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1. 发明专利

JP2014110413A Wafer cleaning/drying device and wafer cleaning/drying method 有权
标题翻译：清洗干燥装置和清洗干燥方法
公开(公告)号：JP2014110413A
公开(公告)日：2014-06-12
申请号：JP2012265722
申请日：2012-12-04
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社 , National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所
发明人： NAKAMURA YOSHIO , OTSUKA YOSHIO , OKUBO TAKASHI , SHIBUYA KAZUTAKA , HARA SHIRO , KUMPUAN SOMAWANG , IKEDA SHINICHI
IPC分类号： H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a wafer cleaning/drying device which allows size reduction of the device and can prevent wafer contamination by particle adhesion.SOLUTION: A wafer cleaning/drying device 10 comprises: a washing tank 12 whose upper part is formed to be a cylindrical part 14 and into which cleaning liquid flows; a rotor 20 formed into a cylinder connected to the washing tank 12, whose lower part side is fitted onto the cylindrical part 14 of the washing tank 12 so as to be arranged rotatably around a center axis of the cylindrical part and whose opening edge on an upper surface side is formed as a mounting part for a wafer 22 to be cleaned and dried; a driving part 26 which rotationally drives the rotor 20; and a bearing formed between the lower part of the rotor 20 and the cylindrical part 14 of the washing tank 12.
摘要翻译：要解决的问题：提供一种晶片清洗/干燥装置，其允许装置的尺寸减小并且可以防止颗粒粘附的晶片污染。解决方案：晶片清洁/干燥装置10包括：清洗槽12，其上部形成为是一个圆筒部分14，清洗液流入其中; 形成为连接到洗涤槽12的气缸的转子20，其下部侧装配在洗涤槽12的圆筒部14上，以便围绕圆筒部的中心轴线可旋转地设置，并且其开口边缘在上表面侧形成为用于待清洗和干燥的晶片22的安装部分; 旋转驱动转子20的驱动部26; 以及形成在转子20的下部和洗涤槽12的圆筒部14之间的轴承。

2. 发明专利

JP2007069279A Method and tool for adhering polishing pad 有权
标题翻译：用于加工抛光垫的方法和工具
公开(公告)号：JP2007069279A
公开(公告)日：2007-03-22
申请号：JP2005256511
申请日：2005-09-05
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , KOYAMA HARUMICHI
IPC分类号： B24B37/08 , B24B37/20 , H01L21/304
CPC分类号： B24D9/085 , B24B37/08
摘要： PROBLEM TO BE SOLVED: To easily and precisely perform the work of adhering a polishing pad on an upper surface plate of a both-side polishing device. SOLUTION: The polishing pad 10 is temporarily adhered to each polishing surface of the upper surface plate 30 and a lower surface plate 20 of the both-side polishing device. A roller device 200 having a roller body 230 rotatably provided at a shaft 220 mounted to a sun gear 80 and an internal tooth gear 70 and formed with a spiral projecting part 232 of a required width on an outside surface is mounted, and is mounted on the lower surface plate 20 in the radial direction. The upper surface plate 30 is lowered up to a position where the upper surface plate 30 is abutted on the roller body 230 by a supporting device 60. The upper and lower surface plates 30 and 20 are rotated at equal speed in mutual opposite directions, while pressurizing the roller body 230 by the upper surface plate 30, and polishing pad 10 is simultaneously adhered to the upper and lower surface plates 30 and 20. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了容易且精确地执行将抛光垫粘附在双面抛光装置的上表面板上的工作。解决方案：抛光垫10临时粘附到上表面板30的每个抛光表面和两面抛光装置的下表面板20。具有可旋转地设置在安装在太阳齿轮80上的轴220和内齿齿轮70上并且形成有外表面上所需宽度的螺旋突出部232的辊体230的滚筒装置200安装在下表面板20沿径向方向。上表面板30被降低到上表面板30通过支撑装置60抵靠在辊主体230上的位置。上表面板30和下表面板20以相等的相反方向旋转，同时通过上表面板30对辊主体230加压，并且抛光垫10同时粘附到上表面板30和下表面板20上。版权所有（C）2007，JPO＆INPIT

