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1. 发明专利

JP2000277895A SOLDER BONDING METHOD 失效
公开(公告)号：JP2000277895A
公开(公告)日：2000-10-06
申请号：JP11199399
申请日：1999-04-20
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , NAKAMURA YOSHINORI , IRIE HISAO , KUMAMOTO SATOSHI
IPC分类号： B23K1/00 , B23K1/20 , B23K35/26 , B23K35/34 , B23K101/42 , C23C18/52 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To obtain a soldering method, which prevents drop in soldering strength and which can ensure a strong soldered part when an electronic component or the like is soldered to an electrode, in which an electroless nickel- phosphorus-plated layer is formed on a metal substrate, such as a copper substrate or the like. SOLUTION: In this soldering method, an electronic component is soldered, by using tin/lead-based eutectic solder, to an electrode in which an electroless nickel-phosphorus plated layer is formed on a metal substrate or to an electrode, in which a gold-plated layer or a palladium-plated layer is further formed on an electroless nickel-phosphorus plated layer. In the soldering method, as a metal layer which is soldered directly to the electrode, a lead layer or a solder layer whose lead content is higher than the composition of the eutectic solder is precoated, solder is supplied to the precoated metal layer, in such a way that the final composition of a soldering material after the soldering operation of the electronic component lie in the range of the eutectic composition of the tin/lead-based eutectic solder, and the electronic component joint is made.

2. 发明专利

JPH098044A SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH098044A
公开(公告)日：1997-01-10
申请号：JP15197495
申请日：1995-06-19
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , AMANO TOSHIAKI , IRIE HISAO , TANAKA HIROSHI
IPC分类号： H01L21/60 , H01L21/321
摘要： PURPOSE: To form a bump with a solder rising part which is thick enough for soldering a semiconductor element to a board by extending a strip-like electrode auxiliary part in an electrode body and forming a solder bump wherein a solder layer is thicker than an electrode auxiliary part in the body. CONSTITUTION: In a semiconductor element wherein a bump 4 is formed on an electrode 1, a strip-like electrode auxiliary part 3 is extended in an electrode body 2 and a solder bump 4 wherein a solder layer is thicker than the electrode auxiliary part 3 is formed on an electrode body 2. For example, to a square electrode body 2 whose one side is about 100 to 300μm, a long side of a strip shape of the electrode auxiliary part 3 is set for 100 to 1000μm and a short side thereof is set so that difference to one side of the electrode body 2 is at least 30μm. A position to the electrode body 2 of the electrode auxiliary part 3 is on a side far from a vertical angle of the electrode body 2.

3. 发明专利

JPS63114979A FORMATION OF METALLIC FILM ON SURFACE OF METAL 失效
公开(公告)号：JPS63114979A
公开(公告)日：1988-05-19
申请号：JP12086387
申请日：1987-05-18
申请人： HARIMA CHEMICALS INC
发明人： KONO MASANAO , HASEGAWA YOSHIHIRO , NISHI YASUTAKA , IRIE HISAO , MIZUTA TATSUJI , OBARA SHINSUKE
IPC分类号： C23C18/54 , C23C18/08 , C23C18/16 , H05K3/10 , H05K3/18 , H05K3/24 , H05K3/34
摘要： PURPOSE:To easily deposit a film of solder or the like on the surface of a base metal by dissolving metallic salts of an org. carboxylic acid in a high b.p. solvent to prepare a soln. and by immersing the base metal having a greater ionization tendency than metals forming the metallic salts in the soln. CONSTITUTION:Metallic salts of an org. carboxylic acid such as rosin or a deriv. thereof are dissolved in a high b.p. solvent to prepare a soln. Metals forming the metallic salts are the constituents of a solder film or the like. The soln. is heated and a substrate of a metal having a greater ionization tendency than the metals forming the metallic salts, e.g., Zn, Al, Fe, Ni or Cu is immersed in the heated soln. to deposit the metals forming the metallic salts on the surface of the substrate. By this method, a film of a metal for joining such as solder can be accurately formed on the exposed surface of the base metal of a board having a drawn circuit pattern.

