

JPS63131392A MAGNETIC BUBBLE MEMORY ELEMENT 失效
公开(公告)号：JPS63131392A
公开(公告)日：1988-06-03
申请号：JP27651086
申请日：1986-11-21
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , SHOJI FUSAJI , UMEZAKI HIROSHI , SUZUKI MAKOTO , KANAI HIROMI , NOZAWA HISAO , SUZUKI TETSUAKI
IPC分类号： G11C19/08 , G11C11/14
摘要： PURPOSE:To obtain excellent bubble transfer characteristic in a high density element using a bubble whose diameter is 1.2mu or below by using polymer resin having a thermal fluidity to a 2nd insulation film in the process of curing. CONSTITUTION:The magnetic film 1 holding magnetic bubbles coated on a nonmagnetic substrate with lamination, a 1st insulation film 2, a conductor pattern 3, a 2nd insulation film 4 and a soft magnetic pattern 5 are provided at least and the bubble diameter is 1.2mum or below. The resin having a fluid property by heat treatment at least parity in the 2nd insulation film 4 is used and not only the fluidity at the coating of the resin solution but also the molten fluidity by heat treatment are utilized together to decrease the title angle at the edge of the conductor pattern. Thus, the 2nd insulation film 4 is formed with high accuracy and the element with excellent characteristic is manufactured with high reproducibility.

9. 发明专利

JPS6314749B2 失效
公开(公告)号：JPS6314749B2
公开(公告)日：1988-04-01
申请号：JP1149880
申请日：1980-02-04
申请人： HITACHI LTD
发明人： SHOJI FUSAJI , NAKATANI MITSUO , WATANABE TAKESHI , SUDO RYOICHI , YOKONO ATARU , ISOGAI TOKIO , MATSUYAMA HARUHIKO , AZUMA KAZUFUMI
IPC分类号： C09D183/04 , C08L83/04 , H01B3/46

10. 发明专利

JPS62273617A THIN FILM MAGNETIC HEAD 失效
公开(公告)号：JPS62273617A
公开(公告)日：1987-11-27
申请号：JP11455786
申请日：1986-05-21
申请人： HITACHI LTD
发明人： MATSUYAMA HARUHIKO , SHOJI FUSAJI , KUWAZUKA SHUNICHIRO , SUGIMOTO KENJI
IPC分类号： G11B5/31
摘要： PURPOSE:To suppress deformation of the entire insulation layer at forming of upper magnetic film by forming the insulation layer of the uppermost layer at least among inter-layer insulation layers in a core by a substance whose glass transition temperature is specific. CONSTITUTION:A thin film magnetic consists sequentially of a lower magnetic substance layer 2 such as a 'Permalloy(R)', a gap insulation layer 3, 1st insulator layer 4-1, a conductor 5 such as Al, Cu or Au, 2nd insulator layer 4-2, insulation layer 4-3 of the uppermost layer, an upper magnetic layer 6 and a protection layer 7. At least the layer 4-3 is formed by a substance whose glass transition temperature is 280 deg.C or over and preferably a compound heated and cured selected by a polyimide resin, especially a polyimide front body. In using the said substance, the manufacturing yield is improved and a thin film magnetic head with high reliability is obtained.

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