3. 发明专利

JP2007157169A Flow control system of cooling water supply device in semiconductor manufacturing device 审中-公开
标题翻译：半导体制造装置中冷却水供应装置的流量控制系统
公开(公告)号：JP2007157169A
公开(公告)日：2007-06-21
申请号：JP2007004811
申请日：2007-01-12
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , HASEGAWA TAKESHI , SEKI TOSHIAKI , OGAWA MITSUE
IPC分类号： G05D7/06 , H01L21/02
摘要： PROBLEM TO BE SOLVED: To provide a flow control system capable of automatically adjusting flow rate.
SOLUTION: This system comprises a branch conduit for supplying cooling water to each semiconductor manufacturing device 51-53; a branch pipe flow control valve; a semiconductor manufacturing device operation part for inputting a setting condition of flow rate of cooling water; a branch pipe flow sensor; a semiconductor manufacturing device instruction processing part including a flow control comparator outputting a signal related to control of the branch pipe flow control valve; an automatic input means 50 automatically inputting a setting condition that is the total sum of supply quantity of cooling water to each semiconductor device; an operation part 32 receiving the setting condition input by the automatic input means 50; a flow control valve 34 provided in a common conduit 16; a flow sensor 26 for detecting the flow rate of cooling water within the common conduit 16; and an instruction processing part 40 including a flow control comparator 36 for comparing a set signal inputted from the operation part 32 with a detection signal by the flow sensor 26 and outputting a signal related to control of the flow control valve 34.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够自动调节流量的流量控制系统。解决方案：该系统包括用于向每个半导体制造装置51-53供应冷却水的分支导管; 分支管流量控制阀; 半导体制造装置操作部，其输入冷却水的流量的设定条件; 支管流量传感器; 半导体制造装置指令处理部，其包括：流量控制比较器，输出与分支管流量控制阀的控制有关的信号; 自动输入装置50自动输入作为每个半导体装置的冷却水供给量的总和的设定条件; 接收由自动输入装置50输入的设定条件的操作部32; 设置在公共管道16中的流量控制阀34; 用于检测公共管道16内的冷却水的流量的流量传感器26; 以及指令处理部40，其包括用于将从操作部32输入的设定信号与流量传感器26的检测信号进行比较的流量控制比较器36，并输出与流量控制阀34的控制有关的信号。（C）2007，JPO＆INPIT

4. 发明专利

JP2007105854A Method for adhering grinding pad, and fixture for adhering grinding pad 有权
标题翻译：用于加工研磨垫的方法和用于加工研磨垫的装置
公开(公告)号：JP2007105854A
公开(公告)日：2007-04-26
申请号：JP2005301330
申请日：2005-10-17
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , KOYAMA HARUMICHI
IPC分类号： B24B37/08 , B24B37/12 , B24B37/20 , H01L21/304
CPC分类号： B24B7/17 , B24B37/08 , B24D9/085
摘要： PROBLEM TO BE SOLVED: To facilitate an operation for adhering a grinding pad to upper and lower surface plates. SOLUTION: This method for adhering a grinding pad in a double-sided grinding device comprises a step for setting a carrier dedicated for adhering a pad fixed while a roller device 48 for pressurizing the grinding pad is positioned in a through hole in a manner that the roller device 48 is directed to a radial direction of upper and lower surface plates 14, 16, a step for making the upper and lower surface plates 14 and 16 relatively approach to each other and nipping the roller device 48 by the upper and lower surface plates 14, 16 with a predetermined pressuring force, and a step for rotating the upper and lower surface plates 14, 16 in opposite directions at identical speed, and pressing and adhering the grinding pad to grinding faces of the upper and lower surface plates 14, 16 by the roller device 48. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了便于将研磨垫粘附到上表面板和下表面板上的操作。解决方案：用于将研磨垫粘合在双面研磨装置中的方法包括：将用于加压研磨垫的辊装置48定位在通孔中的专用于固定的垫的固定用托架的步骤辊装置48指向上表面板14和下表面板16的径向的方式，使上表面板14和下表面板16相互靠近并将辊装置48夹在上面和下表面板14和16的步骤下表面板14,16具有预定的加压力，以及用于以相同的速度沿相反方向旋转上表面板14和下表面板16的步骤，并将研磨垫按压并粘附到上表面板和下表面板的研磨面 14，16由辊装置48.版权所有（C）2007，JPO＆INPIT

