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1. 发明专利

JP2007027549A Ic chip packaging method 有权
标题翻译： IC芯片包装方法
公开(公告)号：JP2007027549A
公开(公告)日：2007-02-01
申请号：JP2005209965
申请日：2005-07-20
申请人： Fujitsu Frontech Ltd , Fujitsu Ltd , 富士通フロンテック株式会社 , 富士通株式会社
发明人： ISHIKAWA NAOKI , BABA SHUNJI , KIRA HIDEHIKO , KOBAYASHI HIROSHI , KIKUCHI SHUNICHI , TSUNENO TATSURO
IPC分类号： H01L21/60 , H01L25/04 , H01L25/18
CPC分类号： G06K19/07749 , H01L21/67132 , H01L21/67144 , H01L21/6835 , H01L21/6836 , H01L24/75 , H01L24/81 , H01L24/97 , H01L2221/68327 , H01L2221/68354 , H01L2223/6677 , H01L2224/16 , H01L2224/73204 , H01L2224/75 , H01L2224/75252 , H01L2224/75314 , H01L2224/7565 , H01L2224/75745 , H01L2224/7598 , H01L2224/81001 , H01L2224/81005 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/81907 , H01L2224/83192 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/81
摘要： PROBLEM TO BE SOLVED: To improve productivity for an IC chip packaging method for packaging a plurality of IC chips on a base. SOLUTION: A surface at a side opposite to a mount surface on the base is mounted by a tape, the tape is allowed to leave by dicing, and a wafer separated for each IC chip is prepared. The wafer is allowed to oppose the base in a direction where the mount surface on the base opposes the base. The base is fed in a prescribed one-dimensional direction along the wafer, the wafer is moved two-dimensionally along the base, IC chips on the wafer are pressed onto the base successively and are tentatively fixed on the base, and the plurality of IC chips tentatively fixed on the base are heated and pressurized collectively, thus fixing the plurality of IC chips on the base. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提高在基底上封装多个IC芯片的IC芯片封装方法的生产率。解决方案：通过带子安装在与基座上的安装表面相对的一侧的表面，通过切割使带子离开，并且准备用于每个IC芯片的晶片分离。允许晶片在基座上的安装表面与基座相对的方向上与基座相对。基板沿着晶片以规定的一维方向进给，晶片沿着基座二维地移动，晶片上的IC芯片依次被压到基板上，暂时固定在基板上，并且多个IC 临时固定在基座上的芯片被集体加热和加压，从而将多个IC芯片固定在基座上。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006172190A Rfid tag 有权
标题翻译： RFID标签
公开(公告)号：JP2006172190A
公开(公告)日：2006-06-29
申请号：JP2004364590
申请日：2004-12-16
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KIKUCHI SHUNICHI , SUZUKI MASUMI , AOKI MICHIMASA
IPC分类号： G06K19/077 , B32B9/04 , G06K19/00 , G06K19/07 , H01L23/36
CPC分类号： G06K19/0773 , B31D1/028 , G06K19/07749 , H01L2224/16 , H01L2924/00014 , H01L2924/15153 , H01L2924/1517 , H01L2924/3025 , Y10T29/49117 , Y10T156/10 , Y10T156/1056 , Y10T156/1062 , H01L2224/0401
摘要： PROBLEM TO BE SOLVED: To provide an RFID (Radio Frequency IDentification) tag that excels in thermal diffusion. SOLUTION: The RFID tag comprises a base, an antenna pattern provided on the base to form a communication antenna, a circuit chip electrically connected to the antenna pattern to establish radio communication via the antenna, a cover brought in close contact with the base over the antenna pattern except for a predetermined area including the circuit chip, and an insulating thermal diffusion material higher in thermal conductivity than the cover, covering the predetermined area and brought in thermal contact with the circuit chip. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供在热扩散中优异的RFID（射频识别）标签。解决方案：RFID标签包括基座，设置在基座上以形成通信天线的天线图案，电连接到天线图案的电路芯片，以通过天线建立无线电通信，与基于除了包括电路芯片的预定区域之外的天线图案，以及覆盖预定区域并且与电路芯片热接触的比导热系数高于盖的绝缘热扩散材料。版权所有（C）2006，JPO＆NCIPI

