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1. 发明专利

JP2010003939A Method for manufacturing substrate, device for manufacturing substrate, and substrate 审中-公开
标题翻译：制造基板的方法，制造基板的装置和基板
公开(公告)号：JP2010003939A
公开(公告)日：2010-01-07
申请号：JP2008162743
申请日：2008-06-23
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI
IPC分类号： H01L21/027 , G03F9/00
CPC分类号： G03B27/52
摘要： PROBLEM TO BE SOLVED: To provide: a method for manufacturing a substrate which is low in cost, excellent in flexibility, and decreased in man-hour of manufacture; a device for manufacturing the substrate; and the substrate.
SOLUTION: The method for manufacturing the substrate includes a step of forming an alignment mark 17a on one surface 10a of the substrate 10, a step of detecting the position of the alignment mark 17a, and a step of forming a mark 12 at a position on the other surface 10b of the substrate 10 which corresponds to the position of the alignment mark 17a by converging and scanning a laser L with a wavelength having transmission property with respect to the substrate 10.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供：成本低，柔性优异，制造工时减少的基板的制造方法; 用于制造基板的装置; 和基板。解决方案：用于制造衬底的方法包括在衬底10的一个表面10a上形成对准标记17a的步骤，检测对准标记17a的位置的步骤，以及形成标记12的步骤通过会聚和扫描具有相对于基板10的具有透射特性的波长的激光L来对应于对准标记17a的位置的基板10的另一个表面10b上的位置。（C）2010 ，JPO＆INPIT

2. 发明专利

JP2008203434A Scanning mechanism, method of machining material to be machined and machining apparatus 审中-公开
标题翻译：扫描机械，加工材料加工设备的方法
公开(公告)号：JP2008203434A
公开(公告)日：2008-09-04
申请号：JP2007038183
申请日：2007-02-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MATSUSHITA NAOHISA , FURUI JUICHI
IPC分类号： G02B26/10 , B23K26/03 , B23K26/067 , B23K26/08
CPC分类号： B23K26/0604 , B23K26/0084 , B23K26/0619 , B23K26/067 , B23K26/082 , B23K2201/36 , G11B5/84
摘要： PROBLEM TO BE SOLVED: To attain higher-speed scanning and to enable precision machining by using a laser beam of smaller diameter with respect to a scanning mechanism such as laser beam and a method of machining using the laser beam. SOLUTION: A lens which condenses a light beam emitted from a light source is movable in a plane perpendicular to the axial direction of the lens. The condensing light by the lens causes a variation in the trace of the condensed light beam. On the other hand, a bending mirror is arranged to bend an optical path by 90 degrees corresponding to the both faces of an object to be scanned/a material to be machined, and the light beam which is condensed/varied in the trace by the lens is reflected and radiated on the surface of the object to be scanned/the material to be machined. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了实现更高速扫描并且通过使用相对于诸如激光束的扫描机构的较小直径的激光束和使用激光束的加工方法来实现精密加工。解决方案：使从光源发射的光束会聚的透镜可在垂直于透镜的轴向的平面中移动。由透镜引起的聚光会引起凝聚光束的迹线的变化。另一方面，弯曲反射镜被配置为将光路弯曲90度，对应于待扫描物体/被加工物体的两面，并且在轨迹中被冷凝/变化的光束由透镜被反射并辐射在待扫描物体/待加工材料的表面上。版权所有（C）2008，JPO＆INPIT

3. 发明专利

JP2008140818A Method for manufacturing device element and dicing method 有权
标题翻译：制造装置元件和方法的方法
公开(公告)号：JP2008140818A
公开(公告)日：2008-06-19
申请号：JP2006323006
申请日：2006-11-30
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI
IPC分类号： H01L21/301 , B28D5/02
CPC分类号： B81C1/00888 , B81C2201/053 , H01L21/78
摘要： PROBLEM TO BE SOLVED: To surely remove cutting powder generated in the dicing process by not allowing residues of protection agent for protecting substrate surface during the dicing process to be left even after removal of the protection agent. SOLUTION: In the case of manufacturing a device element, a plurality of device elements are formed first on the substrate (S1). Next, before the dicing process, a volatile protection agent is coated to at least front surface of the substrate on which a device element is formed (S2). Thereafter, each device element is isolated by the dicing process (S3). After the dicing process, the front surface of the volatile protection agent is washed (S4). After this washing process, the volatile protection agent is vaporized (S5). COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：即使在除去保护剂之后，也不会在切割过程中不允许保留基板表面的保护剂残留物，从而确保去除切割工艺中产生的切割粉末。解决方案：在制造器件元件的情况下，首先在衬底上形成多个器件元件（S1）。接下来，在切割过程之前，将挥发性保护剂涂覆到其上形成器件元件的基板的至少前表面（S2）。此后，通过切割处理隔离每个器件元件（S3）。在切割过程之后，洗涤挥发性保护剂的前表面（S4）。在该洗涤过程之后，挥发性保护剂蒸发（S5）。版权所有（C）2008，JPO＆INPIT

