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    • 2. 发明专利
    • MICRODISPLACEMENT MECHANISM, SUPPORT MEMBER AND REDUCTION PROJECTION EXPOSURE DEVICE THEREOF
    • JPH03277441A
    • 1991-12-09
    • JP7366190
    • 1990-03-23
    • HITACHI LTD
    • KURIHARA MAKOTOMAZAKI TETSUYA
    • G03F9/00B23Q5/34G03F7/20H01L21/027H01L21/30
    • PURPOSE:To make them in a simple structure, to enable the microdisplacement adjustment in a high accuracy and to realize the cost reduction and life extension, by supporting the body to be displaced with a flexible supporting member centering around an intermediate point and equipping a variable control means together with the bestowal of a necessory force for the flexible action at the support membere intermediate point. CONSTITUTION:The gap in the vertical direction of a reticle 6 and the wafer 4 located on a wafer holding base 3 is found by a detector and input to a controller 18 by an electric signal. The controller 18 then operates a corrected displacement quantity based on the deviation of the both, in the case of there being the difference more than allowance between the gap detection quantity between the reticle 6 and wafer 4 and a target gap quantity. A motor 19 is then rotated according to a command signal, when the displacement command signal necessary for correction is transmitted to the motor 19 of the screw driving mechanism 14 of each support member 12 and a necessary force F is imparted to the intermediate point of the support member 12 by the screw mechanism 14. So, the intermediate point of the support member 12 is primarily displaced and also the wafer holding base 3 is microdisplaced secondarily and the wafer 4 face is corrected so as to locate at the depth of focus uniformly for the reticle 6.
    • 3. 发明专利
    • LASER INTERFERENCE LENGTH MEASURING INSTRUMENT AND POSITIONING METHOD USING SAME
    • JPH03252507A
    • 1991-11-11
    • JP5123690
    • 1990-03-02
    • HITACHI LTD
    • MIYAZAKI CHUICHISAKAIZAWA HIDEYUKIKURIHARA MAKOTO
    • G01B9/02G01B11/00G03F7/20
    • PURPOSE:To perform stable, high-accuracy measurement by supplying air which is controlled to constant temperature onto a light beam uniformly at a constant speed to the overall length of the light beam and eliminating the influence of atmospheric pressure distribution variation, etc., due to thermal disturbance and the motion of an object of measurement. CONSTITUTION:On an XY stage 6 for a stepper, the laser beam 2 from a laser oscillator 1 is split by a beam splitter 17 into two beams for X-axial measurement and Y-axial measurement, which are guided to interferometers 3A and 3B consisting of a 1/4-wavelength plate, a polarizing plates, etc. The interferometer 3A emits measurement light 4A, which is reflected by a rod mirror 5A on the XY stage 6, so that the quantity of X-axial movement of the stage 6 is measured. The measurement is performed by converting the intensity variation of interference light 7A photoeletrically by a photodetector 8A and an optical path difference measuring instrument measures the difference. The Y-axial measurement is the same. Then the air flow 14 which has a uniform temperature distribution and a close to a laminar flow is from a duct 12 through a filter 15 to stabilize the refractive index of air on measurement light beams 4A and 4B, thereby preventing the refractive indexes from varying owing to the peripheral temperature variation and the pressure variation, etc., due to the motion of the stage 6 and generating a measurement error.
    • 6. 发明专利
    • Heavy hydrogen discharge tube
    • 重氢排放管
    • JPS6132346A
    • 1986-02-15
    • JP15371384
    • 1984-07-24
    • Hitachi Ltd
    • TOYAMA YOSHIOSUGIYAMA YASUSHIKURIHARA MAKOTO
    • H01J61/68H01J61/70
    • H01J61/70
    • PURPOSE:To obtain the interchangeability with conventional heavy hydrogen discharge tubes by fitting a temperature detector for connecting a shield to a negative electrode on the surface of the bulb or within the bulb of a heavy hydrogen discharge tube and making it a three terminal circuit system. CONSTITUTION:Heavy hydrogen is sealed in a silica bulb 1 and at the same time, a negative electrode (cathode) 3 composed of a filament applied with oxide, a positive electrode (plate) 2 and a shield plate 4 not directly short- circuited to the negative electrode 3 are included therein and thus, a heavy hydrogen discharge tube for emitting ultraviolet ray is formed so that a discharge sustaining voltage of 50-150V may be applied between the negative and positive electrode. Furthermore, a thermostat 5, whose one end is connected to the shield plate 4 and the other end is connected to the negative electrode 3, operating at 100-200 deg.C is provided on the surface of the bulb 1 and thus, a three terminal type is formed. Therefore, at the time of the start of lighting, the shield plate 4 floats and after the lighting, is short-circuited to the negative electrode 3. Thereby, lighting becomes easy and at the same time, the interchangeability with conventional discharge tubes can be obtained.