4. 发明专利

JPS6253203B2 失效
公开(公告)号：JPS6253203B2
公开(公告)日：1987-11-09
申请号：JP6911779
申请日：1979-06-01
申请人： HARIMA CHEMICALS INC
发明人： ARIMOTO KUNIO , IRIE HISAO , ISHIGAMI MASAHISA
IPC分类号： B01D19/04 , D21C3/22 , D21D5/26 , D21H17/14 , D21H23/22

5. 发明专利

JPS6126818B2 JPS6126818B2 - 失效
公开(公告)号：JPS6126818B2
公开(公告)日：1986-06-23
申请号：JP2198980
申请日：1980-02-22
申请人： Harima Chemicals Inc
发明人： MYAMOTO MICHIO , IRIE HISAO , INOE YOSHIKAZU , ARIMOTO KUNIO , ISHIGAMI MASAHISA
IPC分类号： C08L91/00 , C08L7/00 , C08L21/00 , C08L95/00

6. 发明专利

JPS59131565A Binder composition for refractory brick 失效
$Binder composition for refractory brick$
标题翻译：用于耐火砖的粘合剂组合物
公开(公告)号：JPS59131565A
公开(公告)日：1984-07-28
申请号：JP618883
申请日：1983-01-17
申请人： Harima Chemicals Inc
发明人： IRIE HISAO , MONNO SUSUMU , INOUE YOSHIKAZU , ISHIGAMI MASAHISA , TACHIBANA KAZUHIRO
IPC分类号： C04B35/632 , C04B35/00

7. 发明专利

JPS57139134A COMPOSITION FOR POLYVINYL CHLORIDE TILE 失效
公开(公告)号：JPS57139134A
公开(公告)日：1982-08-27
申请号：JP2472481
申请日：1981-02-20
申请人： HARIMA CHEMICALS INC
发明人： ARIMOTO KUNIO , IRIE HISAO , YAMANE KOUJI , TAKAGI SHIGEO , KIYOHARA KIYOMASA , ISHIGAMI MASAHISA
IPC分类号： C08L27/00 , C08L1/00 , C08L7/00 , C08L21/00 , C08L23/00 , C08L27/06 , C08L93/00
摘要： PURPOSE:To provide a compsn. capable of forming a tile having processability and stability to light and heat, by adding a product as a binder to PVC, said product being obtd. by reacting an alpha, beta-unsaturated polybasic acid with a mixture of rosin and a fatty acid, and then reacting the resulting reaction product with an alkaline earth metal compd. CONSTITUTION:100pts.wt. rosin material such as gum rosin and 2-30pts.wt. 12C or higher fatty acid such as lauric acid or a derivative thereof are mixed together with heating to produce a mixture. 2-20pts.wt. alpha, beta-unsaturated polybasic acid such as maleic acid is added to the mixture. The resulting mixture is heated to produce an addition reaction product. 2-15pts.wt. alkaline earth metal oxide, hydroxide or acetate is reacted with 100pts.wt. said adduct with heating to produce a binder. 5-30pts.wt. said binder and conventional additives such as asbestos and a filler are blended with 100pts.wt. PVC. The mixture is molded into a sheet which is then cut to a required size, to obtain a tile. EFFECT:A tile having proper flexibility is obtd.

