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    • 1. 发明专利
    • CERAMIC BOARD AND MACHINING METHOD THEREFOR
    • JPH05218662A
    • 1993-08-27
    • JP1867092
    • 1992-02-04
    • HITACHI LTD
    • KAYABA NOBUOFUJISAWA MASAYASU
    • B24B41/06B28B11/08H05K3/46
    • PURPOSE:To obtain a ceramic board in which its surface can be accurately flattened and finer wiring can be formed by laying substances having different elastic moduli on a center and a periphery of a clamping jig of the board and machining the board in a protruding or recess shape. CONSTITUTION:A ceramic thick film multilayer board 3 is formed with a circuit of metal conductors 1 in ceramics. At the time of machining, the board 3 is fixed by a clamping jig 13 by vacuum suction, wax fixing, etc. In the case of machining, a cup-shaped super-abrasive grindstone 12 is rotated, the board 3 is rotated while supplying machining solution 17 to be machined. In this case, a compression residual stress is generated on the surface of the board 3. When the board 3 is removed from the jig 13, it is opened to become a protruding shape. Then, elastic substances having different elastic moduli are laid on an outer periphery and a center of the jig 13, or piezoelectric elements 15 are contained in the jig 13. The conduction is controlled to form a protrusion or a recess, thereby obtaining an accuracy of zero warpage when the board 3 is removed from the jig 13.
    • 2. 发明专利
    • EQUIPMENT FOR WORKING DYNAMIC PRESSURE GENERATING GROOVE
    • JPH0199737A
    • 1989-04-18
    • JP25719087
    • 1987-10-14
    • HITACHI LTD
    • KAYABA NOBUO
    • B21H7/18F16C33/14
    • PURPOSE:To accurately work a groove for generating dynamic pressure and to improve the rotating accuracy by a method that 1st and 2nd ring, wherein the central part is thinner in thickness than the outer peripheral part, are fixed face to face to the axial part of a guide pin, and radial holding grooves are fitted to the rings and balls are provided between these two rings. CONSTITUTION:When the balls 6 are inserted into a sleeve 3 as a shaft 13 is rotated by a driving equipment, the inner surface of the sleeve 3 is deformed plastically by the balls 6 and a groove 4 for generating dynamic pressure is worked. Rings 8, 11 in which the central part is thinner in thickness than the external peripheral part are fixed face to face to the axial part 2, balls 6 are fitted between the rings 8, 11. The balls 6 are pushed to the axial part and arranged accurately in the radial direction to hold accurate out-of-roundness. Radial grooves 7 are fitted on the ring 8 and the balls 6 are arranged accurately in the peripheral direction. Hereby, the depth and width of the groove 4 for generating dynamic pressure are uniform and can be worked accurately and the rotating accuracy of the bearing for the dynamic pressure is improve.
    • 3. 发明专利
    • GROUP FORMING METHOD
    • JPH0199736A
    • 1989-04-18
    • JP25716887
    • 1987-10-14
    • HITACHI LTD
    • KAYABA NOBUONOTO KOICHI
    • B21H7/18F16C33/14
    • PURPOSE:To execute high accuracy group working free from protruberance by sandwiching between soft metals a ball-like tool being a group formation tool composed of a ball-like tool of hard metal, a guide pin and a shaft with a central hole. CONSTITUTION:A hard metal ball 2 is arranged at a designated pitch in contact with a projection part 9 of a projecting guide pin 3 of hard metal and through a discoid ball hold 5 of soft metal and caught by a soft metal discoid ball press 6. The projection part 9 of a guide pin 3 is pressed into the central hole 8 of a shaft 1 to form a tool 4. Since the soft metals 5, 6 are subjected to plastic deformation after the outer shape of the ball 2 when the guide pin 3 is pressed into the central hole 8 of the shaft 1, the ball 2 is surely held and gives a depth of cut in an axial direction as it gives the tool 4 rotating motion. Hereby, highly accurate finishing can be carried out by group working provided with many tools in one reciprocating motion of the group tools.
    • 4. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR DEVICE
    • JPH1174242A
    • 1999-03-16
    • JP17998798
    • 1998-06-26
    • HITACHI LTD
    • KAYABA NOBUONISHIGUCHI TAKASHISATO HIDEMIOKAWA TETSUOKOJIMA HIROYUKIKAWAMORI YUKO
    • H01L21/304B24B7/22H01L21/306
    • PROBLEM TO BE SOLVED: To obviate a polishing pad and polishing abrasive grain and achieve highly accurate planarization by flatly securing a semiconductor device with its swelling corrected, relative to the upper face of wiring or the upper face of a layer insulating film, and then cutting or grinding the semiconductor device in parallel with a reference plane. SOLUTION: A semiconductor device 50 set on the swelling correcting section 20 on a circular or straight indexing table 80, is remedied of swelling by correction under a surface profile measuring device 60 and them moved to under a machining tool 30 and machined. Specifically, the semiconductor device 50 is vacuum-sucked to a holding device 70 relative to the surface of the layer insulating film on the semiconductor device 50, and then a vacuum-suction valve is opened to fix a jig for fixing surface reference on the silicon substrate on the underside of the semiconductor device 50 by vacuum suction. A jig for securing semiconductor device is secured on the underside of the semiconductor device 50 by vacuum suction, and the jig for securing surface reference planarizes a group of ceramic blocks, following the underside of the semiconductor device 50 is worked in parallel with the surface of the semiconductor device 50.