4. 发明专利

JP2010251544A Device and method for removing resist 审中-公开
标题翻译：用于去除电阻的装置和方法
公开(公告)号：JP2010251544A
公开(公告)日：2010-11-04
申请号：JP2009099869
申请日：2009-04-16
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KAI SATOSHI , NISHIYAMA SHUSAKU , FURUI JUICHI
IPC分类号： H01L21/3065 , H01L21/027
摘要： PROBLEM TO BE SOLVED: To provide a device and method for removing a resist, more concretely, removing only the resist called edge beads formed to the periphery of a substrate by ashing, regarding the removal of the resist applied to the substrate.
SOLUTION: The device for removing the resist is equipped with: a mask susceptor in a chamber for the device for removing the resist; a substrate susceptor arranged inside the mask susceptor and placing the substrate; and a cover-like ashing mask arranged at a position covering the substrate on the mask susceptor and including an opening exposing the periphery of the substrate.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：为了提供去除抗蚀剂的装置和方法，更具体地，关于去除施加到基板的抗蚀剂，仅去除通过灰化形成到基板周边的称为边缘珠的抗蚀剂。解决方案：用于除去抗蚀剂的装置配备有：用于去除抗蚀剂的装置的腔室中的掩模基座; 衬底基座，布置在所述掩模基座内并放置所述衬底; 以及覆盖在掩模基座上的衬底的位置处的盖状灰化掩模，并且包括露出衬底的周边的开口。版权所有（C）2011，JPO＆INPIT

5. 发明专利

JP2009181683A Device and method of manufacturing spring member 有权
标题翻译：制造弹簧构件的装置和方法
公开(公告)号：JP2009181683A
公开(公告)日：2009-08-13
申请号：JP2008022355
申请日：2008-02-01
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI , MATSUSHITA NAOHISA
IPC分类号： G11B21/21 , B21D11/20
CPC分类号： G11B5/4833 , Y10T29/49041
摘要： PROBLEM TO BE SOLVED: To provide a manufacturing device of spring members for reducing variations of a takt time. SOLUTION: A spring member manufacturing device 1 that manufactures the spring member by laser irradiation includes a laser irradiation unit 9 including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member 4. The laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n-1)th power, n being a positive integer, of predetermined minimum adjustment amount decided in accordance with load adjusting amount required for the spring member. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于减少打开时间变化的弹簧部件的制造装置。解决方案：通过激光照射制造弹簧部件的弹簧部件制造装置1包括激光照射单元9，其包括相对于弹簧部件4进行预定的激光照射的多个激光照射装置。激光照射装置被配置为使得对于各个激光照射装置预先设定彼此不同的激光照射条件，并且被布置成使得各个照射位置彼此不重叠。激光照射装置通过将具有激光照射条件为2的激光照射装置与根据弹簧部件所需的负载调整量确定的预定最小调整量的（n-1）次幂n组合成正整数，。版权所有（C）2009，JPO＆INPIT