8. 发明专利

JPS5620052A ASPHALT COMPOSITION FOR PAVEMENT 失效
公开(公告)号：JPS5620052A
公开(公告)日：1981-02-25
申请号：JP9758379
申请日：1979-07-30
申请人： HARIMA CHEMICALS INC
发明人： ARIMOTO KUNIO , MASHIMA TOORU , MIYAMOTO MICHIO , SHIMA TOSHINORI , IRIE HISAO
IPC分类号： C08L95/00 , C08L7/00 , C08L21/00 , C08L33/00 , C08L33/02 , E01C7/18
摘要： PURPOSE:Titled composition, excellent in aggregate-holding properties, caking properties, etc., which is prepared by mixing asphalt with a thermally treated product such as a distillation bottom of tall oil, and compounding the resulting mixture with a natural or synthetic rubber latex. CONSTITUTION:(a) 1pt.wt. of asphalt, (b) 0.01-0.1pt.wt. of a product obtained by heating a mixture of 100pts.wt. of a distillation bottom of tall oil and/or dienophile adduct of the bottom, with 1-15pts.wt. of at least one alkali metal hydroxide, and (C) such an amount of a latex, as to contain 0.001-0.5pt.wt. of at least one latex, selected from a natural rubber latex, chlorinated rubber latex, etc., as a solid, are mixed. Then titled composition, particularly suitable for a slip-resisting pavement, is obtained by heating an kneading the resulting mixture.

9. 发明专利

JPS55159810A DEFOAMING AGENT FOR PAPER PULP MANUFACTURING PROCESS 失效
公开(公告)号：JPS55159810A
公开(公告)日：1980-12-12
申请号：JP6911779
申请日：1979-06-01
申请人： HARIMA CHEMICALS INC
发明人： ARIMOTO KUNIO , IRIE HISAO , ISHIGAMI MASAHISA
IPC分类号： B01D19/04 , D21C3/22 , D21D5/26 , D21H17/14 , D21H23/22
摘要： PURPOSE:To provide a defoaming agent for preventing an aqueous system of a titled process from foaming comprising adding a specified amount of an emulsifier such as alkali salt of fatty acid or the like to a predetermined amount of an initial fraction of a monoester of tall oil with a specific acid value with glycerine and mixing to adjust the HLB of said aqueous system to a predetermined value. CONSTITUTION:To 100pts.wt. of monoester, diester or a mixture thereof obtained by reacting an initial fraction of the tall oil with 90-170 acid value and glycerine, 0.5-30pts.wt. of one or more of an emulsifier selected from a group comprising an alkali salt of a fatty acid, fatty acid or polyalkylene glycol ester of a fatty acid with 9.0 or more HLB, polyhydric alcohol ester of a fatty acid with 9.0 or more HLB is added and mixed therewith to adust the HLB to 2.4-4. This defoaming agent has both actions for destructing or retarding foams and has excellent long lasting activity and, if diluted by a large amount of water, does not form precipitates and suitable for preventing an aqueous system in a paper pulp industry from foaming.

10. 发明专利

JPH0936531A MOUNTING OF LEAD COMPONENT 失效
公开(公告)号：JPH0936531A
公开(公告)日：1997-02-07
申请号：JP17909995
申请日：1995-07-14
申请人： FURUKAWA ELECTRIC CO LTD , HARIMA CHEMICALS INC
发明人： HIKASA KAZUTO , FUKUNAGA TAKAO , IRIE HISAO , TANAKA HIROSHI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To eliminate a defective bonding of lead components and to make it possible to mount efficiently the lead components on a circuit board by a method wherein a reflow heating treatment is performed on the board in a state that solders have a surface tension smaller than that of the solders at the time of the formation of solder precoatings to mount the lead components on the conductive parts on the board. SOLUTION: Solder precoatings are respectively formed on conductive parts 12 on a board in a state that solders have a prescribed surface tension. At this time, by setting greatly in comparison the surface tension of the solders 13 at the time of the formation of the solder precoatings, the fluidity of the solders 13 can be reduced. Then, a flux having a temporary fixture is fed on the solder precoatings and lead components 11 are respectively mounted on the solder precoatings. After that, a reflow heating treatment is performed on this board to mount the lead components 11 on the parts 12. At this time, the surface tension of the solders at the time of the reflow heating treatment is set smaller than that of the solders at the time of the formation of the solder precoatings, whereby the fluidity of the solders can be improved.

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