    • 6. 发明专利
    • ULTRASONIC MACHINE WITH MACHINING SPINDLE OF VERTICAL AND HORIZONTAL VIBRATION
    • JPS63114855A
    • 1988-05-19
    • JP25823186
    • 1986-10-31
    • HITACHI LTD
    • KAYABA NOBUO
    • B06B1/04B24B1/04
    • PURPOSE:To enable highly efficient processing in a horizontal direction as well by repeating the attraction and the repulsion of a horn through the change of the intensity of a magnetic field formed at the tip of the born in a ultrasonic machine. CONSTITUTION:An oscillator 3, a born 4 and a tool 5 are rotated at a high speed with a motor 6 and concurrently therewith, the oscillator 3 gives a vibration with an amplitude in a Z-axis direction due to the operation of an ultrasonic transmitter 1. The amplitude is expanded with the horn 4 and the vibration is transmitted to the tool 5. Therefore, the tool 5 gives a high-speed rotation and a high-speed vibration in a Z-axis direction. Also, a pulse current runs from a power supply part 20 to coils 11 via a control box 19 and generates a magnetic field around the four coils 11, thereby causing the high-speed rotation of the horn 4. Consequently, the intensity of the magnetic field working on the horn 4 changes momentarily and an electric current runs on the winding surface of an aluminium foil 16 opposite to the coils 11 due to the effect of electromagnetic induction, thereby causing the coils 11 (11-1 and 11-2) to repulse the horn 4 and supporting the horn 4 on the inclusion surface of a case 7 in a non-contact condition. And the horn 4 and the tool 5 repulse each other in X-and Y-axis directions and vibrate within an allowable limit in a space 13 in an overall horizontal direction.
    • 7. 发明专利
    • GRINDING WHEEL
    • JPS6316973A
    • 1988-01-23
    • JP16074986
    • 1986-07-10
    • HITACHI LTD
    • KAYABA NOBUOFUJISAWA MASAYASU
    • B24D3/00B24D3/04B24D3/06
    • PURPOSE:To prevent the degradation of grinding ability with the passage of time and dispense with dressing by forming grains having a grain layer coated with a coating film of metal or ceramics and sintering with the coating films by themselves. CONSTITUTION:Grains 2 having a grain layer 3a coated with a coating film 6 of metal or ceramics are formed by sintering the coating films 6 by themselves. thus, a perforated grinding wheel containing grains 2 and having a proper grain holding force ore obtained. And since the self-generating action of grains 2,i.e. that the strength of grains 2 balances with a grain holding force and when the wear of grains 2 progressed to increase the resistance the grains 2 are dropped out so that new grains 2 are always related to working takes place, chip pockets 9 to make chips escape can be easily formed. Thus, the grinding ability is not degraded with the passage of time and the stable working can be continued.
    • 8. 发明专利
    • FORMATION OF GRINDSTONE
    • JPS6228172A
    • 1987-02-06
    • JP16578185
    • 1985-07-29
    • HITACHI LTD
    • KAYABA NOBUO
    • B23H5/00B24B53/00B24B53/06
    • PURPOSE:To remove efficiently deteriorated layers and spatters and form a grindstone efficiently and precisely in stable discharge by pressing a GC grind stone or a WA grindstone to a discharge machining face of a metal bond dia mond grindstone in the case of formation by discharge machining. CONSTITUTION:While machining liquid is provided in a gap 9 between a metal bond diamond grindstone 1 and a electrode 5, the grindstone 1 is rotated, dis charge is generated between the grindstone 1 and the electrode 5 and the grind stone 1 is formed by discharge. In this case, a GC grindstone or a WA grind stone is pressed to a face, to be machined by discharge, of the grindstone 1, thus deteriorated binder can be removed, falling of a diamond grinding particle layer 2 can be promoted, a face to be machined by discharge is cleaned while spatters stuck on the face being removed and as a result, the stable discharge condition can be obtained whereby the metal bond diamond grindstone is formed in high efficiency and in high precision.
    • 9. 发明专利
    • GRINDING WHEEL FORMING METHOD
    • JPS61241064A
    • 1986-10-27
    • JP8017485
    • 1985-04-17
    • HITACHI LTD
    • KAYABA NOBUO
    • B24B53/013B24B53/06B24B53/07
    • PURPOSE:To reduce wear of a dressing roller by allowing a grinding wheel having abrasive grain layer of hard material to rotate while in contact with a grinding wheel shaper roll and by supplying an appropriate amount of grinding liquid containing free abrasive grains. CONSTITUTION:If a grinding wheel 1 in low speed revolutions is fed in depth direction to allow contact with a dressing roll 5 to cause it into rotation at the same speed through the action of the frictional force, the contact pressure produces a stress distribution in correspondence to the shape of this dressing roll 5 over the hard abrasive grain layer 1B of the grinding wheel 1, which leads to generation of a degraded layer including microcracks. Then a grinding liquid 9 containing free abrasive grains 10 is supplied to the contact surface 7 from a nozzle 6, and said degraded layer is grown by permitting those free abrasive grains 10 to act between the grinding wheel 1 and dressing roll 5, and at the same time its removal is promoted to provide effective dressing. Here the surface pressure is measured by a pressure sensor 15, and a controller controls the amount of grinding liquid with the aid of a valve 12. Accordingly wear of the dressing roll is suppressed to assure high accuracy shaping.