3. 发明专利

JP2003294661A Method and apparatus for measuring thermal capacity of component 审中-公开
标题翻译：测量元件热容量的方法和装置
公开(公告)号：JP2003294661A
公开(公告)日：2003-10-15
申请号：JP2002093655
申请日：2002-03-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： YAMADA MITSUTAKA , YAMAMOTO TAKESHI , IKETAKI KENJI , AZUMA SHUJI , KIKUCHI SHUNICHI
IPC分类号： G01N25/18
摘要： PROBLEM TO BE SOLVED: To provide a thermal capacity measurement method and a thermal capacity measurement apparatus for measuring a thermal capacity of a component which put the component in a container with a small thermal capacity, fill a cooling medium at a fixed temperature into the container, measure an equilibrium temperature, simply, easily and rapidly measure the thermal capacity of the component, and reduce a temperature difference on a printed board based on a measurement value when processed by reflow soldering.
SOLUTION: The thermal capacity measurement method has a step for measuring weight of the component and heating the component until a predetermined temperature T1; a step for measuring weight of the cooling medium and heating the cooling medium until a predetermined temperature T2; a step for putting the component in the container and filling the cooling medium into the container; a step for measuring a temperature of the component, the filled cooling medium or the container, and detecting the equilibrium temperature; and a step for calculating the thermal capacity of the component based on the measured equilibrium temperature, the weight of the component, the predetermined temperature T1; the weight the weight of the cooling medium, and the predetermined temperature T2.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供热容量测量方法和热容量测量装置，用于测量将部件放置在具有小热容量的容器中的部件的热容量，在固定温度下填充冷却介质进入容器，测量平衡温度，简单，容易和快速地测量部件的热容量，并且通过回流焊接处理时基于测量值减小印刷电路板上的温差。解决方案：热容量测量方法具有测量部件的重量并加热部件直到预定温度T1的步骤; 测量冷却介质的重量并加热冷却介质直至预定温度T2的步骤; 将组件放入容器并将冷却介质填充到容器中的步骤; 用于测量部件，填充的冷却介质或容器的温度并检测平衡温度的步骤; 以及基于测量的平衡温度，部件的重量，预定温度T1来计算部件的热容量的步骤; 冷却介质的重量和预定温度T2。版权所有（C）2004，JPO

4. 发明专利

JP2011243897A Multilayer printed board and method of manufacturing the same 审中-公开
标题翻译：多层印刷板及其制造方法
公开(公告)号：JP2011243897A
公开(公告)日：2011-12-01
申请号：JP2010117011
申请日：2010-05-21
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KANAI AKIRA , KIKUCHI SHUNICHI , NAKAMURA NAOKI , SUGINO SHIGERU , HATANAKA KIYOYUKI , TAKETOMI NOBUO
IPC分类号： H05K3/46
CPC分类号： H05K1/185 , H01L23/4985 , H01L23/5389 , H01L24/73 , H01L2224/0401 , H01L2224/06181 , H01L2224/16225 , H01L2224/32225 , H01L2224/33181 , H01L2224/73267 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07811 , H01L2924/12042 , H05K1/186 , H05K3/4602 , H05K3/4691 , H05K2201/10681 , H05K2201/10734 , H05K2203/063 , H05K2203/1469 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a multilayer printed board that allows wiring patterns of the board to be designed in high density without restricting the location of terminals of a semiconductor device, and to provide a method of manufacturing the same.SOLUTION: A multilayer printed board 2 comprises a semiconductor package 1 including a flexible wiring layer 14b with a free-end edge, and the flexible wiring 14 b is electrically connected to an inner wiring layer 24c in the printed board.
摘要翻译：要解决的问题：提供一种多层印刷电路板，其允许在不限制半导体器件的端子的位置的情况下高密度地设计电路板的布线图案，并提供其制造方法。解决方案：多层印刷电路板2包括半导体封装1，其包括具有自由端边缘的柔性布线层14b，并且柔性布线14b与印刷电路板中的内部布线层24c电连接。版权所有（C）2012，JPO＆INPIT