5. 发明专利

JP2006212739A Polishing device 有权
标题翻译：抛光装置
公开(公告)号：JP2006212739A
公开(公告)日：2006-08-17
申请号：JP2005028504
申请日：2005-02-04
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： NAKAMURA YOSHIO , NAKAMURA MITSUHIRO
IPC分类号： B24B37/08 , B24B37/27 , B24B37/28 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a polishing device capable of preventing a workpiece from being flawed by abrasive powder while preventing the wear of a tooth part of a gear to attain a long service life. SOLUTION: The polishing device polishes the workpiece by an upper surface plate and a lower surface plate by engaging external teeth 13a of a carrier 13 for holding the workpiece, with internal teeth of an outer pin gear 11 and external teeth of an inner pin gear 12 respectively to rotate and revolve the carrier 13. At least one of the internal teeth of the outer pin gear 11 and the external teeth of the inner pin gear 12 is formed of a plurality of tooth parts 20, 30 provided at circumferentially constant spaces at the pin rings 11b, 12b, and having pin bodies 22 projected upward and supported to the pin rings 11b, 12b rotatably around axes, and cylindrical collars 24 rotatably fitted to the outer peripheries of the pin bodies 22. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够防止工件由磨料粉碎而发生磨损的抛光装置，同时防止齿轮的齿部磨损达到较长的使用寿命。解决方案：抛光装置通过接合用于保持工件的载体13的外齿13a与外销齿轮11的内齿和内部齿的外齿啮合，通过上表面板和下表面板抛光工件销齿轮12分别旋转和旋转载体13.外销齿轮11的内齿和内销齿轮12的外齿中的至少一个由多个设置在周向上恒定的齿部20,30形成销环11b，12b处的空间，并且具有向上突出并且可绕轴线可旋转地支撑到销环11b，12b的销体22以及可旋转地装配到销主体22的外周的圆柱形套环24。（C）2006，JPO＆NCIPI

6. 发明专利

JP2003080453A Double-surface polishing device 有权
标题翻译：双面抛光装置
公开(公告)号：JP2003080453A
公开(公告)日：2003-03-18
申请号：JP2002245389
申请日：2002-08-26
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社
发明人： ODAGIRI FUMINARI , NAKAMURA YOSHIO , DENDA YASUHIDE , SUMIZAWA HARUO
IPC分类号： B24B37/08 , H01L21/304 , B24B37/04
摘要： PROBLEM TO BE SOLVED: To efficiently utilize a polishing surface of a surface plate preferably coping with a large size of a work, to make a constitution uncomplex and to reduce a manufacturing cost. SOLUTION: The double-surface polishing device is provided with a carrier 12 in which through-holes 12 are provided on a thin flat plate; and upper and lower surface plates 14, 16 for clamping plate-like wafers 10 disposed in the through-holes 12a of the carrier 12 from a vertical direction and relatively moved against the wafer to polish them. The polishing device is provided with a carrier circular motion mechanism 20 in which the carrier 12 is subjected to a circular motion without revolving in a surface parallel to a surface of the carrier 12 and which turns and moves the wafer 10 retained between the upper and lower surface plates 14, 16 in the through-hole 12a.
摘要翻译：要解决的问题：为了有效地利用优选处理大尺寸工件的表面板的抛光表面，使结构不复杂并降低制造成本。解决方案：双面抛光装置设置有载体12，其中通孔12设置在薄平板上; 以及用于夹持从垂直方向设置在载体12的通孔12a中的板状晶片10并且相对于晶片相对移动以对其进行抛光的上表面板14和下表面板16。抛光装置设置有载体圆周运动机构20，其中载体12经受圆形运动，而不在与载体12的表面平行的表面中旋转，并且转动并移动保持在上下的晶片10 通孔12a中的表面板14,16。

