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1. 发明专利

JP2017154249A ドレッシング方法及びドレッシング装置审中-公开
公开(公告)号：JP2017154249A
公开(公告)日：2017-09-07
申请号：JP2017118018
申请日：2017-06-15
申请人：坂東機工株式会社
发明人：坂東和明
IPC分类号： B24B9/00 , B24B53/013
CPC分类号： B24B9/00 , B24B53/013
摘要：【課題】良質なドレッシングを行い得るドレッシング方法及びその装置を提供すること。【解決手段】ドレッシング装置1は、回転する研削ホイール5の研削面6に、当該研削面6の形状に対応した形状を有した突条部12の面を有すると共に当該面を必要な長さに渡って対面接触させる規制体13と、砥粒混在の圧力流体を発生する装置としての噴出砥粒発生装置11と、研削面6と規制体13の突条部12の面との対面接触の間に、噴出砥粒発生装置11からの砥粒混在の圧力流体としての混合圧縮空気を噴射する噴射装置としての砥粒混在圧縮空気の噴出口15とを具備している。【選択図】図1

2. 发明专利

JP5406890B2 Method and trimming device for trimming the two working layers 有权
标题翻译：空值
公开(公告)号：JP5406890B2
公开(公告)日：2014-02-05
申请号：JP2011164114
申请日：2011-07-27
申请人：ジルトロニックアクチエンゲゼルシャフトSiltronic AG
发明人：ゲオルク・ピーチ , ミヒャエル・ケルスタン
IPC分类号： B24B53/12 , B24B37/00 , B24B53/013 , H01L21/304
CPC分类号： B24B53/017 , B24B37/08 , B24B37/28

3. 发明专利

JP2012111165A BORING METHOD 审中-公开
公开(公告)号：JP2012111165A
公开(公告)日：2012-06-14
申请号：JP2010263230
申请日：2010-11-26
申请人： CONSEC CORP
发明人： MATSUBARA HIROYUKI , OSHITA TAKASHI
IPC分类号： B28D1/14 , B24B53/013
摘要： PROBLEM TO BE SOLVED: To supply an abrasive without changing structure of a boring device, when a boring speed gets low, in an internal dust collection type boring method for carrying out air cooling of a core bit cutting edge part and discharge of chips by outside air sucked into a core bit, when boring a material to be bored using the boring device equipped with the core bit.SOLUTION: A bottle-like container 22 is once grasped, when the boring speed gets low, to supply the abrasive from a core bit outside toward a boring groove, using a pump tool 21 comprising the flexible resin bottle-like container 22, and a straw-like nozzle 24, and capable of delivering the abrasive in the container from the nozzle 24, when grasping once the container 22.

4. 发明专利

JP2010194704A Grinding wheel for correcting surface plate, polishing device for correcting surface plate, and method for correcting polishing surface plate 审中-公开
标题翻译：用于校正表面板的研磨轮，用于校正表面板的抛光装置，以及用于校正抛光表面板的方法
公开(公告)号：JP2010194704A
公开(公告)日：2010-09-09
申请号：JP2009170336
申请日：2009-07-21
申请人： Shinano Denki Seiren Kk , 信濃電気製錬株式会社
发明人： YASUOKA KAI , SHIMIZU TSUTOMU , KAZAMA KENICHI
IPC分类号： B24B53/12 , B24B53/013 , B24B53/02 , B24D3/32 , B24D7/06
CPC分类号： B24D7/06 , B24B53/013 , B24B53/02 , B24B53/12
摘要： PROBLEM TO BE SOLVED: To obtain a workpiece with favorable surface roughness by sufficiently holding abrasive grains in an opened granular graphite holes existing at a surface of the surface plate, capable of obtaining a stable polishing force by an increase of the holding force and transferring a fine surface of the surface plate to a polishing workpiece when actually polishing the polishing workpiece by using free abrasive grains. SOLUTION: This polishing device corrects and polishes a polishing surface plate by disposing carriers for correcting the surface plate having holes for holding grinding wheels for correcting the surface plate on the polishing surface plate, holding the grinding wheels in the holes of the carriers, rotating each of the polishing surface plate and the carrier and supplying free abrasive grains to the polishing surface plate. The shape of the grinding wheel disposed in the hole of the carrier has a fan-shape of 180-90° at a circular center angle. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题为了通过在存在于表面板的表面的开放的颗粒状石墨孔中充分保持磨粒来获得具有良好表面粗糙度的工件，能够通过增加保持力获得稳定的抛光力并且通过使用自由磨粒实际抛光抛光工件时，将表面板的精细表面转移到抛光工件上。解决方案：该抛光装置通过设置用于校正具有用于校正磨光轮的孔的表面板的载体来校正抛光表面板，用于校正抛光表面板上的表面板，将磨轮保持在载体的孔中旋转研磨面板和载体，并向研磨面板供给游离磨粒。设置在托架的孔中的砂轮的形状为圆形中心角为180-90°的扇形。版权所有（C）2010，JPO＆INPIT

