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1. 发明专利

JPH04219991A CONNECTION OF PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH04219991A
公开(公告)日：1992-08-11
申请号：JP41245690
申请日：1990-12-20
申请人： FUJITSU LTD
发明人： KUWAHARA KIYOSHI , OSHIMA OSAMU , SAKAI HIDEHISA , SUMIYOSHI MAKOTO
IPC分类号： G01R31/28 , H05K1/11 , H05K3/36
摘要： PURPOSE:To enhance the connecting reliability of a printed-circuit board using a surface-contact type connector. CONSTITUTION:A surface-contact type connector 2 which is used to connect a printed-circuit board 1 to an object 3 to be connected is provided with the following: the printed-circuit board 1; and at least one pair of dummy contacts 5 corresponding to dummy pads 4 formed on the object 3 to be connected of the printed-circuit board 1. Dummy pads 4 formed on the printed-circuit board 1 are short-circuited. When the printed-circuit board 1 is connected to the object 3 to be connected, the continuity between the dummy pads 4 formed on the object 3 to be connected is confirmed and whether their connection is good or not is detected by means of their continuity state.

2. 发明专利

JPH0758276A MULTICHIP MODULE 失效
公开(公告)号：JPH0758276A
公开(公告)日：1995-03-03
申请号：JP20073693
申请日：1993-08-12
申请人： FUJITSU LTD
发明人： SEYAMA KIYOTAKA , KIKUCHI SHUNICHI , SUMIYOSHI MAKOTO , YASUDA NAOKI , HIRANO MINORU , NORI HITOSHI
IPC分类号： H01L25/18 , H01L21/60 , H01L23/12 , H01L23/498 , H01L25/04 , H01L25/065 , H05K1/14 , H05K3/34 , H05K3/36 , H05K3/46
摘要： PURPOSE:To obtain the title module which is low-cost, whose density is high, whose speed is high and whose design and manufacture are flexible. CONSTITUTION:The title module is constituted so as to be provided with a base board 30, with a thin-film multilayer circuit board 32 which is formed on the first face of the base board and in which insulating layers and wiring conductors are laminated alternately, with circuit elements 14, 16 which are formed on the main face of the thin-film multilayer circuit board and with terminals 34 which are supported on the main face of the thin-film multulayer circuit board and by which wiring conductors are connected to an external circuit formed on a wiring board.

3. 发明专利

JPH0661607A MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JPH0661607A
公开(公告)日：1994-03-04
申请号：JP21057292
申请日：1992-08-07
申请人： FUJITSU LTD
发明人： SUMIYOSHI MAKOTO
IPC分类号： H01L21/60 , H05K1/02 , H05K1/18
摘要： PURPOSE:To prevent troubles due to thermal expansion by conducting a detecting bump or a detecting contact pin and a pattern and measuring electric resistance thereby detecting abnormality at the bump or the joint of contact pin. CONSTITUTION:A pattern 6 interconnects detecting pins 8 or contact pins 9 arranged at the opposite ends of a row of bumps 4 or contact pins 5 while detecting pads 7 corresponding with the detecting pads a or the detecting contact pins 9 to be connected therewith are provided on a board 1. The detecting pads 7 allow measurement of electric resistance R between the pattern 6 and the detecting bump 8 or the detecting contact pin 9. Increase of the electric resistance R means occurrence of abnormality at the joint of the detecting bump 8 or the detecting contact pin 9 and the detecting pad 7. This constitution can prevent troubles due to thermal expansion.

4. 发明专利

JPH04219966A SEMICONDUCTOR ELEMENT 失效
公开(公告)号：JPH04219966A
公开(公告)日：1992-08-11
申请号：JP41245790
申请日：1990-12-20
申请人： FUJITSU LTD
发明人： KUWAHARA KIYOSHI , SEYAMA KIYOTAKA , SUMIYOSHI MAKOTO , SAKAI HIDEHISA
IPC分类号： H01L25/18 , H01L25/065 , H01L25/07
摘要： PURPOSE:To enhance the mounting efficiency of a semiconductor element. CONSTITUTION:A plurality of chip holding seats 3 are formed at the inside of a package main body 2 where external terminals 1 are formed on its one face. A semiconductor chip 4 is fixed and bonded to each chip holding seat 3. Said semiconductor chip 4 is connected to the external terminals 1 by using proper means. Said semiconductor chip 4 is sealed with a sealing cap 5.

5. 发明专利

JP2005234922A Request method, request system and storage medium 审中-公开
标题翻译：请求方法，请求系统和存储介质
公开(公告)号：JP2005234922A
公开(公告)日：2005-09-02
申请号：JP2004043872
申请日：2004-02-20
申请人： Fujitsu Ltd , 富士通株式会社
发明人： AKAI TAKAO , SUMIYOSHI MAKOTO , ICHIKAWA MIKI
IPC分类号： G06Q10/00 , G06Q50/00 , G06Q50/10 , G06F17/60
摘要： PROBLEM TO BE SOLVED: To enable the direct and rapid response from a request destination of final answer to a requester, even if a processing request is sequentially transmitted to request destinations in multistage, and the sure communication of receipt of an answer to an intermediate request destination in a requesting method, a request program and a request system for transmitting a request from the requester to a request destination and receiving an answer for it. SOLUTION: This method comprises a step of transmitting request information with a request content and address information of the requester from the requester to a requesting destination, and a step of repeating procedures of setting and transmitting, in case that the request destination which received the transmission can respond to the request content, an answer and the request information with address information of this request destination to the address of the requester, and transmitting, in case that the request destination cannot respond thereto, the request information with the address information of the requester to another request destination. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：即使处理请求被顺序地发送到多级请求目的地，为了使来自请求者的最终答复的请求目的地的直接和快速的响应，以及对答复的接收的肯定的通信在请求方法中的中间请求目的地，请求程序和用于将请求从请求者发送到请求目的地并接收其答复的请求系统。解决方案：该方法包括以请求内容的请求信息和请求者的地址信息从请求者发送到请求目的地的步骤，以及重复执行设置和发送步骤的步骤，在请求目的地接收到的传输可以响应请求内容，应答和具有该请求目的地的地址信息的请求信息到请求者的地址，并且在请求目的地不能响应的情况下，发送具有地址信息的请求信息的请求者到另一个请求目的地。版权所有（C）2005，JPO＆NCIPI

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