7. 发明专利

JP2014132642A Wafer polishing apparatus 有权
标题翻译：抛光抛光装置
公开(公告)号：JP2014132642A
公开(公告)日：2014-07-17
申请号：JP2013244542
申请日：2013-11-27
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社 , National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所
发明人： NAKAMURA YOSHIO , OTSUKA YOSHIO , OKUBO TAKASHI , SHIBUYA KAZUTAKA , FUSE TAKAYUKI , HARA SHIRO , KUMPUAN SOMAWANG , IKEDA SHINICHI
IPC分类号： H01L21/304 , B24B37/00 , B24B37/10 , B24B37/16 , B24B37/20 , B24B37/26 , B24B37/34
CPC分类号： B24B7/228 , B24B37/105 , B24B37/16 , B24B37/26 , B24B37/30 , B24B37/345 , B24B53/017
摘要： PROBLEM TO BE SOLVED: To provide a compact wafer polishing apparatus.SOLUTION: A wafer polishing apparatus 10 presses a wafer 16 held on a polishing head 30 on a polishing cloth of a surface plate 18, and relatively moves the surface plate 18 and the polishing head 30 while supplying a polishing solution, to polish the wafer 16. A plurality of surface plates 18 provided in a concentric shape respectively have pasted polishing cloths, and include polishing zones 40, 41 having necessary widths to enable polishing the wafer 16 and grooves 42, disposed between the polishing zones 40, 41, for exhausting the polishing solution. A cleaning unit 44 for the polishing head 30 or a cleaning unit 25 for cleaning the wafer after polished is disposed at the central part of each surface plate 18 located inside the innermost polishing zone 41.
摘要翻译：要解决的问题：提供一种紧凑的晶片抛光装置。解决方案：晶片抛光装置10将保持在抛光头30上的晶片16压在表面板18的抛光布上，并相对移动表面板18和抛光在提供抛光溶液的同时提供抛光溶液，以抛光晶片16.多个以同心形状设置的表面板18分别具有粘贴的抛光布，并且包括具有必要宽度的抛光区域40,41，以能够抛光晶片16和凹槽42 ，设置在抛光区域40,41之间，用于排出抛光溶液。用于抛光头30的清洁单元44或用于清洁抛光后的晶片的清洁单元25设置在位于最内侧抛光区域41内的每个表面板18的中心部分。

8. 发明专利

JP2014110411A Semiconductor wafer manufacturing method 有权
标题翻译：半导体制造方法
公开(公告)号：JP2014110411A
公开(公告)日：2014-06-12
申请号：JP2012265687
申请日：2012-12-04
申请人： Fujikoshi Mach Corp , 不二越機械工業株式会社 , National Institute Of Advanced Industrial & Technology , 独立行政法人産業技術総合研究所
发明人： NAKAMURA YOSHIO , ICHIKAWA TAIZO , SUMIZAWA HARUO , HARA SHIRO , KUMPUAN SOMAWANG , IKEDA SHINICHI
IPC分类号： H01L21/304 , B23K26/00 , B23K26/38
CPC分类号： H01L21/78 , H01L21/02005 , H01L21/02008
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor wafer manufacturing method which can easily form an orientation flat line and perform beveling without any difficulty.SOLUTION: A manufacturing method of a semiconductor wafer 12 according to the present embodiment is a manufacturing method of a semiconductor wafer of cutting a plurality of small-diameter wafers 12 from a large-diameter semiconductor wafer 10 and comprises: a marking process of collectively forming a straight groove-like orientation flat line 16 every row by laser beams in a manner such that cutting positions of the small-diameter wafers line in a particular direction and each orientation flat line 16 traverses the small-diameter wafers 12 in each row in the large-diameter semiconductor wafer 10; and a cutting process of individually cutting the small-diameter wafers 12 from the large-diameter semiconductor wafer 10 by the laser beams after the marking process.
摘要翻译：要解决的问题：提供一种可以容易地形成定向扁平线并且无任何困难地进行斜面的半导体晶片制造方法。解决方案：根据本实施例的半导体晶片12的制造方法是半导体晶片的制造方法从大直径半导体晶片10切割多个小直径晶片12，并且包括：通过激光束一行地一行地形成直槽状定向扁平线16的标记处理，以使得切割位置小直径晶片线在特定方向上行进，并且每个定向扁平线16横穿大直径半导体晶片10中的每行中的小直径晶片12; 以及在标记处理之后通过激光束从大直径半导体晶片10分别切割小直径晶片12的切割处理。