5. 发明专利

JP2008080487A Abrasive and boring method using the same 审中-公开
标题翻译：使用该方法的磨蚀和钻孔方法
公开(公告)号：JP2008080487A
公开(公告)日：2008-04-10
申请号：JP2007287661
申请日：2007-11-05
申请人： Mitsubishi Materials Corp , Nippon Diamond Co Ltd , 三菱マテリアル株式会社 , 日本ダイヤモンド株式会社
发明人： MAZAKI SHIGERU , KAWAHARA TAKESHI
IPC分类号： B24B53/013 , B28D1/14
摘要： PROBLEM TO BE SOLVED: To provide an abrasive reducing heat generation of a core bit caused by boring, and allowing boring of a deep hole while maintaining the boring speed when the deep hole is bored using a dry method, and a boring method using the same.
SOLUTION: The abrasive 51 is fed between the distal end of the core bit 11 consisting of the diamond tip 31 fixed to the tip of a tubular shank rotatably driven around the axis and a work 20 on which the tip is pressed to bore for dressing the diamond tip 31. Abrasive grains containing ultrafine particles of anhydrous silica and a hydrous resin is used as the abrasive 51 for dressing the diamond tip 31.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供由钻孔引起的芯钻头的研磨减少发热，并且允许在使用干式方法钻孔深孔的同时保持钻孔速度的深孔钻孔，以及钻孔方法使用相同解决方案：研磨剂51被供给在芯钻头11的远端之间，其由固定到围绕轴线旋转地驱动的管状柄的尖端的金刚石尖端31和尖端被压入其中的工件20组成用于修整金刚石尖端31.使用含有无水二氧化硅和含水树脂的超细颗粒的磨料作为用于修整金刚石尖端31的磨料51.版权所有（C）2008，JPO＆INPIT

6. 发明专利

JP3797861B2 失效
公开(公告)号：JP3797861B2
公开(公告)日：2006-07-19
申请号：JP2000294666
申请日：2000-09-27
IPC分类号： B24B37/04 , B24B53/013 , B24B53/017 , B24B53/02 , B24B53/12 , B24B55/02 , B24B55/06 , H01L21/304

7. 发明专利

JP2003535462A Polishing method and apparatus for manufacturing semiconductors and integrated circuits 审中-公开
公开(公告)号：JP2003535462A
公开(公告)日：2003-11-25
申请号：JP2001587967
申请日：2001-05-31
申请人：コーニンクレッカフィリップスエレクトロニクスエヌヴィ
发明人：アルバート、エイチ．リュウ , ネルソン、ダブリュ．ホワイト、ザ、セカンド
IPC分类号： B24B37/32 , B24B53/013 , B24B53/017 , H01L21/304 , B24B37/00 , B24B53/02
CPC分类号： B24B37/32 , B24B53/013 , B24B53/017
摘要： A method of conditioning a polish pad at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine. Next, a polish pad is rotated. Then, the polish pad is conditioned proximately around a location designated for holding a wafer.

8. 发明专利

JP2003127062A DRESSING METHOD AND DRESSING DEVICE FOR DIAMOND WHEEL 审中-公开
公开(公告)号：JP2003127062A
公开(公告)日：2003-05-08
申请号：JP2001327333
申请日：2001-10-25
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YOKOYAMA NOBUYUKI , IZUNO CHIZUO
IPC分类号： B24B53/00 , B24B53/013
摘要： PROBLEM TO BE SOLVED: To solve the problem in the conventional dressing method of a diamond wheel using fixed particles that diamond grains are worm and dulled simultaneously with dressing. SOLUTION: The dressing method and the dressing device for the diamond wheel are to remove binders from the diamond wheel by immersing the diamond wheel turning at a peripheral velocity of 3400-5400 m/min in a mixed liquid of an abrasive and a grinding liquid or by spraying the mixed liquid onto the diamond wheel turning at a high-speed to make the abrasive hit against the face to be dressed of the diamond wheel at a high-speed. A good dressing shape can be formed under the different binder removal conditions at the front and back in the turning direction due to different hitting powers to the faces to be dressed at the front and back in the turning direction.

9. 发明专利

JP2002540965A 失效
公开(公告)号：JP2002540965A
公开(公告)日：2002-12-03
申请号：JP2000609225
申请日：2000-03-29
IPC分类号： B24B53/007 , B24B53/013 , B24B53/017 , B24D13/14 , B24D13/18 , H01L21/304 , B24B37/00 , B24B53/02

10. 发明专利

JP2711471B2 失效
公开(公告)号：JP2711471B2
公开(公告)日：1998-02-10
申请号：JP13461489
申请日：1989-05-30
IPC分类号： B24B53/00 , B24B53/007 , B24B53/013 , B24C7/00

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