5. 发明专利

JP2006260205A Rfid tag, modular component and rfid tag manufacturing method 审中-公开
标题翻译： RFID标签，模块化组件和RFID标签制造方法
公开(公告)号：JP2006260205A
公开(公告)日：2006-09-28
申请号：JP2005077108
申请日：2005-03-17
申请人： Fujitsu Ltd , 富士通株式会社
发明人： ISHIKAWA NAOKI , BABA SHUNJI , KIRA HIDEHIKO , KOBAYASHI HIROSHI , KIKUCHI SHUNICHI
IPC分类号： G06K19/077 , B42D15/10 , G06K19/07
CPC分类号： G06K19/0775 , G06K19/07749 , H01L24/11 , H01L2224/05001 , H01L2224/05023 , H01L2224/05568 , H01L2224/1134 , H01L2224/131 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/14 , H01L2224/13099 , H01L2924/00 , H01L2224/05599
摘要： PROBLEM TO BE SOLVED: To solve the problem of the change of tag characteristics to be generated due to the swelling of paste materials by adopting paste as the materials of an antenna.
SOLUTION: This RFID tag is provided with: a first section where an antenna is formed on a first base with paste; and a second section loaded on the first section and equipped with a metallic patch formed on a second base and electrically connected to the antenna on the first section, and a circuit chip connected through a bump to the metallic patch and configured to perform radio communication through the antenna.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了解决由于通过采用糊料作为天线的材料而导致由于糊剂材料膨胀而产生的标签特性变化的问题。解决方案：该RFID标签设置有：第一部分，其中天线在第一基座上形成有糊状物; 以及第二部分，其装载在所述第一部分上，并且配备有形成在第二基座上并且电连接到所述第一部分上的所述天线的金属贴片，以及电路芯片，其通过凸块连接到所述金属接线片，并且被配置为通过天线。版权所有（C）2006，JPO＆NCIPI

6. 发明专利

JP2011119616A Method for manufacturing printed wiring board, printed wiring board, and electronic device 审中-公开
标题翻译：制造印刷线路板，印刷线路板和电子设备的方法
公开(公告)号：JP2011119616A
公开(公告)日：2011-06-16
申请号：JP2009277892
申请日：2009-12-07
申请人： Fujitsu Ltd , 富士通株式会社
发明人： TAKETOMI NOBUO , KIKUCHI SHUNICHI , NAKAMURA NAOKI , HATANAKA KIYOYUKI , SUGINO SHIGERU , KANAI AKIRA
IPC分类号： H05K3/46
CPC分类号： H05K3/4694 , H05K1/0269 , H05K3/429 , H05K3/4602 , H05K3/4611 , H05K2201/0187 , H05K2201/09918 , H05K2201/09972 , H05K2203/061 , H05K2203/063 , H05K2203/167
摘要： PROBLEM TO BE SOLVED: To provide a printed wiring board that has a smooth surface, and is made partially multilayered and has high degree of freedom of design.
SOLUTION: A method for manufacturing the printed circuit board includes the processes of: laterally-aligning a first inner-layer substrate in which first insulation layers and first conductor layers are laminated and integrated, and a second inner-layer substrate in which second insulation layers and second conductor layers are laminated and integrated and which has the number different from the number of the layer of the first inner-layer substrate; placing the laterally-aligned first inner-layer substrate and second inner-layer substrate between a pair of third insulation layers and pressing them in a thickness direction of a pair of surface-layer substrates; and printing a conductor pattern on surfaces of the pair of third insulation layers respectively.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种具有光滑表面并且部分多层并具有高自由度设计的印刷线路板。解决方案：印刷电路板的制造方法包括：将第一绝缘层和第一导体层层叠并一体化的第一内层基板横向排列的工序;第二内层基板，其中第二绝缘层和第二导体层被层叠并整合，其数量与第一内层基板的层数不同; 将横向排列的第一内层基板和第二内层基板放置在一对第三绝缘层之间，并在一对表面层基板的厚度方向上按压它们; 以及分别在所述一对第三绝缘层的表面上印刷导体图案。版权所有（C）2011，JPO＆INPIT