9. 发明专利

JP2008093810A Retainer ring, polishing head and polishing device 审中-公开
标题翻译：保持环，抛光头和抛光装置
公开(公告)号：JP2008093810A
公开(公告)日：2008-04-24
申请号：JP2006280990
申请日：2006-10-16
申请人： Fujikoshi Mach Corp , Shin Etsu Handotai Co Ltd , 不二越機械工業株式会社 , 信越半導体株式会社
发明人： MASUMURA HISASHI , MORITA KOJI , ARAKAWA SATORU , NAKAMURA YOSHIO
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304
摘要： PROBLEM TO BE SOLVED: To provide a retainer ring to hold an edge part of a workpiece and to pressurize an abrasive cloth in a circumference of the workpiece and capable of polishing the workpiece by maintaining surface flatness high at low cost, etc. SOLUTION: This retainer ring arranged in the circumference of a region to hold the workpiece of a polishing head to polish the workpiece by sliding a surface of the workpiece on the abrasive cloth adhered on a surface -plate by holding a back surface of the workpiece and to hold the edge part of the workpiece and to pressurize the abrasive cloth is constituted of a tenacious resin made resin ring arranged to surround the edge part of the workpiece and a ceramic ring arranged outside of the resin ring, one of the resin ring and the ceramic ring has a recessed part and the other has a protruded part, and the retainer ring is fixed as the recessed part and the protruded part are fitted on each other. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种保持环，用于保持工件的边缘部分并且对工件的圆周上的研磨布加压并且能够以低成本等保持高的表面平坦度来抛光工件。解决方案：该保持环布置在区域的圆周中，以保持抛光头的工件，以通过将粘附在表面板上的研磨布上的工件的表面滑动到工件的表面上，从而保持工件的后表面工件并保持工件的边缘部分并对研磨布加压，由设置成围绕工件的边缘部分的坚固的树脂树脂环和布置在树脂环外侧的陶瓷环构成，树脂之一环和陶瓷环具有凹部，另一方具有突出部，并且保持环固定为凹部，突出部彼此嵌合。版权所有（C）2008，JPO＆INPIT

10. 发明专利

JP2007160496A Workpiece polishing device, and workpiece polishing method 审中-公开
标题翻译：工件抛光装置和工件抛光方法
公开(公告)号：JP2007160496A
公开(公告)日：2007-06-28
申请号：JP2006280840
申请日：2006-10-16
申请人： Fujikoshi Mach Corp , Shinshu Univ , 不二越機械工業株式会社 , 国立大学法人信州大学
发明人： SATO UNKAI , ICHIKAWA KOICHIRO , NISHIMOTO YOSHINOBU , NAKAMURA YOSHIO , HASEGAWA TAKESHI , IIHAMA MASUMI
IPC分类号： B24B37/00 , B24B55/02 , B24B57/02 , H01L21/304
CPC分类号： C09G1/02 , B24B37/044 , B24B57/02 , Y02E60/366
摘要： PROBLEM TO BE SOLVED: To provide a workpiece polishing method using electrolytic reduction water, capable of reducing cost, carrying out polishing with favorable surface precision, and easily conducting disposal of waste fluid. SOLUTION: In the workpiece polishing method, a workpiece is pressed to a polishing member, and as the polishing fluid is supplied, the workpiece and the polishing member are relatively moved to each other, so that the workpiece is polished. For a polishing fluid, electrolytic reduction water obtained by conducting electrolysis to electrolyte salt solution is used for polishing the workpiece. COPYRIGHT: (C)2007,JPO&INPIT

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