6. 发明专利

JP2006150499A Laminate body cutting method and laminate body 有权
标题翻译：层压体切割方法和层压体
公开(公告)号：JP2006150499A
公开(公告)日：2006-06-15
申请号：JP2004344330
申请日：2004-11-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI
IPC分类号： B81C1/00 , B23K26/14 , B23K26/38 , B23K26/40 , B23K101/40 , B28D5/00 , B81C99/00
CPC分类号： B23K26/123 , B23K26/0853 , B23K26/142 , B23K26/18 , B23K26/38 , B23K26/40 , B23K2201/40 , B23K2203/50
摘要： PROBLEM TO BE SOLVED: To cut a laminate body made of dissimilar materials by a laser beam of single wavelength. SOLUTION: Glass 12 and 16 to transmit the laser forms a silicon substrate 14 and a laminate to absorb the laser. Grooves 13 and 17 to match a cutting line to cut a device chip are formed on a surface to make contact with the silicon substrate 14 of the glass 12 and 16. The laser beam 23 is irradiated on the laminate body 10 while blasting N2 gas 27. The beam 23 is absorbed by the silicon substrate, melted silicon is splashed in the groove 13, and the glass 12 is cut off as the silicon attached in the groove is heated by the laser. The melted silicon is also filled in the groove 17 of the glass 16 through a through hole made on the silicon substrate 14. The glass 16 is cut off as the silicon filled in the groove 17 is heated by the laser. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过单波长的激光束切割由不同材料制成的层压体。解决方案：透射激光的玻璃12和16形成硅衬底14和层压体以吸收激光。在表面上形成与切割线切割装置芯片相匹配的槽13和17，以与玻璃12和16的硅基板14接触。激光束23照射在层叠体10上，同时喷射N2气体27 光束23被硅衬底吸收，熔融的硅溅在槽13中，并且随着附着在槽中的硅被激光加热，玻璃12被切断。熔融的硅也通过在硅衬底14上形成的通孔填充在玻璃16的槽17中。当填充在槽17中的硅被激光加热时，玻璃16被切断。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2012192963A Cushioning material, and packing box 有权
标题翻译：包装材料和包装盒
公开(公告)号：JP2012192963A
公开(公告)日：2012-10-11
申请号：JP2011059244
申请日：2011-03-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： UEDA MASANORI , FURUI JUICHI , NISHIYAMA SHUSAKU
IPC分类号： B65D81/107 , B65D5/50
摘要： PROBLEM TO BE SOLVED: To reduce a size of a cushioning material and absorb energy of a wide range simultaneously.SOLUTION: The cushioning material arranged along an inner circumferential surface of the packing box includes a peak part and a valley part, which are alternately formed, and a wing part continuously formed to a connection part for connecting the peak part and the valley part on an inner side of the peak part. The wing part includes a first edge part positioned inward from a line linking the two adjacent valley parts. The first edge part forms a clearance with an inner circumferential wall of the packing box when it is arranged in the packing box. The cushioning material has a wave shape formed by continuing the peak part and the valley part. When the wave shape is elongated and contracted, an impact of small energy such as vibration is absorbed. In addition, when the wing part is plastically deformed, drop impact or the like of large energy is absorbed.
摘要翻译：要解决的问题：减少缓冲材料的尺寸并同时吸收宽范围的能量。解决方案：沿着包装箱的内周面布置的缓冲材料包括交替形成的峰部和谷部，以及连接到用于连接峰部和谷的连接部的翼部部分在峰部分的内侧。翼部包括从连接两个相邻谷部的线向内定位的第一边缘部。当包装盒布置在包装盒中时，第一边缘部分与包装箱的内周壁形成间隙。缓冲材料具有通过使峰部和谷部继续而形成的波形。当波浪形状伸长并收缩时，吸收诸如振动等小能量的影响。此外，当翼部件塑性变形时，吸收大能量的落下冲击等。版权所有（C）2013，JPO＆INPIT

8. 发明专利

JP2007329153A Method of manufacturing device, dicing method, and dicing device 审中-公开
标题翻译：制造装置的方法，定义方法和定义装置
公开(公告)号：JP2007329153A
公开(公告)日：2007-12-20
申请号：JP2006156980
申请日：2006-06-06
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI
IPC分类号： H01L21/301
CPC分类号： H01L21/78 , B23K26/0006 , B23K26/0081 , B23K26/042 , B23K26/40 , B23K2203/50 , B23K2203/52 , B23K2203/56 , H01L21/6836 , H01L23/544 , H01L2221/68327 , H01L2223/54453 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To fix a device substrate reliably without using any pressure-sensitive adhesive tapes; to enable positioning with an alignment mark as a reference; and to improve yields, in a dicing method or the like for positioning the device substrate where a plurality of devices are fabricated and the alignment mark for positioning is formed, with the alignment mark as a reference for dicing. SOLUTION: The method of manufacturing a device includes: a substrate fixing step of fixing the device substrate 15 onto a clamping base 24 while the device substrate is covered with a coagulator 51 and the coagulator coagulates; a positioning step of heating a partial region in which the alignment mark 12 on the device substrate fixed onto the clamping base is formed locally to fuse a coagulator 51a in the partial region, of observing the alignment mark through the fused coagulator, and of performing positioning with the alignment mark as a reference; and a dicing step of dicing the device substrate for dividing into respective device elements. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：在不使用任何压敏胶带的情况下可靠地固定装置基板; 以使定位与对准标记作为参考; 并且为了提高成品率，以切割方法等来定位其中制造多个器件的器件基板，并且形成用于定位的对准标记，以对准标记作为切割的基准。解决方案：制造装置的方法包括：在装置基板被凝结器51覆盖并且凝结器凝结的同时将装置基板15固定在夹持基座24上的基板固定步骤; 局部地形成固定在夹持基板上的装置基板上的对准标记12的部分区域的加热部分区域中的凝结器51a，通过熔融凝结器观察对准标记并进行定位的定位步骤以对齐标记为参考; 以及切割步骤，将装置基板切割成各自的装置元件。版权所有（C）2008，JPO＆INPIT