7. 发明专利

JP2006201895A Authentication key and apparatus 审中-公开
标题翻译：认证钥匙和装置
公开(公告)号：JP2006201895A
公开(公告)日：2006-08-03
申请号：JP2005011103
申请日：2005-01-19
申请人： Fujitsu Ltd , 富士通株式会社
发明人： KIKUCHI SHUNICHI
IPC分类号： G06K19/10 , G06F21/20 , G06K17/00 , G06K19/06 , G06K19/07 , G09C5/00 , H04L9/32
CPC分类号： G07C9/00111
摘要： PROBLEM TO BE SOLVED: To effectively reduce the risk that information may be read by another person. SOLUTION: With respect to authentication keys 11a, 11b formed by performing surface process on an article such as an artificial tooth 10, the authentication keys 11a, 11b are irradiated with an electromagnetic wave and an ultrasonic wave. Or, the images of the authentication keys 11a, 11b are photographed and analyzed. Thus, authentication key information in regard to the authentication on whether or not a right to access the information related to the article is possessed is read from the authentication keys 11a, 11b formed by the process performed on the article itself. Based on the read authentication key information, the authentication on whether or not the right to access the information related to the article is possessed is authenticated. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：有效降低其他人可能读取信息的风险。解决方案：对于通过对诸如人造牙齿10的物品进行表面处理形成的认证密钥11a，11b，用电磁波和超声波照射认证密钥11a，11b。或者，对认证密钥11a，11b的图像进行拍摄和分析。因此，从通过对物品本身执行的处理形成的认证密钥11a，11b读取关于是否拥有访问与该物品相关的信息的权限的认证的认证密钥信息。基于读取的认证密钥信息，认证是否拥有访问与该物品有关的信息的权限。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JPH11167944A I/O PIN WITH SOLDER DAM FOR CONNECTING BOARDS 失效
公开(公告)号：JPH11167944A
公开(公告)日：1999-06-22
申请号：JP19328098
申请日：1998-07-08
申请人： FUJITSU LTD
发明人： SUEHIRO MITSUO , OSAWA TAKUMI , KIKUCHI SHUNICHI
IPC分类号： H05K1/14 , H01R9/09
摘要： PROBLEM TO BE SOLVED: To provide an I/O pin capable of surely preventing the breakage of an MCM(multi-chip module) caused by the flow of solder from the tip of the I/O pin to its root in the soldering of the I/O pin in mounting of the MCM. SOLUTION: One end of this I/O pin 1a is fixed erect to an MCM, and the other end is soldered to the specified portion of a motherboard for electrical connection. A solder dam made of a nickel plating layer with low solder wettability, high heat resistant resin layer or a high temperature solder layer is formed in the middle part of the I/O pin, so as have the flow of solder from the other end side to the one end side obstructed.

9. 发明专利

JPH08222665A HEAT SINK 失效
公开(公告)号：JPH08222665A
公开(公告)日：1996-08-30
申请号：JP2800795
申请日：1995-02-16
申请人： FUJITSU LTD
发明人： KIKUCHI SHUNICHI , NORI HITOSHI , YAMAMOTO HARUHIKO
IPC分类号： H01L23/36
摘要： PURPOSE: To obtain a heat sink for cooling an electronic device, e.g. a semiconductor device, having large heat dissipation area which can be mass produced. CONSTITUTION: The heat sink comprises a base plate 31, a plurality of fins 32 standing in parallel on the base plate 31, and a plurality of protrusions 35 having substantially semicircular cross-section provided for each fin while standing vertically on the base plate 31.

10. 发明专利

JPH0758276A MULTICHIP MODULE 失效
公开(公告)号：JPH0758276A
公开(公告)日：1995-03-03
申请号：JP20073693
申请日：1993-08-12
申请人： FUJITSU LTD
发明人： SEYAMA KIYOTAKA , KIKUCHI SHUNICHI , SUMIYOSHI MAKOTO , YASUDA NAOKI , HIRANO MINORU , NORI HITOSHI
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46
摘要： PURPOSE:To obtain the title module which is low-cost, whose density is high, whose speed is high and whose design and manufacture are flexible. CONSTITUTION:The title module is constituted so as to be provided with a base board 30, with a thin-film multilayer circuit board 32 which is formed on the first face of the base board and in which insulating layers and wiring conductors are laminated alternately, with circuit elements 14, 16 which are formed on the main face of the thin-film multilayer circuit board and with terminals 34 which are supported on the main face of the thin-film multulayer circuit board and by which wiring conductors are connected to an external circuit formed on a wiring board.

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