    • 目的:为了获得与常规重氢放电管的互换性,通过安装温度检测器将屏蔽连接到灯泡表面的负极或重氢放电管的灯泡内,并使其成为三端电路系统。 构成:将重氢密封在石英灯泡1中,同时,由施加有氧化物的灯丝,正极(板)2和屏蔽板4组成的负极(阴极)3不直接短路 负极3被包含在其中,因此,形成用于发射紫外线的重氢放电管,使得可以在负极和正极之间施加50-150V的放电维持电压。 此外,将恒温器5的一端连接到屏蔽板4,另一端连接到负极3,在灯泡1的表面上设置100-200℃的操作,因此,三 端子类型形成。 因此,在照明开始时,屏蔽板4浮起并且在点亮之后与负极3短路。从而,照明变得容易,同时,与常规放电管的互换性可以是 获得。
    • 7. 发明专利
    • ROUNDED AND DEFORMED SHAPE GRINDING WORK DEVICE
    • JPH0679603A
    • 1994-03-22
    • JP23682292
    • 1992-09-04
    • HITACHI LTD
    • KIKUCHI YOSHIMICHIKURIHARA MAKOTOAKAOSUGI MASAMIOTAKA TAKESHI
    • B24B19/00
    • PURPOSE:To facilitate the grinding of fine roundness a deformed shape by providing a mechanism, which applies a fixed load so that a work is pushed to a tool at the time of reciprocating the work in the axial direction of the tool. CONSTITUTION:When a movable base 6 is reciprocated, a work 10, to which the pushing force is applied by a pushing screw of an arm 9 provided through a parallel spring 8, is reciprocated along the tool. At this stage, roundness of the tool is transcribed to the inside of the work 10 by the tool and ground. In the case where the tool is not rotated, the other end of the tool is fixed by a shaft presser 19 with a fastening screw, and the work 10 is similarly reciprocated to perform the grinding work. In the case of deformed shape working, the tool is formed in response to the deformed shape, and simlarily to the method for fixing the tool, the work 10 is reciprocated to be ground into the desired deformed shape. By this method, grinding of the fine roundness and deformed shape having the feeling of the grinding by the manual working can be performed easily at a low cost.
    • 8. 发明专利
    • PROJECTION ALIGNER
    • JPH0397216A
    • 1991-04-23
    • JP23281189
    • 1989-09-11
    • HITACHI LTD
    • KURIHARA MAKOTO
    • H01L21/30G03F7/20H01L21/027
    • PURPOSE:To realize a reducing projection aligner wherein an optical axis is stabilized; high-precision position and length measurement is possible, and microminiaturization and massproduction are properly made by separating and shielding a length measuring part and a wafer stage part from the circumferential atmosphere of the other part positions, and installing a jetting outlet and sucking inlet on the inner upper pat and the inner lower part, respectively. CONSTITUTION:The peripheral part between an upper base 3 and a lower base 4 is separated from the air flow blown out from a clean chamber 1 with a shielding plate 5. An air jetting outlet 8 is installed at the lower part of the upper base 3. An air sucking inlet 9 is installed at the upper part of the lower base 4. The air blown out from the air jetting outlet 8 is subjected to down-flow, sucked by the sucking inlet 9, made to pass an air circulating route 11 of the clean chamber 1, sent by a blower 13, cleaned by a filter 12, and circulated. As a result, the generation of turbulence caused by the movement of a wafer stage is restrained, and an optical axis path is stably maintained. As to the turbulence caused by the down-flow in the inside the vertical distance is reduced, and the sucking force is increased, thereby being minimized. Hence foreign matter such as oil mist generated from the wafer stage can be discharged.