9. 发明专利

JP2005347675A Method for manufacturing element having fine structure 审中-公开
标题翻译：制造精细结构元件的方法
公开(公告)号：JP2005347675A
公开(公告)日：2005-12-15
申请号：JP2004168221
申请日：2004-06-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MATSUSHITA NAOHISA , FURUI JUICHI
IPC分类号： H01L21/301 , B29C37/00 , B81C1/00
CPC分类号： B81C1/00873
摘要： PROBLEM TO BE SOLVED: To make a dicing without causing damage to a fine structure and to take out a plurality of diced element together. SOLUTION: In the method for manufacturing an element having a fine structure, a plate-shaped component 10 having a fine structure on a surface is fixed on a chuck 24 by a holding component 26, a substance 36, whose state changes according to temperature variation, is applied on the surface of the holding component 10, the substance is solidified on the surface of the plate-shaped component by cooling the substance 36, the plate-shaped component 10 is diced to a plurality of elements in a state where the substance 36 is solidified, and the separated elements are discharged from the holding component. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：切割而不会造成精细结构的损坏并且将多个切割元件取出在一起。解决方案：在具有精细结构的元件的制造方法中，表面上具有微细结构的板状部件10通过保持部件26固定在卡盘24上，物质36的状态根据在保持部件10的表面上施加温度变化，通过冷却物质36将物质固化在板状部件的表面上，将板状部件10切割成多个状态的元件其中物质36固化，并且分离的元件从保持部件排出。版权所有（C）2006，JPO＆NCIPI

10. 发明专利

JP2005018906A Method and instrument for measuring roll/pitch angle of magnetic disk suspension 审中-公开
标题翻译：用于测量磁悬浮悬挂/倾斜角的方法和仪器
公开(公告)号：JP2005018906A
公开(公告)日：2005-01-20
申请号：JP2003182038
申请日：2003-06-26
申请人： Fujitsu Ltd , 富士通株式会社
发明人： FURUI JUICHI
IPC分类号： G01B11/26 , G11B21/21
摘要： PROBLEM TO BE SOLVED: To provide an accurate and stable method for measuring the roll/pitch angle of a magnetic disk and to provide an instrument therefor.
SOLUTION: This instrument is constituted of: a moving means for fixing a suspension 1 to a XY stage 12 and moving the stage 12 or a laser displacement meter 7; a data acquiring means for acquiring XY stage coordinate data as XY coordinates and the measured data of the laser displacement meter as a Z coordinate by moving the stage 12 or the laser displacement meter 7 with the moving means; a calculating means 10 for measuring the XYZ coordinates and calculating a roll angle and a pitch angle from the measurements of the coordinates of three or more points; and a storing means for storing the three sets of data of XY stage coordinate data obtained simultaneously by scanning on a head with the laser displacement meter 7, laser displacement meter displacement data, and data indicating whether return light exists at laser irradiation in a storage region 14 as a single set or by correlating the data sets.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于测量磁盘的滚动/俯仰角的精确和稳定的方法，并提供一种用于其的仪器。解决方案：该仪器由以下部件构成：用于将悬架1固定到XY平台12并移动台架12或激光位移计7的移动装置; 数据获取装置，通过用移动装置移动台12或激光位移计7，将XY平台坐标数据作为XY坐标和激光位移计的测量数据作为Z坐标; 计算装置10，用于根据三点或更多点的坐标的测量值来测量XYZ坐标并计算滚动角度和俯仰角; 以及存储装置，用于存储通过用激光位移计7在头部上同时扫描得到的三组数据的XY组坐标数据，激光位移计位移数据和指示在存储区域中是否存在激光照射的返回光的数据 14作为单个集合或通过关联数据集。版权所有（C）2005，JPO＆NCIPI

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